Intel

EP2A40F1020C7ES - APEX II 1.5M Gates FPGA, 1020-FBGA | Intel

MPN: EP2A40F1020C7ES ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss LVTTL, LVCMOS, LVDS, LVPECL, PCML, HyperTransport, 1.5/1.8/2.5/3.3 V Rds(on) 1020-pin FC-FBGA Package 562 MHz Speed 655,360 bits Memory
From $185 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $260 $2,600.00
100 $232 $23,200.00
500 $205 $102,500.00
1,000 $185 $185,000.00
ℹ️ All prices are in USD

EP2A40F1020C7ES Overview

The Intel (formerly Altera) EP2A40F1020C7ES is a high-density FPGA from the APEX II device family, manufactured on a 0.15 µm all-layer copper process supporting up to eight metal layers. It integrates 1.5 million system gates, 38,400 logic elements, and 655,360 bits of embedded memory in a 1020-pin FC-FBGA package with 735 user I/O pins, optimized for 1.5 V core operation at system speeds up to 562 MHz.

What is an APEX II FPGA? APEX II (Advanced Logic Element Matrix, second generation) is a programmable logic device family from Altera that combines look-up table (LUT) based logic, embedded system blocks (ESBs) for memory and arithmetic, and high-speed I/O on a single die. APEX II devices sit in the FPGA hierarchy above CPLDs and below ASICs, between simple programmable logic devices (SPLDs/CPLDs) and structured ASICs. They belong to the broader class of programmable logic devices (PLDs) and are typically deployed when design flexibility, high gate count, and parallel signal processing are required before committing to an ASIC tape-out.

Key features include up to 1.5 million typical gates, 38,400 logic elements (LEs), 655,360 bits of embedded RAM, and 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface support. The 1020-pin FC-FBGA package exposes 735 user I/Os, enabling wide parallel buses and high-pin-count data acquisition. MultiVolt I/O allows interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic levels without external level shifters.

The device uses a hierarchical routing architecture with embedded array blocks (EABs) and logic array blocks (LABs), allowing efficient implementation of large multipliers, FIFOs, and dual-port RAM. True-LVDS support at 1 Gbps makes the part suitable for high-speed serial links and parallel chip-to-chip interconnect. Internal Phase-Locked Loops (PLLs) provide clock multiplication, division, and phase shifting across up to eight clock domains.

Typical applications include high-performance data acquisition, ASIC prototyping, telecommunications infrastructure, parallel DSP pipelines, and high-speed image or video processing. The high I/O count makes it well-suited for bus-intensive bridging and protocol conversion designs.

When designing with EP2A40F1020C7ES, follow Altera's power and thermal decoupling guidance carefully; a 1020-pin FC-FBGA demands multi-layer PCB with continuous power planes and a controlled-impedance stack-up. The 'ES' suffix indicates an enhanced speed grade, so verify timing closure with the Altera Quartus II design tool before tape-out.

This page synthesizes distributor pricing, drop-in alternatives from the same APEX II family, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP2A40F1020C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2A40F1020C7ES (same form factor and footprint) — differing in Package, Process Technology, System Gates, Operating Temperature, Speed Grade.

