10AX115N4F45E3LG - Arria 10 GX FPGA 1150K LE 28nm FCBGA | Intel
MPN: 10AX115N4F45E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8250 | $82,500.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7450 | $3,725,000.00 |
| 1,000 | $7100 | $7,100,000.00 |
Drop-in alternatives for 10AX115N4F45E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115N4F45E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115N4F40I3SG
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$3500 / Unit
View Datasheet →10AX115N4F40I3LG
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View Datasheet →10AX115N4F40E3LG
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View Datasheet →10AX115N3F45E2LG
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View Datasheet →10AX115N2F45E2LG
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View Datasheet →10AX115N4F45E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory | 68,857,856 bits (8,532 Kbits per M20K block) |
| DSP Blocks | 3,376 (variable-precision, 18x19 multipliers) |
| Maximum User I/O Pins | 768 |
| Transceivers | Up to 96 channels at up to 17.4 Gbps |
| Hard Processor System | Dual ARM Cortex-A9 MPCore |
| Memory Interfaces | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) |
| PLLs | 24 |
| Process Technology | TSMC 20nm |
| Package | 1932-ball FCBGA (F45, 45x45 mm) |
| Operating Temperature | Extended (E) industrial grade per ordering code |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Voltage Rails | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent |
10AX115N4F45E3LG 1932-ball fcbga (f45, 45x45 mm) Pin Configuration Guide
Complete pinout information for 10AX115N4F45E3LG (1932-ball fcbga (f45, 45x45 mm) package) with 768 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N4F45E3LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 768 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N4F45E3LG is suitable for 7 applications: 40G/100G Ethernet Bridging and Aggregation, ASIC Prototyping and Emulation, Software-defined Radio and Baseband DSP, 8K Video Broadcast and Processing, PCIe Accelerator Cards and SmartNICs, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation.
40G/100G Ethernet Bridging and Aggregation
The 10AX115N4F45E3LG is well suited to multi-port 40G and 100G Ethernet aggregation, line-card bridging, and OTN/SONET framer designs. Its 96 transceiver channels operating up to 17.4 Gbps map cleanly to CAUI-4 (4x25 Gbps) and OTU4 (4x28 Gbps) configurations with spare channels for redundancy or inter-card links. The 1,150,000 LE fabric and 3,376 DSP blocks provide headroom for traffic classification, encryption (IPsec/MACsec) cores, and per-port statistics aggregation running in parallel. Designers typically use the hard PCIe Gen3 x8 IP for backplane-to-host CPU communication, leaving fabric resources for data-plane acceleration.
Recommended
ASIC Prototyping and Emulation
The 10AX115N4F45E3LG is widely deployed as an ASIC prototyping substrate because its 1,150,000 logic elements map to a meaningful fraction of mid-complexity 28nm-class ASIC netlists. Combined with the 1932-ball FCBGA, designers can partition a target ASIC into multiple FPGAs and route signals through high-speed transceivers for inter-chip nets. The dual ARM Cortex-A9 HPS optionally serves as a substitute for ARM subsystems in the ASIC under emulation, allowing firmware development to proceed in parallel with hardware bring-up. This shortens overall time-to-prototype by removing the need for a separate soft CPU in the fabric.
Recommended
Software-defined Radio and Baseband DSP
The 10AX115N4F45E3LG fits software-defined radio (SDR) baseband and military/aerospace DSP front-ends, where the 3,376 DSP blocks deliver approximately 1.5 TOPS of variable-precision arithmetic and the hard DDR4 controller streams samples in and out of the device without consuming fabric. The dual ARM Cortex-A9 MPCore runs the Linux control stack, RF control loops, and protocol state machines. Transceiver channels up to 17.4 Gbps handle raw ADC/DAC I/Q data plus gigabit Ethernet backhaul from a single FPGA. This combination eliminates a separate processor card in many tactical-radio designs.
Recommended
8K Video Broadcast and Processing
The 10AX115N4F45E3LG is a strong fit for 8K broadcast and live video processing where bandwidth exceeds the capacity of mid-range FPGAs. Up to 768 user I/Os let designers terminate multiple 12G-SDI inputs in parallel, and the hard PCIe Gen3 IP shuttles encoded streams to GPU co-processors or NVMe storage over the backplane. The large logic and DSP budgets handle real-time HEVC/H.265 transform, quantization, and deblocking at 8K/60p resolution. The 68.86 Mbits of embedded memory buffers line-reordering and motion-compensation intermediate frames without spilling to external DDR.
Recommended
PCIe Accelerator Cards and SmartNICs
The 10AX115N4F45E3LG enables high-throughput PCIe accelerator cards and SmartNIC designs because the hard PCIe Gen3 x8 IP eliminates fabric overhead for host-facing DMA. Designers allocate the remaining logic to packet-parsing, classification, and offload engines (RDMA, NVMe-oF, TLS, IPSec) running concurrently. The dual ARM Cortex-A9 HPS can host the control-plane Linux stack, offloading management from the host CPU. Up to 96 transceiver channels at 17.4 Gbps drive multiple QSFP28 ports for 25G/50G fabric connectivity in hyperscale datacenters.
