EPF6024AQC240-2S - FLEX 6000 FPGA 24K Gates 240-PQFP | Altera
MPN: EPF6024AQC240-2S ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $26.1 | $13,050.00 |
| 1,000 | $22.95 | $22,950.00 |
EPF6024AQC240-2S Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines the density of a gate array with the in-system reprogrammability of an SRAM-based lookup table. Within the wider semiconductor taxonomy, an FPGA sits between low-density CPLDs and mask-programmed ASIC gate arrays; FPGAs are typically chosen when NRE cost is too high for an ASIC but density or performance exceeds what a CPLD can deliver. The FLEX 6000 family was Altera's low-cost, high-volume alternative to traditional gate-array designs.
Key features of the EPF6024AQC240-2S include 199 user I/O pins (one of the largest user-I/O counts in the FLEX 6000 family), four embedded logic array blocks implementing 24 logic elements each, SRAM-based configuration cells that allow in-system re-programming via JTAG, and built-in PCI compliance support. MultiVolt I/O allows interface to 5.0 V, 3.3 V, and 2.5 V buses without external level shifters, while in-system programmability (ISP) via the IEEE 1149.1 boundary-scan interface reduces manufacturing test cost and enables field firmware updates. The PQFP-240 package exposes the maximum I/O available in the family.
Architecturally, the OptiFLEX structure routes signals through continuous horizontal and vertical pass-transistor lines that connect every LAB to every other LAB; this shortens typical interconnect delays and removes the segmented routing hierarchy used in competing families. Configuration data is stored in SRAM cells and is loaded from an external serial PROM or via JTAG on power-up, after which the device operates deterministically until the next reconfiguration. The device is fabricated on a 0.42 µm four-layer-metal CMOS process.
Typical applications include telecommunications line cards, industrial control and glue logic, PCI bus bridges, peripheral controllers, low-to-medium density DSP co-processors, and legacy retrofits for systems originally designed around mask-programmed gate arrays. The 240-pin PQFP with 199 user I/Os is a strong fit when a board needs to fan out to many parallel buses or memory interfaces. Industrial, telecom, and embedded computing segments continue to use FLEX 6000 devices for cost-sensitive, mature-platform designs.
When designing with this part, verify PCI compliance timing margins if used in 33 MHz PCI applications, allow sufficient inrush current headroom on the 3.3 V rail for configuration, and pair it with an EPC configuration PROM for standalone power-up. The PQFP-240 footprint requires careful thermal management at high toggle rates, since the plastic package has limited heat dissipation compared to the BGA options available in later FLEX families.
This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the FLEX 6000 family, and practical design notes not consolidated in any single source.
Drop-in alternatives for EPF6024AQC240-2S — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC240-2S (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Configuration Method, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC240-2
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPF6024AQC240-2N
✅ Drop-In✓ In Stock
$26.1 / Unit
View Datasheet →EPF6024AQC240-1
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF6024AQC240-1N
✅ Drop-In✓ In Stock
$54 / Unit
View Datasheet →EPF6024AQC240-2S Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements / Cells | 1960 |
| Typical Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 199 |
| Number of Logic Cells / Registers | 199 |
| Maximum Operating Frequency | 166.67 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage | 3.3 V |
| Configuration Method | SRAM (JTAG or serial PROM) |
| Speed Grade | -2 |
| Package | 240-pin PQFP (BFQFP) |
| Operating Temperature | Commercial (0 °C to +70 °C) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| MultiVolt I/O | Yes (5.0 V / 3.3 V / 2.5 V) |
EPF6024AQC240-2S 240-pin pqfp (bfqfp) Pin Configuration Guide
Pin configuration for EPF6024AQC240-2S (240-pin pqfp (bfqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC240-2S.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC240-2S is suitable for 6 applications: PCI 33 MHz Bus Bridge, Telecommunications Glue Logic, Industrial Control and Factory Automation, Legacy Gate-Array Retrofit, Peripheral Controller / Embedded Bridge, Test and Measurement Equipment Backplane.
PCI 33 MHz Bus Bridge
The EPF6024AQC240-2S is well suited to PCI 33 MHz bridge applications because it provides 199 user I/Os at 166.67 MHz, comfortably exceeding the 33 MHz PCI clock budget. According to the FLEX 6000 datasheet, MultiVolt I/O enables direct connection to 5.0 V and 3.3 V PCI slots without external level shifters. Placed between a host CPU bus and a downstream peripheral, the device absorbs address decode, byte-enable logic, and interrupt steering. The 240-pin PQFP footprint fans out to all 32-bit PCI address/data plus side-band signals. Bitstream is loaded from a serial EPC2 PROM at power-up, so the bridge is fully autonomous after VCC stabilizes.
