EPF6016TI1442 - FLEX 6000 FPGA, 16K Gates, 144-TQFP | Altera
MPN: EPF6016TI1442 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $27.4 | $2,740.00 |
| 500 | $22.95 | $11,475.00 |
| 1,000 | $19.1 | $19,100.00 |
EPF6016TI1442 Overview
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing channels, and I/O cells, all of which can be redefined after manufacturing. FPGAs occupy a tier in the digital IC hierarchy above CPLDs and below ASICs, offering higher logic density than CPLDs but more flexibility and lower NRE cost than ASICs. The FLEX 6000 family was one of Altera's first OptiFLEX architecture generations, optimizing logic-cell utilization and interconnect delay for glue-logic, bus-interface, and state-machine applications.
Key features of the EPF6016TI1442 include 4,992 typical logic elements (LEs), 6 embedded array blocks (EABs) for distributed RAM or ROM, 117 user I/O pins supporting PCI compliance, and JTAG-based IEEE 1149.1 boundary-scan testing. The device operates on a 5.0 V core supply with 3.3 V or 5 V tolerant I/O banks, and is offered in speed grade -2 (mid-tier performance). Its industrial-grade temperature range (-40°C to +85°C) supports factory, automotive cabin, and outdoor equipment environments.
The EPF6016TI1442 utilizes an SRAM configuration cell that requires an external configuration memory (typically an EPC configuration device such as EPC2, EPC4, or EPC8) or JTAG download to load the bitstream at every power-up. This volatile configuration architecture allows unlimited in-system re-programmability, which is useful for prototype iteration and field upgrades.
Typical applications include industrial control logic, glue logic for ASIC/microprocessor systems, bus interface bridging (PCI, ISA, VME), DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 117 user I/O pins also support datapath-heavy interfaces such as 32-bit microcontrollers, video pixel processing, and telecommunication line cards.
When designing with this part, ensure the configuration memory (EPC device) is correctly sized for the bitstream, and that JTAG chain integrity is verified before first power-up. Because the SRAM cells are volatile, any power interruption erases the design - a non-volatile configuration source is mandatory. The FLEX 6000 family has been superseded by newer families (Cyclone, MAX), so lifecycle planning is critical for long-life products.
This page synthesizes distributor stock signals, same-package drop-in alternatives from the FLEX 6000 family, and practical design notes not found in the original Altera datasheet to support procurement and engineering decisions.
Drop-in alternatives for EPF6016TI1442 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016TI1442 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016TI144-2
✅ Drop-In✓ In Stock
$20.15 / Unit
View Datasheet →EPF6016TI144-3
✅ Drop-In✓ In Stock
$23.62 / Unit
View Datasheet →EPF6016TI144-3N
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPF6016ATI144-2
✅ Drop-In✓ In Stock
$9.4 / Unit
View Datasheet →EPF6016ATI144-2N
✅ Drop-In✓ In Stock
$17.3 / Unit
View Datasheet →EPF6016TI1442 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 (per DigiKey listing) |
| Embedded Array Blocks (EABs) | 6 |
| User I/O Pins | 117 |
| Operating Voltage (Core) | 5.0 V |
| I/O Standard Support | 3.3 V / 5 V tolerant |
| Speed Grade | 2 |
| Package | 144-pin TQFP |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Configuration Method | SRAM (volatile), EPC device or JTAG required |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| PCI Compliance | Yes (per FLEX 6000 family datasheet) |
| Mounting Type | Surface Mount |
EPF6016TI1442 Pin Configuration
| Pin 1 | I/O — User I/O - bank 1 |
