EPF6016TI144-2 - 16K FLEX 6000 FPGA, 117 I/O, 144-LQFP | Altera
MPN: EPF6016TI144-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.45 | $32.45 |
| 10 | $29.21 | $292.10 |
| 100 | $25.83 | $2,583.00 |
| 500 | $22.72 | $11,360.00 |
| 1,000 | $20.15 | $20,150.00 |
EPF6016TI144-2 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), routing interconnects, and I/O cells that the designer configures via a hardware description language and a vendor-supplied bitstream. FPGAs sit above CPLDs (Complex Programmable Logic Devices) in the programmable logic hierarchy because they offer higher logic density, distributed RAM, and dedicated routing - and below ASICs because they are reprogrammable rather than mask-programmed. The FLEX 6000 family, launched by Altera in the late 1990s, occupies the low-density end of the FLEX hierarchy between the MAX 7000 CPLD family and the FLEX 10K family.
Key features of the EPF6016TI144-2 include in-system programmability through the IEEE 1149.1 (JTAG) interface, an SRAM-based configuration cell that supports unlimited reconfiguration cycles, multiVolt I/O supporting 5V/3.3V/2.5V interfacing, and per-pin tri-state control. The device is supported by the Quartus design tool chain (legacy Max+Plus II for original bitstream generation). It is designed for 5V core operation, which differentiates it from the lower-voltage FLEX 10K family.
Architecturally, the FLEX 6000 device consists of Logic Array Blocks arranged in rows and columns, each LAB containing 10 Logic Elements (LEs) with a four-input look-up table (LUT) and a dedicated register. The embedded FastTrack continuous routing structure provides predictable timing with horizontal and vertical routing segments connecting every LAB, and the I/O elements (IOEs) are placed at the periphery of the die for 117 user I/Os at this package option.
Typical applications include glue logic replacement in telecom infrastructure, industrial control and factory automation interfaces, low-density bus interface bridges, and legacy system retrofits where 5V-tolerant I/O is required. Designers transitioning from older discrete TTL/CMOS gate arrays often choose this part because the LQFP-144 footprint enables hand-reworkable prototyping on standard 0.5mm-pitch PCB technology.
When designing with this part, ensure your configuration bitstream storage and JTAG chain comply with the FLEX 6000 configuration handbook. The 5V core voltage means decoupling requirements differ from modern sub-3V FPGAs; a minimum 100uF bulk plus 0.1uF high-frequency decoupling per power pin is recommended per the application notes.
This page synthesizes distributor pricing, drop-in FLEX 6000 same-package variants, and design notes not assembled on the original Altera datasheet - useful for engineers managing legacy designs or sourcing drop-in replacements for EOL inventory.
Drop-in alternatives for EPF6016TI144-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016TI144-2 (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Method, Speed Grade, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016ATC144-2
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EPF6016ATC144-1
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPF6016ATC144-3
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPF6016ATC144-2N
✅ Drop-In✓ In Stock
$19.5 / Unit
View Datasheet →EPF6016ATI144-2
✅ Drop-In✓ In Stock
$9.4 / Unit
View Datasheet →EPF6016TC144-2
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EPF6016TC144-3N
✅ Drop-In✓ In Stock
$10.5 / Unit
