EPF6024AQC240-1N - FLEX 6000 FPGA, 24K Gates, 240-PQFP | Intel
MPN: EPF6024AQC240-1N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $109.27 | $109.27 |
| 10 | $95 | $950.00 |
| 100 | $78 | $7,800.00 |
| 500 | $65 | $32,500.00 |
| 1,000 | $54 | $54,000.00 |
EPF6024AQC240-1N Overview
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Within the broader programmable-logic hierarchy, FPGAs sit above Simple Programmable Logic Devices (SPLDs) and Complex PLDs (CPLDs), offering higher logic density, distributed SRAM, and rich I/O resources. The FLEX 6000 family belongs to Altera's classic SRAM-based FPGA portfolio and is positioned as a low-cost, high-volume alternative to mask-programmed gate arrays for designs in the 8K-24K gate range. The same family also includes faster and slower speed grades (AQC240-2, AQC240-3) plus industrial temperature variants (e.g., AFI256, ABI256).
Key features of the EPF6024AQC240-1N include 196 LABs each containing ten Logic Elements (LEs), four embedded Logic Array Blocks (EABs) for on-chip RAM/ROM, multiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfaces, in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and built-in clock-lock circuits. The 240-pin PQFP provides 199 usable I/Os with 218 user I/Os claimed in some distributor entries, leaving the remaining pins for supply, ground, JTAG, and configuration functions. The 0.42 µm CMOS process combined with 3.3 V core gives a favorable power profile versus competing 5 V CPLD families.
Architecturally, FLEX 6000 devices use a continuous, hierarchical interconnect structure called the FastTrack Interconnect, which provides predictable timing across the die regardless of place-and-route choices. Each LE contains a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains. The four EABs each provide 2,048 bits of memory (configurable as RAM, ROM, or FIFO), enabling on-chip data buffering without external SRAM.
Typical applications include glue-logic integration in legacy 5 V and 3.3 V systems, telecommunications backplane controllers, industrial control and instrumentation, peripheral bus bridges (PCI to local bus), digital signal processing pre-processing, and high-volume consumer products that demand mask-array-like unit cost with FPGA-like time-to-market. The wide I/O voltage range also makes it suitable for mixed-voltage bus interfaces where 5 V and 3.3 V devices must coexist.
When designing with this part, observe the 3.3 V core supply tolerance and ensure JTAG chain termination is correct for in-system programming. The PQFP package is a through-hole-friendly surface-mount part, so designers should allocate land pattern per JEDEC MO-112 for the 240-pin variant. Estimated: for a 100 MHz internal clock the typical core current is 30-50 mA, and each LVTTL output draws 4-6 mA DC, so total supply design should budget at least 250 mA of 3.3 V with decoupling distributed every 5 LABs.
This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the original datasheet, including explicit selection guidance between FLEX 6000 speed grades and package variants.
Drop-in alternatives for EPF6024AQC240-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC240-1N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC240-1
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF6024AQC240-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$23.1 / Unit
View Datasheet →EPF6024AQC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$19.8 / Unit
View Datasheet →EPF6016QC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$22.71 / Unit
View Datasheet →EPF6016QC240-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.9 / Unit
View Datasheet →EPF6024AQC240-1N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gates | 24,000 |
| Logic Cells | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 199 |
| Embedded Array Blocks (EABs) | 4 (2,048 bits each) |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Standards Supported | 5.0 V, 3.3 V, 2.5 V (multiVolt I/O) |
| Internal Operating Frequency | 200 MHz |
| Package | 240-pin PQFP (BFQFP) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Programming Interface | JTAG (IEEE 1149.1) / ByteBlaster |
| Configuration | SRAM-based, in-system reconfigurable |
| RoHS Status | Non-Compliant (contains lead, per FindIC compare) |
| Lead-Free Status | Contains Lead |
EPF6024AQC240-1N 240-pin pqfp (bfqfp) Pin Configuration Guide
Pin configuration for EPF6024AQC240-1N (240-pin pqfp (bfqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC240-1N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC240-1N is suitable for 6 applications: Glue-Logic Integration in Mixed-Voltage Systems, Industrial Control and Instrumentation, Telecommunications Backplane Controllers, Peripheral Bus Bridges (PCI / ISA / VME), Digital Signal Processing Pre-Processing, High-Volume Consumer Products (Legacy Designs).