Recommended
Telecommunications Glue Logic
In telecom line cards and backplane interface designs, the EPF6024AQC240-2S acts as a high-density glue-logic replacement for discrete 74-series and PAL devices. The 1,960 logic elements and 196 LABs are enough to absorb bus multiplexing, framing, clock-domain crossing, and alarm-steering logic that would otherwise consume dozens of discrete packages. With 166.67 MHz maximum clock and PCI-compliant I/O, it bridges legacy backplanes to newer processors. The PQFP-240 package and SRAM configuration simplify board bring-up because design changes can be re-flashed via JTAG without re-spinning the PCB.
Recommended
Industrial Control and Factory Automation
Factory-automation controllers benefit from the EPF6024AQC240-2S because the 199 user I/Os handle many parallel sensor and actuator lines from a single device, replacing racks of discrete logic. The OptiFLEX architecture provides predictable interconnect delays, which simplifies timing closure for deterministic control loops such as servo position control. SRAM-based configuration allows field firmware updates over JTAG, which is valuable for installed machinery. The PQFP-240 package is mechanically robust and well suited to industrial temperature ranges when paired with commercial-grade parts.
Recommended
Legacy Gate-Array Retrofit
The FLEX 6000 family was explicitly designed as a low-cost alternative to mask-programmed gate arrays, and the EPF6024AQC240-2S is a common retrofit for systems that have reached ASIC end-of-life. Engineers can port gate-array netlists into Altera Quartus using the FLEX 6000 device library, achieving functional parity without paying NRE. The SRAM-based configuration supports rapid design iteration, and the 166.67 MHz performance envelope matches typical gate-array speeds. MultiVolt I/O enables replacement of mixed-voltage ASIC designs on the same board.
Recommended
Peripheral Controller / Embedded Bridge
Embedded peripheral controllers often use the EPF6024AQC240-2S as a master glue-logic device between a microcontroller or DSP and external memory buses, LCD panels, or custom peripherals. With 1,960 logic elements and 199 I/Os, it implements address decoders, wait-state generators, and DMA engines that offload these tasks from the host processor. The 0.42 µm process and 3.3 V core keep power consumption manageable in portable or fan-less embedded enclosures. JTAG-based ISP allows firmware revision updates without board removal.
Recommended
Test and Measurement Equipment Backplane
Test instruments such as protocol analyzers, logic-analyzer front-ends, and ATE load boards use the EPF6024AQC240-2S as a pattern generator or bus-format converter. The 166.67 MHz internal clock and PCI compliance let the device handle multi-megasample-per-second data steering without external FIFOs. The 199 I/Os accommodate wide parallel test buses, and SRAM configuration supports last-minute pattern changes in production test. The PQFP-240 footprint provides enough I/O for boundary-scan and JTAG-controlled test points across the entire backplane.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC240-2S — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC240-2 | EPF6024AQC240-2N | EPF6024AQC240-1 | EPF6024AQC240-1N | EPF6016AQC208-3 |
|---|---|---|---|---|---|---|
| Package | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 208-pin PQFP |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 | 1960 | 1320 |
| User I/Os | 199 | 199 | 199 | 199 | 199 | 171 |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -1 (slower) | -3 (faster) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Largest I/O count in the FLEX 6000 family (vs EPF6016AQC208-3)
- Faster -2 speed grade vs slower -1 alternatives (vs EPF6024AQC240-1)
- OptiFLEX architecture with continuous routing (vs Generic CPLD alternatives)
Design Notes
The EPF6024AQC240-2S requires a clean 3.3 V core supply capable of delivering inrush current during SRAM configuration (often 200-500 mA peaks for the duration of the bitstream load). Decouple with a 100 µF bulk tantalum plus 0.1 µF and 0.01 µF ceramics on each VCCINT pin. Place the EPC2 boot PROM close to the FPGA so configuration traces are short; long CONFIG traces can cause bitstream errors on noisy boards.
The PQFP-240 plastic package has a thermal resistance of approximately 25-35 °C/W junction-to-ambient depending on PCB copper area, which limits sustained toggle rates. At high internal utilization (>80 %) and 166.67 MHz, consider adding a copper heatsink pad or airflow. For industrial deployments, derate junction temperature to 100 °C maximum rather than 125 °C to extend life. Always validate with a thermal probe in the actual enclosure.
Do not assume the 'S' suffix in EPF6024AQC240-2S indicates a temperature grade or screening level - it is typically a reel-packaging or lead-finish code, not an electrical difference. Check the actual datasheet suffix definitions before substituting. Also note that FLEX 6000 configuration bitstreams are NOT compatible with Cyclone devices; recompile required. Always generate the programming file from the target device's Quartus library.
Compliance Information
Compliance status not stated in the Verified Web Data. The 'N' suffix variant EPF6024AQC240-2N typically denotes lead-free / Pb-free finish per Altera legacy ordering information. RoHS, REACH, halogen-free, and conflict-minerals data should be requested from the distributor or checked on the Intel/Altera legacy product page before use in RoHS-restricted designs.
