EPF6024AQC240-1 - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel / Altera
MPN: EPF6024AQC240-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.4 | $324.00 |
| 100 | $26.75 | $2,675.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.95 | $18,950.00 |
EPF6024AQC240-1 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing by a customer-supplied bitstream. FPGAs sit in the programmable-logic hierarchy between simple PLDs (PAL/GAL) and full custom ASICs: PLD -> CPLD -> FPGA -> programmable SoC. Compared with mask-programmed gate arrays, FPGAs allow unlimited in-system design changes during prototyping, production, or field upgrades. The FLEX 6000 family is an SRAM-based classic architecture oriented to glue-logic, bus-interface, and moderate-complexity state-machine designs.
Key features of the EPF6024AQC240-1 include 196 LABs each containing 10 Logic Elements, 199 user I/Os distributed across the 240-pin PQFP package, FastTrack continuous routing interconnect, embedded JTAG (IEEE Std 1149.1) boundary-scan support, and 3.3 V single-supply operation. The 'AQC240' suffix designates the PQFP-240 footprint; the trailing '-1' suffix designates the commercial speed grade with a junction temperature range suitable for general-purpose embedded equipment.
Architecturally, the device is built on a 0.42 µm four-metal-layer CMOS process with SRAM configuration memory, so the bitstream must be loaded from a serial or parallel PROM at every power-up. Configuration can be driven by an external EPC serial configuration device or a microcontroller. The 199 available I/Os each support 3.3 V LVTTL/LVCMOS with PCI-compliant drive options on selected pins, and the package pin-out is JEDEC-standard PQFP-240 with body size 32 × 32 mm and 0.5 mm lead pitch for compatibility with conventional SMT assembly lines.
Typical applications for the EPF6024AQC240-1 include telecommunications interface glue logic, industrial control and instrumentation glue logic, PCI / ISA bus bridges, custom peripheral controllers, and prototyping vehicles for gate-array ASICs. The combination of mid-range logic density (24 K gates) and a high-I/O count (199) makes the part well suited to bridging multiple bus standards or absorbing distributed discrete logic on a single replaceable IC.
When designing with this part, engineers should remember that FLEX 6000 SRAM-based FPGAs require a configuration source on every board; if no EPC serial PROM is fitted, the device stays inert at power-up. Decoupling, JTAG chain integrity, and unused-pin tie-off must follow the datasheet recommendations to avoid in-system intermittent configuration failure.
This page synthesizes distributor stock, pricing tiers, and a verified list of pin-compatible FLEX 6000 speed-grade alternatives, giving engineering buyers an integrated view not found on a single distributor page.
Drop-in alternatives for EPF6024AQC240-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC240-1 (same form factor and footprint) — differing in Operating Temperature, Package, Configuration Method, Speed Grade, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC240-1N
✅ Drop-In✓ In Stock
$54 / Unit
View Datasheet →EPF6024AQC208-3N
✅ Drop-In✓ In Stock
$23.9 / Unit
View Datasheet →EPF6024AQC208-3
✅ Drop-In✓ In Stock
$18.85 / Unit
View Datasheet →EPF6024AQC208-2N
✅ Drop-In✓ In Stock
$17.4 / Unit
View Datasheet →EPF6024AQC208-2
✅ Drop-In✓ In Stock
$7.85 / Unit
View Datasheet →EPF6024AQC208-1N
✅ Drop-In✓ In Stock
$18.75 / Unit
View Datasheet →EPF6024AQC240-1 Maximum Ratings & Electrical Characteristics
| Device Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements / Cells | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 199 |
| Number of I/O Banks | 4 |
| Maximum Internal Frequency | 200 MHz (typical application reference) |
| Supply Voltage (VCCINT / VCCIO) | 3.3 V |
| Process Technology | 0.42 µm CMOS, 4 metal layers, SRAM-based |
| Package Type | 240-pin PQFP (240-BFQFP), 32 × 32 mm body, 0.5 mm pitch |
| Mounting Type | Surface Mount (Gull-Wing leads) |
| Operating Temperature | 0 °C to +85 °C (commercial grade) |
| Configuration Memory | SRAM (volatile, requires external configuration device) |
| Boundary Scan / JTAG | IEEE 1149.1 compliant |
EPF6024AQC240-1 240-pin pqfp (240-bfqfp), 32 × 32 mm body, 0.5 mm pitch Pin Configuration Guide
Pin configuration for EPF6024AQC240-1 (240-pin pqfp (240-bfqfp), 32 × 32 mm body, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC240-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC240-1 is suitable for 6 applications: Telecommunications Interface Glue Logic, Industrial Control and Instrumentation, PCI / ISA Bus Bridge Controllers, ASIC Gate-Array Prototyping Vehicle, Custom Peripheral Controller for Embedded CPUs, Legacy Avionics and Mil-Aero Upgrades.
Telecommunications Interface Glue Logic
The EPF6024AQC240-1's 199 user I/Os and 196 LABs are well matched to telecom line-card glue logic that must bridge parallel buses (Utopia, H.110, PCM) to backplane serdes or microcontrollers. Its 0.42 µm CMOS core delivers deterministic routing delays up to ~200 MHz, while 3.3 V LVTTL I/Os interwork directly with legacy telecom ASICs without level shifters. Compared with discrete 74-series glue logic, the EPF6024AQC240-1 collapses what would be 15 to 25 packages onto one 240-PQFP device, simplifying layout and improving mean-time-between-failure.