Glue-Logic Integration in Mixed-Voltage Systems
The EPF6024AQC240-1N's 24K-gate capacity, 199 user I/Os, and multiVolt I/O support for 5.0 V, 3.3 V, and 2.5 V interfaces make it an ideal bridge between legacy 5 V peripherals and modern 3.3 V processors on a single board. Designers can use the device to consolidate discrete 74-series glue logic, address decoders, and bus-arbitration state machines into a single programmable part, reducing PCB area and BOM cost. Its 196 LABs and four EABs each provide 2,048 bits of memory, enabling small FIFO buffers for inter-IC handshaking without external SRAM. Unlike a fixed-function CPLD, the FPGA allows late-stage design changes and in-field firmware updates via JTAG.
Recommended
Industrial Control and Instrumentation
Industrial control platforms benefit from the EPF6024AQC240-1N's commercial 0 to +85 °C operating range, 3.3 V core efficiency, and abundant 199 I/Os for sensor aggregation, actuator control, and HMI interfaces. The 200 MHz internal Fmax allows deterministic state-machine implementation for PID loops and motor-control timing blocks, while the four EABs provide on-chip RAM for parameter tables and waveform lookup tables. The 240-pin PQFP is hand-solderable for low-volume industrial OEM builds, avoiding the X-ray inspection required for BGAs. In retrofit designs, the part can be drop-in swapped with EPF6024AQC240-2 or -3 to gain timing margin without PCB changes.
Recommended
Telecommunications Backplane Controllers
In legacy telecom backplanes, the EPF6024AQC240-1N is well suited as a low-cost backplane controller that fans out address and control signals across multiple line cards. The 24K-gate capacity is sufficient to implement H.110 / MVIP / SCSA bus arbitration, and the 199 user I/Os comfortably drive 8-bit wide data buses plus parity, framing, and clock-enable signals. The 3.3 V core with multiVolt I/O is compatible with both 3.3 V LVCMOS and 5 V TTL line-card logic. Its SRAM-based configuration supports hot-swap-friendly fast reprogramming via JTAG when field upgrades are required, and the 0.42 µm process delivers mature, well-characterized timing closure.
Recommended
Peripheral Bus Bridges (PCI / ISA / VME)
The EPF6024AQC240-1N is widely used as a peripheral bus bridge in PCI-to-local-bus and ISA-to-PCI designs where 24K gates, 199 I/Os, and SRAM-based configurability provide the right mix of capacity, I/O count, and time-to-market. Its EABs can be configured as FIFOs for DMA buffering, and the FastTrack interconnect gives predictable PCI 33 MHz timing closure at the -2 and -3 speed grades. The 3.3 V core reduces in-rush current on hot-plug slots relative to 5 V CPLD bridges, and the JTAG port supports in-system bitstream updates during board bring-up. Designers targeting newer PCIe should consider migrating to Cyclone III/IV, but for legacy 32-bit PCI the EPF6024AQC240-1N remains a strong choice.
Recommended
Digital Signal Processing Pre-Processing
For pre-processing of sensor or audio data streams, the EPF6024AQC240-1N's 200 MHz internal Fmax and four 2,048-bit EABs support simple FIR filters, gain stages, and decimators feeding an external DSP or DAC. Each EAB can be configured as 256×8, 512×4, 1024×2, or 2048×1 memory, allowing efficient storage of filter coefficients and sample-delay lines. The 24K-gate capacity is enough for a multi-channel mixer with per-channel mute/volume control. While it lacks dedicated multiplier blocks, designers can implement small MAC operations using LEs and carry chains, and the multiVolt I/O interfaces directly to 5 V codec ADCs/DACs without level shifters.
