EP20K400CF672C-8 - APEX 20K 400K Gates FPGA, 672-BGA | Altera
MPN: EP20K400CF672C-8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $95 | $95,000.00 |
EP20K400CF672C-8 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device category sitting under the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. APEX 20K devices belong to the MultiCore architecture family, integrating look-up table (LUT) logic with embedded system blocks (ESBs) that combine dedicated RAM, ROM, and content-addressable memory functions on a single die. They are pin-compatible with the APEX 20KE series and deliver 25 to 35 percent faster design performance than APEX 20KE predecessors.
Key features of the EP20K400CF672C-8 include 400,000 typical gates, 1664 Macros, 488 I/O lines, 1.78 ns worst-case pin-to-pin combinatorial delay (speed grade -8), and 1.8 V core supply with commercial (C) temperature grade (0 °C to 85 °C). The device supports in-system programmability via the IEEE 1149.1 JTAG interface, configuration via passive serial, passive parallel asynchronous, and passive parallel synchronous modes, and is supported by the Altera Quartus and MAX+PLUS II design suites.
Architecturally, the MultiCore structure combines distributed LUT-based logic with columnar embedded system blocks. Each ESB can be configured as a 4096-bit RAM block, a ROM, or a CAM, providing flexible on-chip memory for high-bandwidth datapaths without sacrificing logic resources. The high copper interconnect metal stack reduces RC delay, enabling the 1.78 ns propagation performance at the -8 speed grade.
Typical applications for the EP20K400CF672C-8 include telecom line-card interface logic, high-speed DSP co-processing glue logic, industrial imaging preprocessing pipelines, and ASIC prototyping where 400K gates of programmable logic is required on a single die. Its 488 I/O make it well suited to parallel bus aggregation and data-format conversion roles.
When designing with this device, observe that the EP20K400CF672C-8 is now in an obsolete / last-time-buy lifecycle per industry catalogs; designers of new products should evaluate modern Cyclone or Stratix equivalents. Always observe JTAG configuration timing and decoupling requirements in the manufacturer datasheet.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Altera APEX 20K catalog, lifecycle status, and practical design guidance not consolidated in any single distributor product page.
Drop-in alternatives for EP20K400CF672C-8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400CF672C-8 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400CF672C-7
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP20K400CF672C-7ES
✅ Drop-In✓ In Stock
$132 / Unit
View Datasheet →EP20K400CF672I-8
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K400CF672C8ES
✅ Drop-In✓ In Stock
$158.4 / Unit
View Datasheet →EP20K400CF672C8N
✅ Drop-In✓ In Stock
$68.4 / Unit
View Datasheet →EP20K400CB652C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$89.2 / Unit
View Datasheet →EP20K400CF672C-8 Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Logic Elements | 16,640 |
| Typical Gates | 400,000 |
| Macros | 1,664 |
| Maximum User I/O | 488 |
| Package Type | PBGA-672 (FineLine BGA, 27 x 27 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | 1.8 V nominal (1.71 V to 1.89 V) |
| Pin-to-Pin Delay (tPD) | 1.78 ns (speed grade -8) |
| Speed Grade | -8 |
| Temperature Grade (C) | Commercial, 0 °C to 85 °C |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Embedded Memory Type | ESB (RAM / ROM / CAM) |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Mounting Type | Surface Mount (BGA) |
EP20K400CF672C-8 pbga-672 (fineline bga, 27 x 27 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP20K400CF672C-8 (pbga-672 (fineline bga, 27 x 27 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400CF672C-8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400CF672C-8 is suitable for 7 applications: Telecom Line-Card Interface Logic, ASIC Prototyping Platform, Industrial Imaging Preprocessing, DSP Co-Processing Glue Logic, Legacy Industrial Control Backplane, Network Router / Switch Aggregation, Test & Measurement Instrumentation.
Telecom Line-Card Interface Logic
The EP20K400CF672C-8's 400,000 typical gates and 488 user I/O lines make it well suited to telecom line-card interface aggregation, where multiple low-speed serial channels must be multiplexed into a higher-speed backplane interface. The 1.8 V core consumption limits total power dissipation, while the JTAG-supported in-system programming simplifies field upgrades. With 16,640 logic elements, designers can integrate glue logic, framing, and simple protocol conversion in a single device. The MultiCore architecture's ESB blocks also enable on-chip buffer memory for packet queues, allowing multi-port aggregation without external SRAM.
Recommended
ASIC Prototyping Platform
Engineers chose the EP20K400CF672C-8 in the late 1990s and 2000s as an ASIC prototyping vehicle because its 400K gates and 488 I/O were sufficient to validate multi-million-gate ASIC designs in silicon before tape-out. The 1.78 ns tPD at -8 speed grade allows real-time verification of system logic and timing closure, while the JTAG configuration interface accelerates iteration cycles. Quartus II and MAX+PLUS II support the device, enabling teams to migrate logic from simulation to hardware rapidly. For engineers still maintaining legacy ASIC prototypes, the EP20K400CF672C-8 remains a familiar and well-documented platform.
Recommended
Industrial Imaging Preprocessing
The EP20K400CF672C-8 supports industrial imaging preprocessing pipelines such as Bayer demosaicing, color-space conversion, and histogram generation across multiple parallel sensor channels. Its 16,640 logic elements enable full-parallel datapaths at typical camera line rates of 20 to 80 MHz, while the ESB blocks provide line buffers for short image-row storage. The 488 I/O lines allow direct attachment to multiple image sensors without external bus multiplexers. The commercial temperature grade (0 to 85 C) suits factory-floor enclosures with adequate thermal management.