Intel
Package: 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm
Process Technology: 0.15 µm CMOS, up to 8 metal layers, all-layer copper
Operating Temperature: 0 °C to +85 °C (commercial)
Compare with EP2A40F1020C7ES →
Intel
Package: 724-ball FCBGA
Process Technology: 0.15 µm
System Gates: 1,500,000 (1.5M)
Compare with EP2A40F1020C7ES →
Intel
Package: FBGA-1020
Process Technology: 0.15 µm CMOS
Compare with EP2A40F1020C7ES →
Altera
Package: FBGA-1020
Process Technology: 0.15 µm
Speed Grade: C6
Compare with EP2A40F1020C7ES →
Altera
Package: 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA)
Process Technology: 0.15 um CMOS, all-layer copper (up to 8 metal layers)
System Gates: 1.5 M
Compare with EP2A40F1020C7ES →
Intel
Package: FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line
System Gates: 1,500,000 (1.5 M)
Operating Temperature: 0 °C to +85 °C (commercial, C7 grade)
Compare with EP2A40F1020C7ES →
Intel
Process Technology: 0.15 µm all-layer copper, up to 8 metal layers
System Gates: 1,500,000
Operating Temperature: 0 C to +85 C (commercial, 'C' suffix)
Compare with EP2A40F1020C7ES →
Intel
Operating Temperature: 0 °C to 85 °C (TJ)
Speed Grade: C8
Compare with EP2A40F1020C7ES →
Altera
Process Technology: 0.15 µm CMOS
System Gates: 1.5 M
Compare with EP2A40F1020C7ES →
Altera
Package: 1020-ball FC-FBGA
Process Technology: 0.15 µm CMOS
System Gates: 1.5M
Compare with EP2A40F1020C7ES →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2A40F1020C7

✅ Drop-In
Altera
📦 1020-pin FC-FBGA
APEX II · 38,400 · 1.5 M · 2,560 · 735 · 655,360 bits · 1.5 V · 562 MHz

✓ In Stock

$138 / Unit

View Datasheet →

EP2A40F1020C6

✅ Drop-In
Intel
📦 1020-pin FC-FBGA
APEX II · 1,600,000 · 40,000 · 655,360 bits · 4 · 1.8 V

✓ In Stock

$149 / Unit

View Datasheet →

EP2A40F1020C6N

✅ Drop-In
Altera
📦 1020-pin FC-FBGA
APEX II · APEX II (EP2A) · 40,000 · 655,360 bits · 735 · FBGA-1020 · 1.5 V (typical)

✓ In Stock

$198 / Unit

View Datasheet →

EP2A40B724C7ES

✅ Drop-In
Intel
📦 724-pin BGA
APEX II · 38,400 · 1,500,000 (1.5M) · 562 MHz · 0.15 µm · 1.5 V · 724-ball FCBGA · Surface Mount

✓ In Stock

$155 / Unit

View Datasheet →

EP2A40B724C7

✅ Drop-In
Intel
📦 724-pin BGA
APEX II · 38,400 · 1,500,000 · 655,360 · 540 · 1.425 V to 1.575 V (typ. 1.5 V) · 0.15 µm CMOS, up to 8 metal layers, all-layer copper · 562 MHz

✓ In Stock

$650 / Unit

View Datasheet →

EP2A40B652C7ES

✅ Drop-In
📦 652-pin BGA
same die (38,400 LEs, 1.5M gates), 652-pin BGA with fewer I/O, ES speed grade, pinout differs - PCB rework required

📋 Reference alternative (not in catalog)

EP2A40F1020C7ES Maximum Ratings & Electrical Characteristics

Family APEX II
Logic Elements 38,400
Typical Gates 1,500,000
Embedded Memory 655,360 bits
Maximum User I/O 735
Maximum Frequency 562 MHz
Process Technology 0.15 µm CMOS, all-layer copper, up to 8 metal layers
Core Voltage 1.5 V
Package 1020-pin FC-FBGA
Speed Grade C7 (with ES enhanced speed suffix)
High-Speed Interface 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport
I/O Standards LVTTL, LVCMOS, LVDS, LVPECL, PCML, HyperTransport, 1.5/1.8/2.5/3.3 V
PLLs Up to 8 (per datasheet family feature)
Programming Interface JTAG (IEEE 1149.1), passive serial
Mounting Type Surface Mount (FC-FBGA)

EP2A40F1020C7ES 1020-pin fc-fbga Pin Configuration Guide

Pin configuration for EP2A40F1020C7ES (1020-pin fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1020-pin fc-fbga package pinout diagram for EP2A40F1020C7ES

No detailed pinout data available for EP2A40F1020C7ES.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2A40F1020C7ES is suitable for 7 applications: ASIC Prototyping and Emulation, Telecommunications Infrastructure, High-Speed Data Acquisition Systems, Parallel DSP Pipeline Processing, Industrial Automation and Control, Medical Imaging and Diagnostics, Aerospace and Defense Signal Processing.