Recommended
High-Volume Consumer Products (Legacy Designs)
The EPF6024AQC240-1N was a workhorse for high-volume consumer products such as set-top boxes, DVD players, and digital cameras in the late 1990s and early 2000s. Its low unit cost at 24K-gate density and PQFP packaging enabled simple, hand-rework-friendly assembly lines without BGA X-ray inspection. Today, surviving production lines for legacy SKUs continue to consume residual stock, especially in industrial, military, and medical refresh programs where re-validation cost outweighs the silicon savings of a new FPGA. The lead-finish N suffix indicates the original SnPb finish, which is preferred for some military and aerospace programs that still require lead-based soldering per legacy specifications.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC240-1N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC240-1 | EPF6024AQC240-2 | EPF6024AQC240-3 | EPF6016QC240-3 | EPF6016QC240-2 |
|---|---|---|---|---|---|---|
| Package | 240-pin PQFP (QC240) | 240-pin PQFP (QC240) - same | 240-pin PQFP (QC240) - same | 240-pin PQFP (QC240) - same | 240-pin PQFP (QC240) - same | 240-pin PQFP (QC240) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 | 16,000 |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 | 1,320 |
| User I/Os | 199 | 199 | 199 | 199 | 147 | 147 |
| Speed Grade | -1 (slowest) | -1 | -2 (faster) | -3 (fastest) | -3 (fastest) | -2 (mid) |
| Core Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
Key Differentiators
- Highest gate count in the 240-pin PQFP FLEX 6000 family (vs EPF6016QC240-3)
- Three pin-compatible speed grades allow in-field timing margin upgrade (vs EPF6024AQC240-3)
- Same-die drop-in for legacy designs without re-validation cost (vs EPF6024AQC240-1)
Design Notes
Estimated: at 200 MHz internal Fmax with 199 I/Os toggling at 50 MHz LVTTL into 50 pF loads, the 3.3 V core draws roughly 30-50 mA and each output adds 4-6 mA DC plus dynamic switching current. The 240-pin PQFP has a junction-to-ambient thermal resistance of approximately 35 °C/W, so a fully-loaded design with 80% I/O toggling at 50 MHz can dissipate 1.5-2 W, yielding a 50-70 °C junction temperature rise above ambient. Provide at least four 0.1 µF decoupling capacitors placed within 5 mm of every fifth PQFP power pin, and add a 10 µF bulk tantalum near the center of the package.
The 240-pin PQFP requires a JEDEC MO-112 land pattern with 0.5 mm lead pitch and a 30 × 30 mm package body. Keep all signal traces on the top layer under 25 mm to avoid reflections on LVTTL outputs, and route JTAG TCK/TMS/TDO/TDI signals as a daisy chain with 10 kΩ pull-ups on TCK/TMS to prevent false configuration during power-up. Estimated: 0.1 µF bypass capacitors should be placed every 5 LAB rows to maintain stable VCCINT and VCCIO; the FastTrack interconnect is timing-predictable only when VCC ripple is kept below 50 mV peak-to-peak.
Pin 1 on the 240-pin PQFP is identified by the molded dot on the package top and a beveled edge on pin 1 side; orient the package with pin 1 at the top-left when reading the silkscreen. The EPF6024AQC240-1N pinout is identical to all other EPF6024AQC240-XXX variants in the same package, so PCB designers can mix speed grades and lead-finish variants on a single board layout. Always lock the configuration-mode MSEL pins to the desired mode (AS, AP, PS, JTAG) and do not float them, or the device may enter an undefined configuration state at power-up.
Common pitfalls when migrating to the EPF6024AQC240-1N from a larger FPGA include (1) underestimating EAB-based memory bandwidth - each EAB provides 2,048 bits but the read clock is shared with the LAB logic, (2) confusing the 'N' suffix with an industrial temperature grade - the N denotes lead-finish, not temperature, and the part is still 0 to +85 °C commercial, and (3) attempting to use Quartus support files from a Cyclone device - the FLEX 6000 requires MAX+PLUS II or Quartus legacy FLEX device support, which is no longer packaged in current Quartus releases.
Compliance Information
Per FindIC comparison page, the EPF6024AQC240-1N is RoHS non-compliant due to SnPb lead finish. Lead-free status: contains lead. The part is commercial temperature grade (0 to +85 °C) and is not AEC-Q100 qualified; industrial temperature FLEX 6000 parts use the 'I' suffix (e.g., EPF6024AFI256-2, EPF6024ABI256-2) and are not drop-in compatible due to different packages.
