EPF6024AQC240-2N - 24K Gates FLEX 6000 FPGA, 240-PQFP | Intel
MPN: EPF6024AQC240-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.95 | $3,395.00 |
| 500 | $29.4 | $14,700.00 |
| 1,000 | $26.1 | $26,100.00 |
EPF6024AQC240-2N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs or LABs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM, allowing rapid design iteration. The FLEX 6000 family sits within Intel/Altera's broader programmable logic hierarchy as a low-cost, 3.3 V alternative to higher-density FLEX 10K and APEX families, ideal for high-volume gate-array replacement and prototyping.
Key features of the EPF6024AQC240-2N include a 199-pin user I/O count (one of the highest pin counts in the FLEX 6000 line), 1,960 logic cells distributed across 196 LABs, embedded SRAM-based configuration, JTAG-based boundary-scan test support, and operation across 0 °C to 85 °C commercial temperature range. The 240-pin PQFP package offers reliable through-hole-style surface-mount assembly on standard PCB footprints.
Architecturally, the device pairs each LAB with an Embedded Array Block (EAB) for implementing RAM, ROM, or multiplier functions, and uses a continuous FastTrack interconnect routing fabric. MultiVolt I/O pins accept 3.3 V and 5 V signaling for mixed-voltage system integration, while the 0.42 µm CMOS process delivers a favorable cost-per-gate for volume production.
Typical applications include telecommunications line cards, industrial control glue logic, legacy peripheral bridges, prototyping platforms, and cost-sensitive replacement of fixed-logic gate arrays. Designers migrating from discrete TTL or low-density PLDs benefit from 1,960 logic cells and 199 I/Os in a single device.
When designing with this part, note that configuration bitstream must be loaded from external ROM at every power-up due to SRAM-based architecture, and unused I/Os should be tri-stated to minimize switching current.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and selection decisions.
Drop-in alternatives for EPF6024AQC240-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQC240-2N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQC240-2
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPF6024AQC240-1
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF6024AQC240-1N
✅ Drop-In✓ In Stock
$54 / Unit
View Datasheet →EPF6016QC240-3
✅ Drop-In✓ In Stock
$22.71 / Unit
View Datasheet →EPF6016QC240-2
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EPF6024AQC240-2N Maximum Ratings & Electrical Characteristics
| Device Type | FPGA (Field Programmable Gate Array) |
| Series | FLEX 6000 |
| Logic Cells | 1960 |
| Logic Array Blocks (LABs) | 196 |
| Gates | 24,000 |
| Maximum User I/Os | 199 |
| Internal Frequency (max) | 166.67 MHz |
| Process Technology | 0.42 µm CMOS |
| Supply Voltage | 3.3 V |
| Package Type | 240-pin PQFP (BQFP) |
| Pin Count | 240 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C |
| Configuration Method | SRAM (volatile, external bitstream) |
| Speed Grade | -2 |
EPF6024AQC240-2N 240-pin pqfp (bqfp) Pin Configuration Guide
Pin configuration for EPF6024AQC240-2N (240-pin pqfp (bqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQC240-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQC240-2N is suitable for 6 applications: Telecommunications Line Card Glue Logic, Industrial Control Glue Logic Replacement, Legacy Peripheral Bridge and Bus Converter, ASIC Prototype and Design Validation, Cost-Sensitive Gate Array Replacement, Educational and Training FPGA Platform.
Telecommunications Line Card Glue Logic
The EPF6024AQC240-2N's 199 user I/O pins and 1,960 logic cells make it well-suited for telecommunications line cards where it bridges between backplane buses and framer/mapper ASICs. Its 166.67 MHz internal frequency handles STS-1/STM-0 datacom overhead processing, while the 240-PQFP package offers easy assembly on legacy line-card PCBs. Designers implement bus multiplexing, clock domain crossing, and parity/ECC logic that would otherwise require multiple discrete PLDs.
Recommended
Industrial Control Glue Logic Replacement
In industrial control systems migrating from discrete 74-series TTL, the EPF6024AQC240-2N consolidates dozens of glue-logic functions into a single reprogrammable device. Its 24,000 gates and 199 I/Os handle encoder interfacing, PWM generation, and safety-interlock logic on PLC backplanes. The 0 °C to 85 °C commercial temperature range suits indoor control cabinets, while JTAG boundary-scan simplifies production test. Compared to multiple PALs, it reduces board area and improves traceability.
Recommended
Legacy Peripheral Bridge and Bus Converter
The EPF6024AQC240-2N excels at bridging legacy peripherals (ISA, VME, SCSI) to modern processor buses where ASIC NRE is not justified. Its 1,960 logic cells implement bus arbiters, FIFO controllers, and protocol converters in a single chip. The 199 I/Os accommodate wide data buses plus control signals without external muxing. Designers targeting legacy system upgrades benefit from in-system reprogrammability via JTAG, enabling field firmware updates without board rework.