🖥️

ASIC Prototyping and Emulation

The EP2A40F1020C7ES is well suited for ASIC prototyping with its 1.5 million system gates and 38,400 logic elements providing sufficient capacity to emulate mid-complexity ASICs at functional level. The 735 user I/Os in the 1020-pin FC-FBGA package expose wide parallel buses, enabling direct mapping of ASIC pinout for pre-silicon validation. Designers using Quartus II can iterate RTL quickly and validate system behavior before committing to silicon.

🌐

Telecommunications Infrastructure

In telecom equipment, the EP2A40F1020C7ES provides parallel DSP and packet processing capability with its 1 Gbps True-LVDS interface support, enabling high-speed chip-to-chip links to line card ASICs and network processors. The 655,360 bits of embedded memory allow implementation of large lookup tables, packet buffers, and queuing structures directly in the FPGA. MultiVolt I/O at 1.5/1.8/2.5/3.3 V enables direct interface to legacy and modern telecom ASICs without external level shifting.

🎥

High-Speed Data Acquisition Systems

The EP2A40F1020C7ES supports multi-channel data acquisition with its 735 user I/Os and 1 Gbps LVDS interface, allowing direct parallel sampling from multiple high-speed ADCs and digital sensors. The 655,360 bits of embedded RAM provide local buffering for incoming sample streams, while the 38,400 LEs handle real-time DSP preprocessing. The 562 MHz maximum operating frequency supports complex FIR/FFT preprocessing on multi-channel input data.

🏭

Parallel DSP Pipeline Processing

The EP2A40F1020C7ES implements parallel DSP pipelines using its MultiVolt I/O and embedded arithmetic blocks, supporting sample rates up to 562 MHz for FIR filters, FFT engines, and correlation processors. With 38,400 LEs, designers can instantiate multiple parallel multiply-accumulate channels simultaneously. The 655,360-bit embedded memory serves as coefficient storage and sample delay lines for adaptive filtering and beamforming.

🏭

Industrial Automation and Control

The EP2A40F1020C7ES provides deterministic parallel I/O for industrial control systems, with 735 user I/Os supporting multi-axis motor control, encoder feedback, and high-speed deterministic response to sensor inputs. The 1.5 V core and multi-voltage I/O integrate with industrial 3.3 V and 5 V logic families. APEX II's MultiVolt feature simplifies interface to legacy PLC and factory automation equipment without external level translators.

💊

Medical Imaging and Diagnostics

The EP2A40F1020C7ES suits medical imaging front-end processing where its 735 user I/Os capture parallel data streams from ultrasound transducer arrays, CT detectors, or MRI digitizers. The 1 Gbps LVDS interface supports chip-to-chip links to high-speed ADCs used in medical imaging front-ends. Embedded memory of 655,360 bits allows line buffer storage for image reconstruction, while 38,400 LEs handle real-time beamforming and image preprocessing pipelines.

✈️

Aerospace and Defense Signal Processing

The EP2A40F1020C7ES is deployed in aerospace signal processing applications including radar data pre-processing, electronic warfare front-ends, and secure communications links. The 1 Gbps True-LVDS interface connects to high-speed converters and downconverters, while 735 user I/Os support wide parallel data paths. The 1020-pin FC-FBGA package is suitable for ruggedized PCB assemblies with thermal management provisions for high-altitude operation.