Recommended
DSP Co-Processing Glue Logic
In DSP co-processing subsystems, the EP20K400CF672C-8 acts as the glue logic between dedicated DSP processors, memory controllers, and high-speed data converters. Its 400K-gate capacity handles complex state machines for DMA, interrupt prioritization, and FIFO address generation, while the 1.78 ns tPD keeps interface latency low for real-time signal processing. The MultiCore ESB blocks implement parameterized FIFOs that bridge DSP data streams to external SDRAM, simplifying PCB routing by reducing the need for external FIFO devices.
Recommended
Legacy Industrial Control Backplane
Factory automation and process-control backplanes used the EP20K400CF672C-8 to integrate fieldbus interfaces (Profibus, Foundation Fieldbus) with proprietary control networks. Its 488 I/O lines directly drive parallel backplane buses and discrete I/O racks, while the 1.8 V core limits heat dissipation in sealed cabinets. The MultiCore ESBs serve as mailbox RAM for inter-processor messaging in multi-CPU control systems. Industrial customers migrating these systems today must plan for the part's obsolete lifecycle and source drop-in alternatives where possible.
Recommended
Network Router / Switch Aggregation
Network aggregation equipment built on the EP20K400CF672C-8 used the FPGA to implement multi-port Ethernet aggregation, VLAN tagging, and simple Layer-2 forwarding at line-card level. The 488 I/O accommodated several Gigabit Ethernet MAC interfaces in parallel, while the 16,640 logic elements sustained per-port packet processing at wire speed. The MultiCore ESB blocks provided per-port packet buffers and lookup tables for MAC address filtering, allowing system vendors to deliver differentiated features without external ASICs.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments built on the EP20K400CF672C-8 used its 400K gates to implement custom pattern generation, capture, and protocol-aware decoding in bench-top and ATE-class equipment. The JTAG-supported in-system programming accelerated instrument calibration routines, while the 488 I/O lines allowed direct interface to high-pin-count DUTs and probe fixtures. Modern replacements with similar logic density exist but require PCB redesign because no pin-compatible successor exists.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400CF672C-8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400CF672C-7 | EP20K400CF672I-8 | EP20K400CF672C8ES | EP20K400CF672C8N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | PBGA-672 (FineLine BGA, 27 x 27 mm) | PBGA-672 (FineLine BGA, 27 x 27 mm) - same | PBGA-672 (FineLine BGA, 27 x 27 mm) - same | PBGA-672 (FineLine BGA, 27 x 27 mm) - same | PBGA-672 (FineLine BGA, 27 x 27 mm) - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Typical Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -8 (1.78 ns tPD) | -7 (faster, ~1.4 ns tPD) | -8 (1.78 ns tPD) | -8 (1.78 ns tPD) | -8 (1.78 ns tPD) |
| Temperature Grade | Commercial (0 to 85 C) | Commercial (0 to 85 C) | Industrial (-40 to 100 C) | Commercial (0 to 85 C) | Commercial (0 to 85 C) |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) | 1.8 V (1.71 V to 1.89 V) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Largest gate-count APEX 20K variant in PBGA-672 (vs EP20K300EFC672-2N)
- Faster speed-grade option available in same package (vs EP20K400CF672C-7)
- Industrial-temperature drop-in variant (vs EP20K400CF672I-8)
Design Notes
The EP20K400CF672C-8 uses a 1.8 V nominal core supply (VCCINT) with the legal range 1.71 V to 1.89 V per the APEX 20K datasheet. I/O banks (VCCIO) are supplied separately and must be configured for the chosen I/O standard (LVTTL, LVCMOS, PCI). Estimated: with all 488 I/O switching at 3.3 V and 50 percent toggle rate, core power can exceed 2 W, so decoupling with 0.1 uF X7R ceramics at every VCCINT pin and bulk 33 to 100 uF tantalums near the regulator is mandatory. The 1.8 V regulator must source the inrush current demanded during configuration bitstream loading.
The PBGA-672 FineLine BGA (27 x 27 mm, 1.0 mm pitch) requires PCB land patterns that comply with IPC-7351 BGA design rules. Use microvia (0.1 mm hole, 0.25 mm pad) stack-ups with at least 4 to 6 layers routed under the device for power and ground. Estimated: matched impedance traces (50 ohm single-ended, 100 ohm differential) are essential for LVDS or SSTL interfaces; reference the Altera APEX 20K board-design guidelines for via-in-pad recommendations and escape routing patterns.
Common pitfalls include (1) applying the wrong VCCIO voltage for the chosen I/O standard, (2) failing to sequence VCCINT before VCCIO per the APEX 20K datasheet (which can cause I/O latch-up), (3) using legacy MAX+PLUS II assignments without migrating to Quartus II when porting designs, and (4) expecting modern Altera/Intel tools to fully support APEX 20K - always test the bitstream in hardware before committing to production. Also note that the obsolete lifecycle means new bitstream IP must be frozen and validated now.
Estimated: at worst-case 2 W core dissipation and JEDEC-standard 4-layer PCB with no airflow, theta_JA for the PBGA-672 is approximately 12 to 18 C/W, leading to a junction temperature rise of 24 to 36 C above ambient. For high-reliability industrial deployments, mounting the device on a thermally-conductive PCB pad array and providing 100 LFM airflow keeps Tj within the 125 C commercial limit. Thermal vias (0.3 mm diameter, 1.2 mm pitch) under the center BGA balls are recommended to conduct heat to inner copper planes.
Compliance Information
Compliance information not present in verified web data; set to unknown. APEX 20K family devices were typically RoHS-compliant for the N-suffix variants (e.g., EP20K400CF672C8N) but specific compliance status for this C-8 variant requires confirmation from the manufacturer datasheet.
