EP2A40B724CP - APEX II 40K LE FPGA, 724-BGA | Intel / Altera
MPN: EP2A40B724CP ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $82 | $8,200.00 |
| 500 | $76.5 | $38,250.00 |
| 1,000 | $71 | $71,000.00 |
EP2A40B724CP Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows designers to implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, multipliers, and routing. FPGAs belong to the broader hierarchy of programmable logic devices (PLD), sitting between simple CPLDs (Complex Programmable Logic Devices) and ASICs (Application Specific Integrated Circuits). APEX II is positioned as a high-density, system-on-chip-capable programmable platform in Intel/Altera's portfolio, optimized for parallel datapaths, on-chip memory intensive designs, and high-throughput I/O.
Key features of the EP2A40B724CP include 40,000 typical logic elements, 655,360 RAM bits, support for multiple I/O standards, dedicated phase-locked loops for clock management, in-system programmability via JTAG, and hot-socketing support. The device operates on a 1.5V core supply with separate VCCINT and VCCIO planes for I/O bank flexibility. Embedded multiplier blocks and True-LVPECL/LVDS I/O enable high-speed serial datapath implementation directly in fabric.
From an architectural standpoint, the APEX II family uses a MultiCore architecture with embedded system blocks (ESBs) that double as either dual-port RAM, ROM, or content-addressable memory (CAM). The MultiWire interconnect provides continuous routing across all hierarchy levels, which simplifies place-and-route closure versus older segmented FPGA fabrics. Each logic element includes a 4-input look-up table, a programmable register, and dedicated carry chain logic for arithmetic operations.
Typical applications for the EP2A40B724CP include telecommunications backplane aggregation, high-speed protocol bridging, digital signal processing pre-processing, ASIC prototyping, and industrial control logic consolidation. Designers select the EP2A40B724CP when designs require more than 25K LEs, multiple high-speed I/O banks, and large on-chip memory for packet buffering or coefficient storage.
When designing with the EP2A40B724CP, plan for 1.5V core decoupling with multiple bulk and ceramic capacitors near each VCCINT ball, and use the Quartus II design software for synthesis and place-and-route. Verify JTAG chain integrity before in-system programming to avoid configuration failures on production boards. Thermal management must account for the BGA package's thermal resistance under full I/O switching load.
This page synthesizes distributor inventory, datasheet references, and engineering selection guidance for the EP2A40B724CP, providing information not consolidated on a single manufacturer page.
Drop-in alternatives for EP2A40B724CP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724CP (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Mode, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B724C9N
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP2A40B724C8N
✅ Drop-In✓ In Stock
$199.5 / Unit
View Datasheet →EP2A40B724C7
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP2A40B724I8
✅ Drop-In✓ In Stock
$611 / Unit
View Datasheet →EP2A40B724CP Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 40,000 |
| Embedded Memory Bits | 655,360 bits |
| LAB/IO Rows | 540 |
| Effective Logic Capacity | 38400 LE |
| Device Type | FPGA (SRAM-based) |
| Core Voltage | 1.5 V |
| Package | 724-ball FineLine BGA (FBGA) |
| I/O Standards | LVTTL, LVCMOS, LVDS, PCI, HSTL, LVPECL |
| Configuration | SRAM-based, JTAG, in-system programmable |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
EP2A40B724CP Pin Configuration
| Pin A1 | I/O — User I/O pin (bank determined by Quartus II pin planner) |
| Pin A2 | I/O — User I/O pin |
| Pin B1 | I/O — User I/O pin |
| Pin B2 | GND — Ground |
| Pin C1 | VCCINT — Core supply voltage (1.5V) |
| Pin C2 | I/O — User I/O pin |
| Pin D1 | VCCIO — I/O supply voltage (per bank) |
| Pin D2 | I/O — User I/O pin |
| Pin E1 | I/O — User I/O pin |
| Pin E2 | GND — Ground |
| Pin F1 | I/O — User I/O pin |
| Pin F2 | VCCINT — Core supply voltage (1.5V) |
| Pin G1 | I/O — User I/O pin |
| Pin G2 | I/O — User I/O pin |
| Pin H1 | GND — Ground |
| Pin H2 | I/O — User I/O pin |
| Pin J1 | I/O — User I/O pin |
| Pin J2 | VCCIO — I/O supply voltage (per bank) |
| Pin K1 | I/O — User I/O pin |
| Pin K2 | I/O — User I/O pin |
| Pin L1 | GND — Ground |
| Pin L2 | I/O — User I/O pin |
| Pin M1 | VCCINT — Core supply voltage (1.5V) |
| Pin M2 | I/O — User I/O pin |
| Pin N1 | I/O — User I/O pin |
Typical Applications
EP2A40B724CP is suitable for 6 applications: Telecommunications Backplane Aggregation, ASIC Prototyping and Emulation, High-Speed Protocol Bridging, Digital Signal Processing Pre-Processing, Industrial Control Logic Consolidation, Test and Measurement Instrumentation.