What is the EP2A40F1020C7ES FPGA?
The EP2A40F1020C7ES is a high-density FPGA from Intel's (formerly Altera) APEX II family, manufactured on a 0.15 µm all-layer copper CMOS process. According to the Altera APEX II datasheet, it integrates 1.5 million typical system gates, 38,400 logic elements, 655,360 bits of embedded memory, and 735 user I/O pins in a 1020-pin FC-FBGA package, with True-LVDS support up to 1 Gbps.
How many logic elements and gates does EP2A40F1020C7ES have?
The EP2A40F1020C7ES contains 38,400 logic elements (LEs) and supports up to 1,500,000 typical system gates. The device also integrates 655,360 bits of embedded system block (ESB) memory, configurable as RAM, ROM, or content-addressable memory, making it suitable for high-throughput parallel processing designs.
What package does the EP2A40F1020C7ES use?
The EP2A40F1020C7ES is housed in a 1020-pin flip-chip fine-pitch BGA (FC-FBGA) package. According to the manufacturer datasheet, this package exposes 735 user I/O pins and supports MultiVolt I/O operation at 1.5 V, 1.8 V, 2.5 V, and 3.3 V, enabling mixed-voltage interfacing without external level shifters.
Where can I download the EP2A40F1020C7ES datasheet PDF?
The Altera APEX II device family datasheet is available as a 99-page PDF at alldatasheet.com (datasheet-pdf/pdf/273646/ALTERA/EP2A40.html) and via Altera/Intel's legacy APEX II documentation archive. The datasheet contains pinout, timing, electrical characteristics, and Quartus II support information for all APEX II speed grades including the C7 ES variant.
What is the price of EP2A40F1020C7ES as of 2026?
EP2A40F1020C7ES prices as of 2026-09-08 range from approximately USD 285 per unit at qty 1 to USD 185 per unit at qty 1000, based on distributor and broker market data. The part is obsolete and only available through aftermarket channels; pricing reflects scarcity rather than volume manufacturing cost, and Heisener quotes lead times of approximately 4 weeks.
Is EP2A40F1020C7ES in stock at distributors?
EP2A40F1020C7ES is no longer in factory production; it is obsolete and only available from authorized distributors and aftermarket brokers. As of 2026-09-08, Heisener lists approximately 2,720 pieces in stock with lead times to be confirmed. Altera/Intel recommend migrating to Cyclone IV/V or Stratix family devices for new designs.
What is the lead time for EP2A40F1020C7ES orders?
Lead time for EP2A40F1020C7ES varies by distributor and is typically quoted as 'to be confirmed' for obsolete parts. Heisener estimates delivery in late October to early November 2026 if ordered today, with expedited shipping available at additional cost. Plan inventory buffers for production runs since the part is no longer manufactured.
What is the difference between EP2A40F1020C7ES and EP2A40F1020C7?
Both EP2A40F1020C7ES and EP2A40F1020C7 are from the APEX II family in the same 1020-pin FC-FBGA package with C7 speed grade. The 'ES' suffix denotes an enhanced speed/revision variant with the same silicon die but improved electrical characterization. They are drop-in compatible at the PCB footprint level, but timing closures should be verified against your specific Quartus II design.
Can EP2A40F1020C7ES be replaced by an EP2A40F1020C6?
Yes, EP2A40F1020C6 is a drop-in replacement for EP2A40F1020C7ES in the same 1020-pin FC-FBGA package; the difference is the speed grade (C6 is slower than C7 ES), so timing margins will tighten. Per the Altera datasheet, replacing C7 with C6 is acceptable for designs with adequate timing slack but may require re-running Quartus II timing analysis to confirm closure.
EP2A40F1020C7ES vs EP2A25F672 - which is better for high-density designs?
The EP2A40F1020C7ES has 38,400 logic elements, 1.5M gates, and 735 user I/Os, versus the EP2A25F672's 25,600 LEs, 1.0M gates, and 536 I/Os. For high-density designs needing more logic capacity and parallel I/O, choose EP2A40F1020C7ES. For cost-sensitive designs with adequate logic headroom, EP2A25F672 provides a smaller-footprint alternative. Both share APEX II architecture and Quartus II tool support.
What software tool supports EP2A40F1020C7ES programming?
The EP2A40F1020C7ES is supported by Altera Quartus II design software, which provides synthesis, place-and-route, timing analysis, and programming file generation for all APEX II devices. Quartus II versions 9.0 and earlier include full APEX II support; Intel (which acquired Altera) maintains legacy support via the Quartus Prime Subscription Edition with APEX II device libraries enabled.
Is EP2A40F1020C7ES RoHS compliant?
RoHS compliance status for EP2A40F1020C7ES is not explicitly documented in the verified web data; this information should be confirmed with the specific distributor or aftermarket supplier providing the part. Note that the 'ES' suffix denotes enhanced speed grade, not environmental compliance. Marked as [DATA_NEEDED] in specifications.
What applications is EP2A40F1020C7ES best suited for?
EP2A40F1020C7ES is best suited for high-density parallel processing designs such as ASIC prototyping, telecommunications infrastructure, high-speed data acquisition, parallel DSP pipelines, and protocol bridging with 735 user I/Os. Its 1 Gbps True-LVDS interface support also makes it suitable for chip-to-chip high-speed serial links and parallel data converters. According to the APEX II datasheet, the device's logic density targets 100K-1M gate-equivalent designs.
Hey Google, what is a drop-in replacement for EP2A40F1020C7ES?
The best drop-in replacement for EP2A40F1020C7ES is the EP2A40F1020C6 or EP2A40F1020C6N in the same 1020-pin FC-FBGA package, both from the APEX II family. These parts share the same 38,400 logic elements, 655,360 memory bits, and pinout, differing only in speed grade. For a faster drop-in option, EP2A40F1020C7 (without ES suffix) is also pin-compatible.
What are the key specifications of EP2A40F1020C7ES that engineers should know?
Engineers working with EP2A40F1020C7ES need to know: 38,400 logic elements, 1.5 million typical gates, 655,360 bits of embedded memory, 735 user I/O pins, 562 MHz maximum operating frequency, 1.5 V core voltage, 1020-pin FC-FBGA package, and 1 Gbps True-LVDS interface support. The device is obsolete as of 2026; design-in should target Cyclone IV/V or Stratix for new products.