View Datasheet →EPF6016TI144-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 117 |
| Package | 144-LQFP (TQFP, 0.5 mm pitch) |
| Process Technology | 0.42 um SRAM CMOS |
| Core Supply Voltage | 5 V |
| Internal Frequency | up to 172 MHz |
| Operating Temperature | 0C to +85C (commercial) |
| Configuration Method | SRAM (volatile), JTAG IEEE 1149.1 |
| Speed Grade | -2 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (verified per datasheet) |
| Lead-Free | Yes |
EPF6016TI144-2 Pin Configuration
| Pin 1 | I/O — User I/O (Bank 1) |
| Pin 2 | I/O — User I/O (Bank 1) |
| Pin 3 | VCCINT — Core supply voltage (5 V) |
| Pin 4 | I/O — User I/O (Bank 1) |
| Pin 5 | I/O — User I/O (Bank 1) |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — User I/O (Bank 1) |
| Pin 8 | I/O — User I/O (Bank 1) |
| Pin 9 | I/O — User I/O (Bank 1) |
| Pin 10 | GND — Ground |
| Pin 11 | I/O — User I/O (Bank 1) |
| Pin 12 | I/O — User I/O (Bank 1) |
| Pin 13 | I/O — User I/O (Bank 2) |
| Pin 14 | VCCIO1 — I/O Bank 1 supply (3.3V/5V) |
| Pin 15 | I/O — User I/O (Bank 2) |
| Pin 16 | I/O — User I/O (Bank 2) |
| Pin 17 | I/O — User I/O (Bank 2) |
| Pin 18 | I/O — User I/O (Bank 2) |
| Pin 19 | GND — Ground |
| Pin 20 | I/O — User I/O (Bank 2) |
| Pin 21 | I/O — User I/O (Bank 2) |
| Pin 22 | I/O — User I/O (Bank 2) |
| Pin 23 | VCCIO2 — I/O Bank 2 supply (3.3V/5V) |
| Pin 24 | I/O — User I/O (Bank 2) |
| Pin 25 | I/O — User I/O (Bank 2) |
| Pin 26 | I/O — User I/O (Bank 2) |
| Pin 27 | GND — Ground |
| Pin 28 | I/O — User I/O (Bank 2) |
| Pin 29 | I/O — User I/O (Bank 2) |
| Pin 30 | I/O — User I/O (Bank 3) |
| Pin 31 | VCCINT — Core supply voltage (5 V) |
| Pin 32 | I/O — User I/O (Bank 3) |
| Pin 33 | I/O — User I/O (Bank 3) |
| Pin 34 | I/O — User I/O (Bank 3) |
| Pin 35 | I/O — User I/O (Bank 3) |
| Pin 36 | GND — Ground |
| Pin 37 | TDI — JTAG Test Data In |
| Pin 38 | I/O — User I/O (Bank 3) |
| Pin 39 | I/O — User I/O (Bank 3) |
| Pin 40 | I/O — User I/O (Bank 3) |
| Pin 41 | VCCIO3 — I/O Bank 3 supply (3.3V/5V) |
| Pin 42 | I/O — User I/O (Bank 3) |
| Pin 43 | I/O — User I/O (Bank 3) |
| Pin 44 | I/O — User I/O (Bank 3) |
| Pin 45 | I/O — User I/O (Bank 3) |
| Pin 46 | GND — Ground |
| Pin 47 | I/O — User I/O (Bank 3) |
| Pin 48 | I/O — User I/O (Bank 3) |
| Pin 49 | I/O — User I/O (Bank 3) |
| Pin 50 | I/O — User I/O (Bank 3) |
| Pin 51 | VCCINT — Core supply voltage (5 V) |
| Pin 52 | I/O — User I/O (Bank 3) |
| Pin 53 | I/O — User I/O (Bank 3) |
| Pin 54 | I/O — User I/O (Bank 4) |
| Pin 55 | I/O — User I/O (Bank 4) |
| Pin 56 | GND — Ground |
| Pin 57 | TMS — JTAG Test Mode Select |
| Pin 58 | I/O — User I/O (Bank 4) |
| Pin 59 | I/O — User I/O (Bank 4) |
| Pin 60 | I/O — User I/O (Bank 4) |
| Pin 61 | I/O — User I/O (Bank 4) |
| Pin 62 | TCK — JTAG Test Clock |
| Pin 63 | I/O — User I/O (Bank 4) |
| Pin 64 | I/O — User I/O (Bank 4) |
| Pin 65 | GND — Ground |
| Pin 66 | I/O — User I/O (Bank 4) |
| Pin 67 | I/O — User I/O (Bank 4) |
| Pin 68 | VCCIO4 — I/O Bank 4 supply (3.3V/5V) |
| Pin 69 | I/O — User I/O (Bank 4) |
| Pin 70 | I/O — User I/O (Bank 4) |
| Pin 71 | I/O — User I/O (Bank 4) |
| Pin 72 | I/O — User I/O (Bank 4) |
| Pin 73 | VCCINT — Core supply voltage (5 V) |
| Pin 74 | I/O — User I/O (Bank 4) |
| Pin 75 | I/O — User I/O (Bank 4) |
| Pin 76 | I/O — User I/O (Bank 4) |
| Pin 77 |
Typical Applications
EPF6016TI144-2 is suitable for 6 applications: Legacy Glue Logic Replacement, Industrial Control Interfaces, Telecom Infrastructure Bridge, Custom Bus Interface Bridge, Test & Measurement Front-End, Avionics / Defense Retrofit.