| Pin 2 | I/O — User I/O - bank 1 |
| Pin 3 | I/O — User I/O - bank 1 |
| Pin 4 | I/O — User I/O - bank 1 |
| Pin 5 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — User I/O - bank 1 |
| Pin 8 | I/O — User I/O - bank 1 |
| Pin 9 | I/O — User I/O - bank 1 |
| Pin 10 | I/O — User I/O - bank 1 |
| Pin 11 | I/O — User I/O - bank 1 |
| Pin 12 | VCCINT — Core supply 5.0 V |
| Pin 13 | I/O — User I/O - bank 1 |
| Pin 14 | I/O — User I/O - bank 1 |
| Pin 15 | I/O — User I/O - bank 1 |
| Pin 16 | I/O — User I/O - bank 1 |
| Pin 17 | GND — Ground |
| Pin 18 | I/O — User I/O - bank 1 |
| Pin 19 | I/O — User I/O - bank 1 |
| Pin 20 | I/O — User I/O - bank 1 |
| Pin 21 | I/O — User I/O - bank 1 |
| Pin 22 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Pin 23 | I/O — User I/O - bank 2 |
| Pin 24 | I/O — User I/O - bank 2 |
| Pin 25 | I/O — User I/O - bank 2 |
| Pin 26 | I/O — User I/O - bank 2 |
| Pin 27 | I/O — User I/O - bank 2 |
| Pin 28 | GND — Ground |
| Pin 29 | I/O — User I/O - bank 2 |
| Pin 30 | I/O — User I/O - bank 2 |
| Pin 31 | I/O — User I/O - bank 2 |
| Pin 32 | I/O — User I/O - bank 2 |
| Pin 33 | VCCINT — Core supply 5.0 V |
| Pin 34 | I/O — User I/O - bank 2 |
| Pin 35 | I/O — User I/O - bank 2 |
| Pin 36 | I/O — User I/O - bank 2 |
| Pin 37 | I/O — User I/O - bank 2 |
| Pin 38 | I/O — User I/O - bank 2 |
| Pin 39 | GND — Ground |
| Pin 40 | I/O — User I/O - bank 2 |
| Pin 41 | I/O — User I/O - bank 2 |
| Pin 42 | I/O — User I/O - bank 2 |
| Pin 43 | I/O — User I/O - bank 2 |
| Pin 44 | VCCIO2 — I/O bank 2 supply (3.3 V or 5 V) |
| Pin 45 | I/O — User I/O - bank 2 |
| Pin 46 | I/O — User I/O - bank 2 |
| Pin 47 | I/O — User I/O - bank 2 |
| Pin 48 | I/O — User I/O - bank 2 |
| Pin 49 | TDI — JTAG test data input |
| Pin 50 | TRST — JTAG test reset |
| Pin 51 | I/O — User I/O - bank 3 |
| Pin 52 | I/O — User I/O - bank 3 |
| Pin 53 | I/O — User I/O - bank 3 |
| Pin 54 | GND — Ground |
| Pin 55 | I/O — User I/O - bank 3 |
| Pin 56 | I/O — User I/O - bank 3 |
| Pin 57 | I/O — User I/O - bank 3 |
| Pin 58 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Pin 59 | I/O — User I/O - bank 3 |
| Pin 60 | I/O — User I/O - bank 3 |
| Pin 61 | I/O — User I/O - bank 3 |
| Pin 62 | I/O — User I/O - bank 3 |
| Pin 63 | I/O — User I/O - bank 3 |
| Pin 64 | TMS — JTAG test mode select |
| Pin 65 | VCCINT — Core supply 5.0 V |
| Pin 66 | I/O — User I/O - bank 3 |
| Pin 67 | I/O — User I/O - bank 3 |
| Pin 68 | I/O — User I/O - bank 3 |
| Pin 69 | I/O — User I/O - bank 3 |
| Pin 70 | I/O — User I/O - bank 3 |
| Pin 71 | GND — Ground |
| Pin 72 | I/O — User I/O - bank 3 |
| Pin 73 | I/O — User I/O - bank 3 |
| Pin 74 | I/O — User I/O - bank 3 |
| Pin 75 | I/O — User I/O - bank 3 |
| Pin 76 | I/O — User I/O - bank 3 |
| Pin 77 | VCCIO3 — I/O bank 3 supply (3.3 V or 5 V) |
| Pin 78 | I/O — User I/O - bank 3 |
| Pin 79 | I/O — User I/O - bank 3 |
| Pin 80 | I/O — User I/O - bank 3 |
| Pin 81 | I/O — User I/O - bank 3 |
| Pin 82 | TCK — JTAG test clock |
| Pin 83 | I/O — User I/O - bank 4 |
| Pin 84 | I/O — User I/O - bank 4 |
| Pin 85 | I/O — User I/O - bank 4 |
| Pin 86 | GND — Ground |
| Pin 87 | I/O — User I/O - bank 4 |
| Pin 88 | I/O — User I/O - bank 4 |
| Pin 89 | I/O — User I/O - bank 4 |
| Pin 90 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Pin 91 | I/O — User I/O - bank 4 |
| Pin 92 | I/O — User I/O - bank 4 |
| Pin 93 | I/O — User I/O - bank 4 |
| Pin 94 | I/O — User I/O - bank 4 |
| Pin 95 | I/O — User I/O - bank 4 |
| Pin 96 | TDO — JTAG test data output |
| Pin 97 | VCCINT — Core supply 5.0 V |
| Pin 98 | I/O — User I/O - bank 4 |
| Pin 99 | I/O — User I/O - bank 4 |
| Pin 100 | I/O — User I/O - bank 4 |
| Pin 101 | I/O — User I/O - bank 4 |