Engineering reference data for EP2A40F1020C7ES — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2A40F1020C7ES when your design requires maximum pin count (735 user I/Os) for parallel buses, high-speed LVDS interconnect at 1 Gbps, and the densest logic capacity (38,400 LEs / 1.5M gates) in the APEX II family, and you have an existing design verified for C7 ES timing margin. For cost-sensitive applications where C7 timing is not required, choose EP2A40F1020C6 or EP2A40F1020C6N (same 1020-pin FC-FBGA, slower speed grade, 20-30% lower price). For designs with fewer I/O requirements, consider EP2A40B724C7ES (724-pin BGA, 455 I/Os) or EP2A40B652C7ES (652-pin BGA, 406 I/Os) - note these require PCB layout rework since packages differ. For new designs, Intel recommends migrating to Cyclone IV/V or Stratix families due to APEX II obsolescence.

Comparison with Alternatives

Parameter This Product EP2A40F1020C7 EP2A40F1020C6 EP2A40F1020C6N EP2A40B724C7ES EP2A40B724C7 EP2A40B652C7ES
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 1020-pin FC-FBGA 1020-pin FC-FBGA (same) 1020-pin FC-FBGA (same) 1020-pin FC-FBGA (same) 724-pin BGA (different) 724-pin BGA (different) 652-pin BGA (different)
Logic Elements 38,400 38,400 38,400 38,400 38,400 38,400 38,400
Typical Gates 1,500,000 1,500,000 1,500,000 1,500,000 1,500,000 1,500000 1,500,000
User I/O 735 735 735 735 455 (lower) 455 (lower) 406 (lower)
Speed Grade C7 ES C7 C6 (slower) C6 (slower) C7 ES C7 C7 ES
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Embedded Memory (bits) 655,360 655,360 655,360 655,360 655,360 655,360 655,360
True-LVDS Speed 1 Gbps 1 Gbps 1 Gbps 1 Gbps 1 Gbps 1 Gbps 1 Gbps
Approx. Unit Price (qty 1, USD) 285.00 275.00 220.00 230.00 210.00 200.00 190.00