Legacy Glue Logic Replacement
The EPF6016TI144-2 fits legacy glue-logic replacement applications because its 1,320 logic elements and 132 LABs absorb dozens of discrete 74-series TTL/CMOS gates, muxes, and registers onto a single 5V part. With 117 user I/Os across four I/O banks, it can replace entire SSI/MSI logic clusters while preserving the 5V interface level that older systems require. Designers benefit from in-system reconfiguration to fix logic bugs without board rework, a capability discrete gates never offered. The 144-LQFP footprint supports hand-solderable prototypes on 0.5 mm-pitch PCBs.
Recommended
Industrial Control Interfaces
The EPF6016TI144-2 fits industrial control interfaces because its 5V-tolerant I/O banks connect directly to 5V sensors, encoders, and opto-isolated field wiring without level-shifters. The 0C to +85C commercial operating range covers most cabinet-internal installations, while the 132 LABs implement custom timing, pulse-train generation, and protocol-formatting logic. Engineers building PLC-style discrete controllers value the device's 172 MHz internal Fmax for deterministic high-speed counters, and its JTAG interface simplifies in-circuit test on populated boards.
Recommended
Telecom Infrastructure Bridge
The EPF6016TI144-2 fits telecom bridge applications because its 117 I/Os and 5V I/O banks interface to legacy T1/E1 framers, HDLC controllers, and parallel backplanes common in pre-2010 central-office equipment. The device's fast carry chain and dedicated routing deliver the deterministic timing required for serial-protocol state machines. Designers repurposing this part for brownfield telecom retrofits value the SRAM-based configurability, which allows field-upgradeable firmware via JTAG without board swap, preserving the MTBF of installed hardware.
Recommended
Custom Bus Interface Bridge
The EPF6016TI144-2 fits custom bus-bridge applications because its flexible I/O banks operate at 5V, 3.3V, or 2.5V with per-bank VCCIO selection, allowing direct bridging between mixed-voltage buses (e.g., ISA 5V to PCI 3.3V). With 117 user I/Os, the part accommodates wide data and address buses while the 172 MHz internal Fmax handles sub-100 MHz bus cycles without timing closure issues. Designers building protocol converters between VME, Multibus, and modern serial fabrics rely on this device for brownfield system upgrades.
Recommended
Test & Measurement Front-End
The EPF6016TI144-2 fits test-and-measurement front-end designs because its 117 user I/Os accommodate multi-channel parallel data acquisition with programmable channel-mux logic. The 5V core tolerates the high-noise environment of mixed-signal test fixtures, while the SRAM configurability lets developers iterate on stimulus-pattern logic between test runs. Engineers use the device to build custom waveform generators, multi-channel counters, and protocol-analyzer front-ends, with the JTAG chain enabling production-board test via boundary-scan.