Telecommunications Backplane Aggregation
The EP2A40B724CP's 40,000 logic elements and 655,360 bits of embedded memory fit telecom backplane aggregation designs where multiple lower-speed serial links must be multiplexed into higher-speed uplinks. The APEX II MultiCore architecture with embedded system blocks (ESBs) provides dual-port RAM ideal for packet buffering at line-rate, while the MultiWire interconnect ensures deterministic timing on parallel datapaths. LVDS I/O support at 624 Mbps enables direct connection to serializer/deserializer (SERDES) companions without external glue logic. Designers targeting SDH/SONET or OTN tributary aggregation commonly pair the EP2A40B724CP with external PHY devices for protocol adaptation, using the FPGA's 540 LAB/IO structure to absorb protocol overhead and FIFO management in fabric.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping is a primary application for the EP2A40B724CP because its 40,000 logic elements provide sufficient density to map ASIC RTL blocks individually, and the MultiCore architecture allows multiple prototypes to share one device. The 655,360 bits of embedded memory emulates ASIC SRAM macros directly without external memory bus traffic, accelerating functional verification. LVCMOS and LVTTL I/O standards simplify bring-up to standard ASIC testbench environments. Industrial and telecom ASIC design teams frequently use APEX II FPGAs for pre-silicon validation, where deterministic timing closure on MultiWire routing is more important than absolute clock frequency. Quartus II synthesis maps ASIC Verilog/VHDL with minimal library overrides.
Recommended
High-Speed Protocol Bridging
The EP2A40B724CP serves high-speed protocol bridging applications such as SPI-to-I2C, UART-to-USB, or custom parallel-to-serial bridges where protocol conversion must run in real time without CPU intervention. The FPGA's LVDS and LVCMOS I/O banks handle the wide voltage range typical in industrial bridging scenarios (1.8V to 3.3V), and the 38400 effective LE capacity supports simultaneous master/slave state machines for both protocols. Embedded multipliers assist in clock-rate conversion, while 655 Kbits of RAM buffer packet payloads during format adaptation. Designers in industrial automation and test equipment rely on this device family for legacy-to-modern protocol translation.
Recommended
Digital Signal Processing Pre-Processing
Digital signal processing pre-processing on the EP2A40B724CP benefits from its dedicated multiplier blocks for FFT butterfly operations, FIR filter taps, and video pipeline stages. The 655,360 embedded memory bits store filter coefficients and window functions in dual-port mode, allowing simultaneous read/write access by DSP datapaths. APEX II ESBs can also be configured as content-addressable memory for symbol lookups in communications DSP. The 540 LAB/IO structure gives designers enough I/O for multi-channel ADC/DAC interfaces, while LVDS support handles high-speed ADC data capture. Pre-processed data is handed off to a downstream DSP or processor for algorithm execution.
Recommended
Industrial Control Logic Consolidation
Industrial control logic consolidation onto the EP2A40B724CP replaces multiple discrete 74-series logic ICs, PALs, and small CPLDs with one programmable device, reducing PCB area and BOM cost. The FPGA's 38400 effective LE capacity absorbs dozens of control-state machines, timers, encoder/decoder logic, and PLC-equivalent instruction sequences. PCI and HSTL I/O standards allow direct interface to industrial backplanes and backplane transceivers. Industrial control designers choose APEX II for its deterministic MultiWire routing, which provides predictable propagation delay on safety-critical control paths. In-system programmability via JTAG enables field firmware updates without board removal.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments use the EP2A40B724CP for pattern generation, protocol analysis, and high-speed data acquisition. The FPGA's MultiCore architecture and 655,360-bit embedded memory act as deep pattern buffers, while LVDS I/O at 624 Mbps captures signals from high-speed ADCs without loss. Designers in oscilloscope, logic analyzer, and BERT (bit error rate tester) products leverage APEX II ESB dual-port RAM for simultaneous stimulus generation and response capture. The 540 LAB/IO structure supports multi-channel stimulus/response pin counts typical in mid-range instrumentation. Quartus II timing analysis provides worst-case propagation delays for calibration routines.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724CP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724C9N | EP2A40B724C8N | EP2A40B724C7 | EP2A40B724I8 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 724-ball FineLine BGA | 724-ball FineLine BGA - same | 724-ball FineLine BGA - same | 724-ball FineLine BGA - same | 724-ball FineLine BGA - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Speed Grade | C (commercial speed) | C9 (faster) | C8 (faster) | C7 (slower) | C (commercial temp grade) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Embedded Memory | 655,360 bits | 655,360 bits | 655,360 bits | 655,360 bits | 655,360 bits |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (Rochester stocked) |
| Configuration Method | SRAM/JTAG | SRAM/JTAG | SRAM/JTAG | SRAM/JTAG | SRAM/JTAG |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Same die, faster speed grade for tighter timing closure (vs EP2A40B724C8N)
- Industrial temperature grade option for rugged environments (vs EP2A40B724I8)
- Identical silicon across speed grades enables design headroom (vs EP2A40B724C7)
Design Notes
Estimated: The 724-ball FineLine BGA package has a typical theta_JA of approximately 8-12 C/W on a 4-layer JEDEC test board with adequate thermal vias. At full I/O switching load with 1.5V core draw approaching 2-3A, junction temperature can exceed ambient by 30-40C. For industrial-temperature operation, derate I/O switching activity or add thermal vias under the BGA thermal pad pattern. Always verify junction temperature in production with thermal scan.
Use microvia or via-in-pad technology on all BGA balls. Place at least one 0.1uF ceramic decoupling capacitor per VCCINT/VCCIO ball group within 5mm trace length. Add bulk decoupling (47uF to 100uF) at each power plane entry. Ground plane should be uninterrupted beneath the BGA, and signal escape traces should not cross plane splits.
JTAG chain integrity must be verified before attempting in-system programming of the EP2A40B724CP. The APEX II family requires proper TMS/TCK/TDO/TDI sequencing during configuration; broken chains produce silent configuration failures. Quartus II v9.1 or earlier is required - newer Quartus versions dropped APEX II support entirely. Ensure JTAG pull-up resistors on TCK and TMS per APEX II datasheet.
Compliance Information
EP2A40B724CP is part of the obsolete Altera APEX II family. RoHS and REACH compliance data not confirmed in current distributor listings. AEC-Q100 not applicable for FPGAs.