Recommended
ASIC Prototype and Design Validation
Before committing to ASIC mask costs, design teams use the EPF6024AQC240-2N to prototype and validate control logic, datapath interfaces, and timing assumptions. Its 24K-gate capacity closely matches typical mid-complexity ASICs, allowing real-system validation. The SRAM-based architecture enables rapid design iteration: change the bitstream, not the board. Once validated, the same HDL code migrates to an ASIC or to a Cyclone series FPGA with minimal code changes.
Recommended
Cost-Sensitive Gate Array Replacement
For mid-volume production runs (typically 1K-100K units), the EPF6024AQC240-2N replaces fixed-logic gate arrays where ASIC NRE of $100K-$500K cannot be amortized. Its 24K gates and 199 I/Os cover a broad class of consumer and industrial products. While unit cost is higher than an equivalent ASIC at high volume, total cost of ownership is lower when factoring in mask charges, inventory risk, and time-to-market. Once volume exceeds 500K units, ASIC migration becomes economical.
Recommended
Educational and Training FPGA Platform
The EPF6024AQC240-2N appears in university FPGA design courses as an affordable, well-documented platform for teaching HDL design, synthesis, and timing closure. Its 1,960 logic cells are large enough for meaningful designs (UARTs, simple CPUs) yet small enough to fit in classroom lab time. The 240-PQFP package is hand-solderable for student projects, and the FLEX 6000 design flow using Altera MAX+PLUS II or Quartus is well-supported by legacy educational materials and textbooks.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQC240-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQC240-2 | EPF6024AQC240-1 | EPF6024AQC240-1N | EPF6016QC240-3 | EPF6016QC240-2 |
|---|---|---|---|---|---|---|
| Package | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Gates | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 | 16,000 |
| Logic Cells | 1960 | 1960 | 1960 | 1960 | 1320 | 1320 |
| User I/Os | 199 | 199 | 199 | 199 | 171 | 171 |
| Speed Grade | -2 | -2 | -1 | -1 | -3 | -2 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration Method | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
Key Differentiators
- Higher logic density than EPF6016 family (vs EPF6016QC240-2)
- Faster speed grade than -1 variant (vs EPF6024AQC240-1N)
- More user I/Os than lower-density siblings (vs EPF6016QC240-3)
- Established design ecosystem with mature tool support (vs Generic CPLD alternatives)
Design Notes
The EPF6024AQC240-2N requires a stable 3.3 V core supply with ±5% tolerance. Decouple each VCC pin pair with a 0.1 µF ceramic capacitor placed within 5 mm of the pin. Add bulk capacitance (47-100 µF tantalum) at the board supply entry. During configuration, inrush current peaks at ~500 mA; ensure the regulator can sustain this transient. SRAM-based configuration means power must be monotonic during configuration, otherwise the device may latch into an undefined state requiring power-cycle.
The 240-pin PQFP has 0.5 mm pin pitch and gull-wing leads. Use a land pattern with at least 0.6 mm pad width and 1.5 mm pad length to ensure reliable solder fillets. Apply solder paste via stencil (0.15 mm thickness recommended). For prototypes, hand-soldering is feasible with a fine-tip iron and flux, but production assembly requires reflow. Keep signal traces on inner layers and use the top and bottom layers primarily for power and ground planes to minimize crosstalk on the high-pin-count package.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) with 50 Ω controlled impedance and keep traces under 50 mm to avoid signal integrity issues. Place the configuration memory (EPC2/EPC4) within 25 mm of the FLEX 6000 device to meet DATA0/DCLK setup time. Group dedicated clock inputs (CLK0-CLK3) and route them on inner layers with ground shielding. Unused I/O pins should be configured as outputs driving low or tri-stated to minimize switching current and ground bounce.
Do not assume hot-swap capability; the EPF6024AQC240-2N must be powered in a defined sequence. Do not leave CONF_DONE pin floating; it requires a 10 kΩ pull-up to VCC. Do not apply I/O signals before the device is configured, as this can cause latch-up via the I/O ESD structures. Always include a JTAG chain even if not used for production test, as it enables in-field firmware updates and recovery from corrupted configuration.
The FLEX 6000 output drivers have limited slew-rate control. For high-speed clocks (above 100 MHz), use the slow slew-rate option and add series damping resistors (22-33 Ω) near the driver. For multi-drop buses, add 33 Ω series termination at each FLEX 6000 output to dampen reflections. Avoid driving capacitive loads above 50 pF without a buffer; the 4 mA IOL/IOH drive strength is insufficient for heavily loaded nets.
Compliance Information
The 'N' suffix in EPF6024AQC240-2N historically indicates lead-free / RoHS compliance per Altera naming convention, but specific compliance certificates are not confirmed in the verified web data. RoHS, REACH, lead-free, halogen-free, and conflict-mineral statuses marked unknown pending datasheet or manufacturer letter verification.