Key Differentiators

  • Highest pin-count option in APEX II family with 735 user I/Os (vs EP2A40B724C7ES)
  • Enhanced speed grade for tighter timing margin (vs EP2A40F1020C7)
  • Same silicon die across all EP2A40F1020 variants (vs EP2A40B652C7ES)
  • C7 speed grade offers balance of speed and availability (vs EP2A40F1020C6)

Design Notes

The 1020-pin FC-FBGA package demands a multi-layer PCB with at least 6 to 8 layers, dedicated ground and 1.5 V power planes, and a controlled-impedance stack-up for LVDS/LVPECL signal integrity. Per Altera's APEX II hardware design guide, route all power pins directly to the planes through short vias, place 0.1 µF decoupling capacitors every 5 to 10 power pins, and provide bulk decoupling with 220 µF tantalum capacitors at the PCB edge connector. Use microvia or stacked-via technology for fan-out from the 1.0 mm pitch BGA pads.

Estimated: at 562 MHz with 100% logic utilization, the EP2A40F1020C7ES may dissipate 4 to 6 W in the FC-FBGA package. With θJA of approximately 12 to 15 °C/W for a 1020-pin FC-FBGA on a JEDEC test board, this translates to a 48 to 90 °C junction-temperature rise above ambient. For reliable operation in industrial temperature range (-40 °C to +85 °C ambient), ensure continuous top-side airflow or attach a heatsink with thermal interface material. Compute exact values using Quartus II PowerPlay power analyzer output for your specific design utilization.

Common pitfalls when designing with EP2A40F1020C7ES: (1) conflate 'ES' suffix with environmental compliance - it denotes enhanced speed, not RoHS or halogen-free status; (2) ignore the C7 speed grade's lower timing margins when migrating from C6 designs - re-run Quartus II timing analysis to confirm closure; (3) assume the device supports 5 V I/O - it requires 1.5/1.8/2.5/3.3 V via MultiVolt I/O only; (4) over-constrain pin assignments without checking the device's pin-out file for 1020-FBGA bank assignments; (5) fail to provide JTAG chain termination - the device requires 4.7 kΩ pull-up on TCK per IEEE 1149.1.

For 1 Gbps True-LVDS interfaces on EP2A40F1020C7ES, match differential pair impedance to 100 Ω ±10%, keep intra-pair skew below 5 ps, and maintain length matching between P and N traces within 0.13 mm. Per the APEX II datasheet, route LVDS pairs on inner stripline layers adjacent to a continuous ground plane; avoid routing over plane splits. Use LVDS point-to-point topology when possible; for multi-drop configurations, keep stubs below 2.5 mm and validate with IBIS-AMI simulation.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance status not explicitly documented in verified web data for the ES speed-grade suffix variant; the base EP2A40 family is from Altera's pre-Intel obsolescence era (early 2000s). Confirm RoHS/lead-free status with specific distributor at time of quote. AEC-Q100 not applicable for FPGAs in this context.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP2A40F1020C7ES EP2A40F1020C7 EP2A40F1020C6 EP2A40B724C7ES APEX II FPGA Programmable Logic Device PLD FC-FBGA BGA-1020 True-LVDS LVPECL PCML HyperTransport MultiVolt I/O logic element embedded system block ESB 1.5 V core voltage Quartus II 0.15 µm CMOS process IEEE 1149.1 JTAG RoHS ASIC prototyping telecommunications infrastructure data acquisition DSP pipeline medical imaging aerospace signal processing
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