10AX115N4F45I3LG - Arria 10 GX FPGA, 1150K LE, 1932-FCBGA | Intel
MPN: 10AX115N4F45I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 5 | $8200 | $41,000.00 |
| 10 | $7950 | $79,500.00 |
| 25 | $7600 | $190,000.00 |
| 100 | $7100 | $710,000.00 |
Drop-in alternatives for 10AX115N4F45I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N4F45E3LG
✅ Drop-In✓ In Stock
$7100 / Unit
View Datasheet →10AX115N4F40I3LG
✅ Drop-In✓ In Stock
$2350 / Unit
View Datasheet →10AX115N3F45I2LG
✅ Drop-In✓ In Stock
$8050 / Unit
View Datasheet →10AX115N2F45I2LG
✅ Drop-In✓ In Stock
$8750 / Unit
View Datasheet →10AX090N4F45I3LG
✅ Drop-In✓ In Stock
$5202.97 / Unit
View Datasheet →10AX115N4F45I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Device | 10AX115 |
| Logic Elements | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 |
| User I/O Count | 768 |
| Process Technology | TSMC 20 nm |
| Package | 1932-BBGA, FCBGA |
| Package Family | F45 (45 mm) |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| Speed Grade | I3 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Terminal Form | Ball |
| Number of Terminals | 1932 |
| Package Code | BGA (FCBGA) |
10AX115N4F45I3LG bga (fcbga) Pin Configuration Guide
Complete pinout information for 10AX115N4F45I3LG (bga (fcbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N4F45I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N4F45I3LG is suitable for 7 applications: Broadcast Video Processing, Wireless Baseband & RF Signal Processing, High-Speed Data Acquisition, Radar Signal Processing, Test & Measurement Instrumentation, High-Performance Compute Acceleration, Industrial Imaging & Machine Vision.
Broadcast Video Processing
The 10AX115N4F45I3LG is well suited to broadcast video processing because its 1,150,000 logic elements and embedded DSP blocks deliver the parallel pixel-pipeline throughput required for 4K/UHD video format conversion, color-space transform, and multi-stream scaling. The 12.5 Gbps transceivers accept SDI and HDMI-over-IP inputs while the on-chip PCIe hard IP streams processed frames to host CPUs. The 1932-ball F45 FCBGA exposes enough user I/Os to drive multiple parallel video interfaces and external DDR4 memory simultaneously without external bridging.
Recommended
Wireless Baseband & RF Signal Processing
The 10AX115N4F45I3LG serves wireless baseband and RF signal processing where its transceiver-rich 'N4' variant supports CPRI/OBSAI backhaul at multi-gigabit rates, and its DSP blocks implement channelization, FFT/iFFT, and crest-factor reduction in LTE and 5G small-cell base stations. Industrial temperature rating allows outdoor remote-radio-head deployment. The 768 user I/Os and external-memory interfaces accommodate JESD204B/C ADC/DAC connectivity for direct RF sampling designs.
Recommended
High-Speed Data Acquisition
The 10AX115N4F45I3LG handles high-speed data acquisition in test-and-measurement and defense applications where multiple 10 Gbps ADC/DAC channels must be aggregated, buffered in 68.86 Mbit embedded memory, and forwarded over PCIe Gen3 to a host processor. The combination of integrated transceivers and a rich parallel I/O bank lets the FPGA replace custom analog front-end controllers, and the industrial temperature rating suits laboratory, field, and ruggedized environments.
Recommended
Radar Signal Processing
The 10AX115N4F45I3LG is a strong fit for radar signal processing in phased-array and synthetic-aperture systems because its DSP blocks perform real-time pulse compression, MTI, and STAP arithmetic, while 12.5 Gbps transceivers connect to ADC/DAC front-ends and backhaul links. The 1,150K LE budget supports multi-channel beamforming pipelines, and the 768 user I/Os allow dense GPIO expansion for synchronization and timing distribution. Industrial temperature grade covers radar deployments in non-automotive settings.
Recommended
Test & Measurement Instrumentation
The 10AX115N4F45I3LG enables protocol-aware test and measurement instruments such as multi-channel protocol analyzers, BERT testers, and oscilloscope DSP backends, because its logic density and transceiver bandwidth scale to 25 Gbps+ aggregate data rates. Designers can integrate custom PCIe, Ethernet, and serial-protocol IP alongside vendor IPs from the Quartus Prime library. The large FCBGA package provides the GPIO fan-out needed for display, button, and trigger interfaces.
Recommended
High-Performance Compute Acceleration
The 10AX115N4F45I3LG accelerates compute workloads in HPC and machine-learning inference appliances where its DSP blocks implement dense fixed- and floating-point math, and its PCIe Gen3 hard IP delivers high-bandwidth host connectivity. The 1,150K LE fabric supports custom SIMD, FFT, and convolution datapaths at deterministic latency, while the F45 FCBGA exposes the 12.5 Gbps transceiver channels needed for cluster interconnects and NIC offload.