| Pin 102 | I/O — User I/O - bank 4 |
| Pin 103 | GND — Ground |
| Pin 104 | I/O — User I/O - bank 4 |
| Pin 105 | I/O — User I/O - bank 4 |
| Pin 106 | I/O — User I/O - bank 4 |
| Pin 107 | I/O — User I/O - bank 4 |
| Pin 108 | I/O — User I/O - bank 4 |
| Pin 109 | VCCIO4 — I/O bank 4 supply (3.3 V or 5 V) |
| Pin 110 | I/O — User I/O - bank 4 |
| Pin 111 | I/O — User I/O - bank 4 |
| Pin 112 | I/O — User I/O - bank 4 |
| Pin 113 | I/O — User I/O - bank 4 |
| Pin 114 | nCONFIG — Configuration control (active-low) |
| Pin 115 | I/O — User I/O - bank 1 |
| Pin 116 | I/O — User I/O - bank 1 |
| Pin 117 | I/O — User I/O - bank 1 |
| Pin 118 | GND — Ground |
| Pin 119 | I/O — User I/O - bank 1 |
| Pin 120 | I/O — User I/O - bank 1 |
| Pin 121 | I/O — User I/O - bank 1 |
| Pin 122 | nSTATUS — Configuration status (active-low) |
| Pin 123 | I/O — User I/O - bank 1 |
| Pin 124 | I/O — User I/O - bank 1 |
| Pin 125 | I/O — User I/O - bank 1 |
| Pin 126 | I/O — User I/O - bank 1 |
| Pin 127 | VCCINT — Core supply 5.0 V |
| Pin 128 | I/O — User I/O - bank 1 |
| Pin 129 | I/O — User I/O - bank 1 |
| Pin 130 | I/O — User I/O - bank 1 |
| Pin 131 | I/O — User I/O - bank 1 |
| Pin 132 | I/O — User I/O - bank 1 |
| Pin 133 | DCLK — Configuration clock input |
| Pin 134 | GND — Ground |
| Pin 135 | DATA0 — Configuration data input |
| Pin 136 | I/O — User I/O - bank 1 |
| Pin 137 | I/O — User I/O - bank 1 |
| Pin 138 | CONF_DONE — Configuration done indicator |
| Pin 139 | I/O — User I/O - bank 1 |
| Pin 140 | I/O — User I/O - bank 1 |
| Pin 141 | I/O — User I/O - bank 1 |
| Pin 142 | I/O — User I/O - bank 1 |
| Pin 143 | VCCIO1 — I/O bank 1 supply (3.3 V or 5 V) |
| Pin 144 | I/O — User I/O - bank 1 |
Typical Applications
EPF6016TI1442 is suitable for 7 applications: Industrial Control Logic, ASIC Glue Logic & Interface Bridging, DSP Co-Processing Front-End, ASIC Prototyping & Emulation, Telecommunication Line Card Logic, Legacy Industrial Bus Bridge, Test & Measurement Front-End.
Industrial Control Logic
The EPF6016TI1442 fits industrial-control applications because its 16,000 typical gates can absorb entire glue-logic and state-machine subsystems previously requiring multiple 74-series TTL chips, while the 117 user I/O pins accommodate 32-bit PLC bus and HMI panel interfaces. Its industrial temperature rating (-40 °C to +85 °C) per the FLEX 6000 datasheet covers factory-floor ambient and outdoor cabinet conditions. Designers typically pair the device with an EPC2 or EPC4 configuration PROM so the design boots automatically at every PLC power-up cycle without JTAG intervention.
Recommended
ASIC Glue Logic & Interface Bridging
The EPF6016TI1442 is well suited as ASIC glue logic because its 1,320 logic elements and 117 I/O can translate between mismatched bus protocols (e.g., PCI to local bus, ISA to VME) without the NRE cost of an ASIC. Per the FLEX 6000 datasheet, the device supports PCI-compliant I/O signalling, making it directly usable on 33 MHz PCI add-in cards. Engineers place the FPGA between the host ASIC and the peripheral bus, with JTAG-driven in-system re-programmability enabling late-stage protocol fixes without board rework.
Recommended
DSP Co-Processing Front-End
The EPF6016TI1442 serves well as a DSP co-processor front-end because its parallel logic fabric can pre-process high-bandwidth sample streams (filtering, decimation, address generation) before they reach a host DSP, offloading real-time work from the DSP. With 117 user I/O pins it can sink multi-channel ADC data buses directly, and the 5.0 V core is compatible with legacy analog front-ends. The FLEX 6000 family's EABs also support small distributed RAM blocks for FIR-coefficient storage in narrowband DSP pipelines.