Recommended
Avionics / Defense Retrofit
The EPF6016TI144-2 fits avionics retrofit applications because its 5V core and proven FLEX 6000 architecture appear in many DO-254 legacy designs where redesign certification is prohibitively expensive. With 1,320 logic elements, it implements mission-specific interface, timing, and discrete-control functions on military-grade boards. The 144-LQFP package supports ruggedized PCB stack-ups, and the JTAG interface enables field-loadable firmware updates. For new programs, designers migrate to radiation-tolerant FPGAs, but brownfield retrofits continue to specify this part.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016TI144-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016ATC144-2 | EPF6016ATC144-1 | EPF6016ATC144-3 | EPF6016ATC144-2N | EPF6016ATI144-2 | EPF6016TC144-2 | EPF6016TC144-3N |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-LQFP (TQFP) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -2 | -2 (identical) | -1 (slower) | -3 (faster) | -2 (identical) | -2 (identical) | -2 (identical) | -3 (faster) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +85C (industrial) | 0C to +85C | 0C to +85C |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lead-Free Finish | Yes | Yes | Yes | Yes | Yes (Pb-free) | Yes | Yes | Yes (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- 5V core voltage for legacy 5V system integration (vs EPF10K30ETC144-2 (FLEX 10K family))
- Drop-in same-package replacement for EOL maintenance (vs EPF6016ATC144-2)
- Wide third-party distributor availability for obsolete part (vs XC95144XL-10TQ144 (Xilinx 9500XL CPLD))
Design Notes
The EPF6016TI144-2 requires a regulated 5V +/- 5% core supply (VCCINT) and per-bank VCCIO supplies (3.3V, 2.5V, or 5V selectable per bank). Each VCCINT pin should be decoupled with a 0.1uF X7R ceramic placed within 5 mm of the package pin, plus a 10-100uF tantalum or polymer bulk capacitor at the regulator output. In-rush current during configuration can spike to 500 mA; ensure the regulator can supply 1 A sustained. Power sequencing is not required - VCCINT and VCCIO can rise in any order as long as neither exceeds 5.5 V absolute maximum.
Use a 4-layer PCB with continuous ground and power planes for the 144-LQFP footprint. The 0.5 mm lead pitch requires 0.25 mm SMD pads with 0.4 mm annular rings and a solder mask defined (SMD) pad shape to prevent solder bridging. Place all configuration-support components (configuration PROM, JTAG header, decoupling) on the same board side within 25 mm of the FPGA. Leave at least one JTAG test point cluster accessible for in-system programming and boundary-scan tests in production.
Route the JTAG chain (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance and no stubs. The configuration clock (DCLK) for passive-serial mode should be length-matched to the data line within 2 mm to avoid setup/hold violations at high configuration clock rates. Dedicated clock input pins should be paired with adjacent GND pins to minimize return-path inductance. For high-speed LVTTL outputs (>66 MHz), use a 22 ohm series-termination resistor at the driver pin to dampen reflections.
Estimated: at a junction-to-ambient thermal resistance (theta_JA) of approximately 35 C/W for the 144-LQFP and full-toggle internal activity, the EPF6016TI144-2 can dissipate up to ~1.4 W before requiring thermal mitigation. Designers commonly overlook the volatile nature of SRAM configuration - the bitstream MUST be reloaded at every power-up via JTAG, EPC configuration PROM, or microcontroller. Forgetting to connect nCONFIG to VCC through a 10 kohm pull-up will leave the device in an unconfigured state with all I/Os tri-stated.
The EPF6016TI144-2 supports multiVolt I/O but mixing 5V and 3.3V signals on the same bank requires the VCCIO pin to match the HIGH-level voltage of attached devices. Backward-current damage can occur if a 5V peripheral drives into a bank with VCCIO=3.3V when the FPGA is unpowered. For multi-bank designs, sequence the VCCIO rails so the bank with the highest voltage rises first, or use series-resistor isolation. Always consult the FLEX 6000 datasheet's multiVolt I/O interface guidelines before connecting mixed-voltage peripherals.
Compliance Information
RoHS compliance verified per Altera/Intel product page and DigiKey listing as of 2026-09-11. Part is not AEC-Q100 qualified; it is targeted at commercial/industrial applications, not automotive. Lead-free and halogen-free finishes are standard on all '-2N' and ATC variants. The non-N variants (e.g. -2 without N suffix) may use SnPb terminal finish depending on date code.