Recommended
Industrial Imaging & Machine Vision
The 10AX115N4F45I3LG powers high-speed industrial imaging and machine-vision systems where multiple 10 GigE Vision or CoaXPress-over-FPGA links must be processed in real time. The on-chip DSP blocks execute Bayer demosaic, color-correction, and pre-ML preprocessing pipelines, while industrial temperature grade supports factory-floor and outdoor installations. The 768 GPIO provide ample margin for sensor triggering, lighting control, and rejection I/O.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N4F45I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N4F45E3LG | 10AX115N4F40I3LG | 10AX115N3F45I2LG | 10AX115N2F45I2LG | 10AX090N4F45I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-FCBGA (F45) | 1932-FCBGA (F45) | 1932-FCBGA (F40) | 1932-FCBGA (F45) | 1932-FCBGA (F45) | 1932-FCBGA (F45) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | ~900,000 (-22%) |
| Embedded Memory (Mbit) | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 | [DATA_NEEDED] |
| User I/O | 768 | 768 | 768 (F40 pinout) | 768 | 768 | 768 |
| Temperature Grade | Industrial (-40C to +100C) | Extended (-40C to +125C) | Industrial | Industrial | Industrial | Industrial |
| Speed Grade | I3 | E3 | I3 | I2 | I2 | I3 |
| Transceiver Variant | N4 (mid-bandwidth) | N4 (same) | N4 (same) | N3 (lower channel count) | N2 (lowest channel count) | N4 (same) |
Key Differentiators
- Highest logic-element count in the 10AX115N F45 lineup at this temperature grade (vs 10AX090N4F45I3LG)
- F45 FCBGA provides the largest ball array in the Arria 10 GX mid-density line (vs 10AX115N4F40I3LG)
- Industrial temperature grade backed by active Intel production (vs 10AX115N4F45E3LG)
- Mid-bandwidth N4 transceiver configuration optimizes cost-vs-bandwidth (vs 10AX115N3F45I2LG)
Design Notes
The Arria 10 GX 10AX115N4F45I3LG requires multiple voltage rails: VCC, VCCP, VCCPT, VCCBAT, VCCA_PLL, VCCIO per bank, and a dedicated VCC_HSSI for transceivers. Estimated: with all 1,150K LE, 768 I/O, and transceivers active, worst-case core power can exceed 30 W. Decouple each rail with a 1 µF + 100 nF + bulk capacitor stack placed within 5 mm of the package ball. A multi-phase PWM controller such as the ISL99227B or Enpirion EM1130 is recommended. The 'I3' speed grade draws more dynamic current than I2; budget 10-15% headroom.
Estimated: at 30 W total board dissipation in the 1932-ball FCBGA, junction-to-ambient thermal resistance (theta_JA) on a 12-layer JEDEC test board is roughly 7-9 °C/W, giving a junction rise of 240 °C. A heat-spreader or heatsink is mandatory; industrial-grade parts operating near 100 °C junction must use thermal vias under the exposed die flag and a minimum 6-layer PCB. Always validate with the Arria 10 thermal estimator in Quartus Prime before locking the stack-up.
Use a high-density interconnect (HDI) PCB with at least 10 layers, micro-vias under the FCBGA ball field, and matched 100 Ω differential routing for all transceiver channels. Reference the Intel Arria 10 PCB Design Guidelines for via-in-pad rules and length-matching budgets. Power-rail pours must overlap fully without voids to avoid hot spots when the device wakes from sleep at high ambient temperature.
All 12.5 Gbps transceiver channels require AC-coupled capacitors on the TX/RX serial pads, with AC cap placement within 4 mm of the BGA ball. Series coupling caps must be 0402 size with NPO/C0G dielectric for low loss. Reference-clock routing must be 100 Ω differential with length matching to within 0.127 mm (5 mil) for 12.5 Gbps; consult the Arria 10 device handbook for jitter budget allocations.
Common mistakes: (1) selecting a 10AS066x or 10AS057x (Arria V) variant thinking it is interchangeable - it is not; Arria V is a different silicon family. (2) swapping F45 and F40 packages without re-doing the PCB footprint - the ball maps differ. (3) omitting the VCCBAT battery domain needed for configuration memory retention. (4) using a speed grade without verifying transceiver performance - I3 typically supports 12.5 Gbps while I2 may limit to 10 Gbps depending on protocol.
Compliance Information
RoHS compliance confirmed via Altera/Intel product page. Not AEC-Q100 qualified (industrial grade only; not automotive). Lead-free BGA ball finish per RoHS directive.