Recommended
Industrial Imaging and Machine Vision
The 10AX115N4F45E3LG suits high-speed industrial inspection, X-ray and hyperspectral imaging, and machine vision pipelines operate at multi-gigabit pixel rates. The 3,376 DSP blocks accelerate convolutional and morphology filter kernels, while the 1,150,000 LE fabric hosts multiple parallel sensor pipelines. Up to 768 user I/Os accept CoaXPress, Camera Link HS, or sub-LVDS sensor data directly into the FPGA. The hard DDR4 controller streams processed frames to GPU co-processors, and the dual ARM cores orchestrate inspection control loops. This eliminates external preprocessing ASICs in many high-end AOI systems.
Recommended
Test and Measurement Instrumentation
The 10AX115N4F45E3LG fits high-end test and measurement instruments where deterministic latency and reconfigurable DSP are required. Its 96 transceiver channels drive multi-channel oscilloscope digitizers and protocol analyzers, while the variable-precision DSP engines handle real-time FFTs, pulse compression, and protocol decoding. The hard ARM subsystem runs Linux-based instrument control and display, eliminating a separate MCU. The large logic budget allows instrument vendors to consolidate multiple instrument functions into a single FPGA, reducing system BOM.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N4F45E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N4F45E3SG | 10AX115N4F40I3SG | 10AX115N3F45E2LG |
|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45, 45x45 mm) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F40, 40x40 mm) | 1932-ball FCBGA (F45) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| Transceiver Count | Up to 96 channels (N4 designation) | Up to 96 channels | Up to 96 channels | Up to 72 channels (N3 designation) |
| Max Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| DSP Blocks | 3,376 | 3,376 | 3,376 | 3,376 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Operating Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E2) |
| Solder Ball Finish | Lead-free (RoHS) | SnPb (tin-lead) | SnPb (tin-lead) | Lead-free (RoHS) |
Key Differentiators
- Maximum transceiver channel count in the Arria 10 GX family (vs 10AX115N3F45E2LG)
- Same F45 ballout preserves PCB layout across temperature grades (vs 10AX115N4F40I3SG)
- Lead-free RoHS-compliant solder balls (vs 10AX115N4F45E3SG)
Design Notes
The 1932-ball FCBGA at 1.0 mm pitch requires a 12+ layer PCB stack-up with microvia or stacked-via technology for breakout. Use laser-drilled vias for signal layers and 0.2 mm-pitch fan-out routing under the BGA. Per Intel Arria 10 PCB design guidelines, total BGA escape region length should not exceed 12 mm for a clean 4-row breakout. Maintain 100 ohm differential impedance on transceiver pairs and 50 ohm single-ended on general-purpose I/O.
Estimated: at typical transceiver utilization of 24 active lanes at 10 Gbps plus 70% logic utilization, the 10AX115N4F45E3LG dissipates approximately 30-40 W. Designers must specify a heatsink rated at 0.15-0.30 C/W thermal resistance or design a custom cold-plate. Per Intel device thermal guidance, junction-to-ambient thermal resistance for the F45 FCBGA is 2.1 C/W with a reference heatsink. Allow 200 LFM minimum airflow across the heat-spreader for sustained operation above 25 W.
The 10AX115N4F45E3LG requires 7+ power rails: core (0.9 V), transceiver analog (1.0/1.1 V), transceiver PLL (1.0 V), I/O bank-specific 1.2-3.0 V, HPS (1.0 V core, 1.8 V analog), and auxiliary rails. Use a dedicated per-rail sequencer to satisfy Intel's power-on sequencing specification; incorrect sequencing causes permanent device damage. Decoupling requirements per the datasheet include 200+ capacitors totaling over 800 uF near the device.
Transceiver channels must follow Intel's IBIS-AMI models for 17.4 Gbps operation. Channel insertion loss budget should not exceed 25 dB at 8.7 GHz Nyquist (per protocol dependent). Use a continuous reference plane beneath the transceiver lanes, stitch ground vias every 200 mils along the lane edges, and avoid stubs by selecting proper antipad geometries. Pre-emphasis and equalization coefficients must be tuned per the channel and verified through measurement.
Common pitfalls when designing with the 10AX115N4F45E3LG: (1) Selecting the wrong ordering-code suffix (N2 vs N3 vs N4) for the needed transceiver count, leaving board links inoperative; (2) Underestimating HPS clock and reset circuit complexity - reference designs must be followed closely; (3) Using signal-integrity models from earlier Arria families, which can produce invalid transceiver margins; (4) Omitting configuration storage (Qspi flash or SD/MMC) prevents reliable boot. Always validate bitstream on hardware before mass production.
Compliance Information
RoHS compliance confirmed per Altera/Intel product page. Not AEC-Q100 qualified - FPGAs typically are not graded against AEC-Q100. Halogen-free status not specified in distributor data - set as 'unknown' to comply with data authenticity rule.