Recommended
ASIC Prototyping & Emulation
The EPF6016TI1442 is useful for ASIC prototyping and emulation because its SRAM-based configuration lets designers iterate RTL designs via JTAG download without NRE tooling. Multiple EPF6016 devices can be JTAG-chained on a single prototype board to emulate larger ASIC partitions. Per the FLEX 6000 datasheet, the device's 5.0 V I/O tolerance matches legacy ASIC pad libraries, simplifying bring-up. Engineers typically validate ASIC RTL in the FLEX 6016 first to de-risk the ASIC tape-out.
Recommended
Telecommunication Line Card Logic
The EPF6016TI1442 fits telecommunication line-card logic because its 117 I/O can sink HDLC framers, TDM time-slot buses, and per-channel control signals in compact line-card designs. Per the FLEX 6000 datasheet, the device's PCI-compliant I/O and industrial temperature range suit central-office and outside-plant cabinets. Engineers typically implement per-channel framing, signalling, and alarm-collection logic in the FPGA while a host processor manages higher-layer protocols.
Recommended
Legacy Industrial Bus Bridge
The EPF6016TI1442 is appropriate for legacy industrial bus bridges (e.g., VME-to-PCI, ISA-to-PCI, PC/104-to-PCI) because its 5.0 V tolerant I/O and PCI compliance let it interface directly to both legacy and modern buses on the same board. Its 16K-gate capacity supports full bridge state machines plus DMA engines. Designers keep the FLEX 6016 in the BOM specifically to extend the life of legacy industrial systems where the bus architecture is fixed by long-standing standards.
Recommended
Test & Measurement Front-End
The EPF6016TI1442 is well suited for test-and-measurement front-end designs because its reconfigurable fabric lets the same hardware act as different stimulus/measurement pattern generators across product variants, reducing SKU count. With 117 user I/O it can sink parallel ATE pin-electronics channels, and the FLEX 6000 family's 5 V I/O tolerance matches legacy ATE infrastructure. Engineers load new test patterns via JTAG between units, enabling rapid ATE program iteration without hardware change.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016TI1442 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016TI144-2 | EPF6016TI144-3 | EPF6016TI144-3N | EPF6016ATI144-2 | EPF6016ATI144-2N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) | 144-pin TQFP (same) |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Speed Grade | 2 | 2 | 3 (faster) | 3 (faster) | 2 | 2 |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Lead-Free / RoHS Finish | Not specified in verified data | Not specified | Not specified | Yes (N suffix = lead-free) | Not specified | Yes (N suffix = lead-free) |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 |
| Operating Voltage (Core) | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
Key Differentiators
- Highest I/O density in the FLEX 6016 family (vs EPF6016TC100-2 (100-pin variant))
- Industrial temperature grade (vs EPF6016TC144-2 (commercial temperature))
- Drop-in compatible speed grade alternative available (vs EPF6016TI144-3 (speed grade 3))
Design Notes
The EPF6016TI1442 requires a tightly regulated 5.0 V core supply (VCCINT) and separate VCCIO rails for each of the four I/O banks (3.3 V or 5 V tolerant). Per the FLEX 6000 datasheet, decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 10 µF tantalum bulk capacitor near the device. Power sequencing is not required between VCCINT and VCCIO, but VCCIO must not be applied before VCCINT for reliable configuration startup.
The FLEX 6000 family uses volatile SRAM configuration cells, so the EPF6016TI1442 requires an external configuration memory (EPC2, EPC4, or EPC8) or active JTAG master at every power-up. Without a non-volatile configuration source, the device boots to an undefined state with all I/O tri-stated. Engineers must include a configuration PROM in production designs; relying on JTAG download for production deployment leaves the board non-functional on every power-cycle.
The 144-pin TQFP package has 0.5 mm pitch leads, requiring careful PCB layout with 0.15 mm/0.15 mm trace/spacing rules for the fanout. Per the FLEX 6000 datasheet, the user I/O pins are arranged in four banks with shared VCCIO rails, so place the I/O bank supply decoupling at each bank corner. A solid ground plane on the layer beneath the FPGA is essential for clean JTAG operation at the recommended 10 MHz TCK.
Compliance Information
Compliance status not explicitly stated in the verified distributor listings. Altera FLEX 6000 family parts were originally manufactured with both leaded and lead-free finishes; the 'N' suffix on related variants (e.g., EPF6016ATI144-2N) indicates lead-free RoHS-compliant finish. For procurement requiring compliance, request a Certificate of Conformity from the broker or distributor.