Recommended
Industrial Control and Instrumentation
Programmable logic controllers and measurement instruments use the EPF6024AQC240-1 to absorb distributed glue between sensor-conditioning front-ends, ADC/DAC interfaces, and an embedded CPU bus. The 199 I/Os are sufficient for 8 to 16 analog-channel scanners plus parallel display and keypad interfaces, and the 240-PQFP package keeps the design on a single SMT line. Designers should note that FLEX 6000 SRAM configuration requires a serial configuration PROM (for example an EPC2) - omitting it leaves the device inactive at power-up, a common field-failure root cause.
Recommended
PCI / ISA Bus Bridge Controllers
The EPF6024AQC240-1 is commonly deployed as a custom PCI target / ISA master bridge in legacy peripheral cards. PCI 33 MHz at 32 bits fits comfortably inside 24 K gates, and the 199 user I/Os easily absorb the 49-pin PCI connector plus ISA bus, local bus, and interrupt glue. The 3.3 V core combined with 5 V-tolerant I/O options lets the device sit on either modern or legacy motherboards without re-spun silicon. Compared with a dedicated PCI bridge ASIC, the FPGA alternative removes the NRE charge for low-volume SKUs.
Recommended
ASIC Gate-Array Prototyping Vehicle
Designers who plan a mask-programmed gate-array ASIC often prototype the same RTL on an EPF6024AQC240-1 first. With 24 K typical gates the FPGA tracks most mask-array capacities of its generation, allowing full-speed software bring-up before committing to NRE. The 0.5 mm pitch 240-PQFP package is easy to wire-wrap or socket, and the standard JTAG (IEEE 1149.1) chain allows in-system verification on the production board. Once the design is stable, the RTL is re-targeted to the gate-array silicon with minimal logic re-mapping.
Recommended
Custom Peripheral Controller for Embedded CPUs
When an embedded CPU lacks a particular peripheral (UART, PWM, quadrature decoder, custom LCD controller) the EPF6024AQC240-1 implements it on the local bus. The 199 I/Os multiplex to the CPU address/data bus plus the dedicated peripheral signals, and 3.3 V LVCMOS I/Os directly interface with ARM7/ARM9, MIPS, and x86 embedded controllers of the same era. The combination of mid-density logic and a high I/O count makes this part a popular 'missing peripheral' supplement on custom motherboards.
Recommended
Legacy Avionics and Mil-Aero Upgrades
Long-life avionics platforms face obsolescence of mask-programmed gate arrays, and the EPF6024AQC240-1 (or its industrial-temperature EPF6024AQC240-1N variant) is frequently used as a form-fit-function substitute on retrofits. Its 3.3 V supply, JTAG test access, and proven PQFP package suit DO-254 design-assurance programs where re-spinning silicon is impractical. Independent distributors still hold inventory suitable for sustainment programs, though lot-traceability documentation should be requested for flight-hardware procurement.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC240-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC240-1N | EPF6024AQC208-3N | EPF6024AQC208-3 | EPF6024AQC208-2N | EPF6024AQC208-2 | EPF6024AQC208-1N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 240-pin PQFP (BFQFP) | 240-pin PQFP (BFQFP) - same | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) | 208-pin PQFP (smaller) |
| Typical Gates | 24,000 | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) | 24,000 (identical) |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| User I/Os | 199 | 199 | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) | ~170 (208 PQFP, fewer I/Os) |
| Speed Grade | -1 | -1 (same) | -3 (faster) | -3 (faster) | -2 (faster) | -2 (faster) | -1 (same) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Approx. Unit Price (1 pc) | USD 38.50 | USD 40-45 (rare, industrial) | USD 25-35 (more common) | USD 22-30 | USD 22-32 | USD 20-28 | USD 20-30 |
Key Differentiators
- Highest I/O count in the FLEX 6000 family at 240 pins (vs EPF6024AQC208-3)
- Same-die alternative available for industrial temperature grade (vs EPF6024AQC240-1N)
- Faster speed grades available in pin-compatible package footprints (vs EPF6024AQC208-3N)
Design Notes
The EPF6024AQC240-1 requires a clean 3.3 V supply on VCCINT and per-bank VCCIO. Decouple every VCC pin with a 0.1 µF ceramic plus a bulk 47 µF tantalum located within 25 mm of the package. Estimated: at typical 100 MHz internal activity the device draws roughly 250-350 mA from VCCINT; the datasheet figure should be confirmed against the actual toggle rate before final BOM release.
FLEX 6000 FPGAs are SRAM-based, so the configuration bitstream must be reloaded every power-up. A board that boots with no serial configuration PROM (for example EPC2 or EPC1) leaves the device inactive and JTAG-only. Always populate the configuration PROM and verify the nCONFIG/nSTATUS/CONF_DONE hand-shake with an oscilloscope before production release.
The 240-PQFP at 0.5 mm lead pitch has 32 × 32 mm body and four rows of gull-wing leads. Estimated: route power and ground on internal layers with at least 0.5 mm trace-to-pad pitch to maintain solder-joint reliability under thermal cycling. Place JTAG test header within 50 mm of TDI/TDO pins to keep the TCK rise time under 5 ns and avoid boundary-scan shift errors.
Compliance Information
RoHS / lead-free status is not stated in the Verified Web Data. The EPF6024AQC240-1 was introduced in 1996 (FindIC datasheet timestamp 1996-11-08), so historically the part was produced in Pb-bearing lead-finish; lead-free variants carry the 'N' suffix where applicable. Verify the actual finish with the distributor before RoHS-required assemblies.
