EP2S130F1020I4RB - Stratix II FPGA 132540 Cells 1.2V FC-FBGA | Intel
MPN: EP2S130F1020I4RB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $980 | $490,000.00 |
| 1,000 | $875 | $875,000.00 |
EP2S130F1020I4RB Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic functionality is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit in the broader taxonomy programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor, and are used when design iteration, parallel processing, hardware acceleration, or low-NRE prototyping are required. The Stratix II family is Intel's (formerly Altera's) mid-2000s high-density flagship line, built on a 90nm process and introducing adaptive logic modules (ALMs) instead of the older 4-input LUT architecture of Stratix I.
Key specifications of the EP2S130F1020I4RB include 132,540 logic elements, up to 6,747,840 bits of embedded memory (M4K/M512 blocks), embedded DSP blocks for fixed- and floating-point arithmetic, twelve embedded transceiver channels, and four phase-locked loops (PLLs). The device also exposes up to 742 general-purpose user I/O supporting multiple single-ended and differential I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Configuration can be performed via JTAG, passive serial (PS), passive parallel synchronous (PPS), or via an external configuration device such as an EPCS or EPCQ flash.
Architecturally, the Stratix II family introduced TriMatrix embedded memory (MLAB/M512/M4K/RAM) and dedicated DSP blocks operating at up to 450 MHz, with each DSP block capable of up to eight 18x18 multipliers. High-speed serial transceivers operate at up to 6.375 Gbps, supporting protocols such as Serial RapidIO, PCI Express, XAUI, and gigabit Ethernet, while the global clock network and up to 16 dedicated clock pins route low-skew clocks across the fabric.
Typical applications for the EP2S130F1020I4RB include telecommunications infrastructure (baseband processing, framer/mapper cards), high-performance ASIC prototyping and emulation, military and aerospace signal processing, broadcast video engines, and high-end industrial imaging. The industrial temperature grade makes it suitable for outdoor telecom, factory automation, and defense platforms with extended thermal envelopes.
When designing with this part, ensure the Quartus II design software (version 6.1 or later, with full support in later releases) is used for synthesis, place-and-route, and timing closure; the 1020-pin FC-FBGA package requires a multilayer PCB with 0.8mm or finer pitch and controlled-impedance routing for high-speed transceiver channels.
This page consolidates distributor pricing, same-package drop-in alternatives from the Stratix II family, and practical design guidance beyond what is available in the original Intel/Altera datasheet, helping procurement and engineering teams evaluate the EP2S130F1020I4RB alongside modern equivalents.
Drop-in alternatives for EP2S130F1020I4RB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1020I4RB (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S130F1020I4N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2S130F1020I4
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP2S130F1020C5NRB
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP2S130F1020C5N
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP2S130F1020C5
✅ Drop-In✓ In Stock
$4100 / Unit
View Datasheet →EP2S130F1020C4RB
✅ Drop-In✓ In Stock
$1310 / Unit
View Datasheet →EP2S130F1020C4N
✅ Drop-In✓ In Stock
$2850 / Unit
View Datasheet →EP2S130F1020C4
✅ Drop-In✓ In Stock
$2800 / Unit
View Datasheet →EP2S130F1020I4RB Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Number of User I/O | 742 |
| Number of Logic Gates | 6,747,840 (equivalent gates) |
| Operating Frequency (Max) | 711.24 MHz |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Package | 1020-pin FC-FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I4 |
| Number of Transceivers | 12 (up to 6.375 Gbps) |
| Embedded Memory | 6,747,840 bits (RAM blocks) |
| Number of PLLs | 4 (up to 16 clock pins) |
| Configuration Mode | JTAG / PS / PPS / EPCS / EPCQ |
| MSL Level | 3 |
EP2S130F1020I4RB 1020-pin fc-fbga Pin Configuration Guide
Pin configuration for EP2S130F1020I4RB (1020-pin fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1020I4RB.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1020I4RB is suitable for 7 applications: Telecommunications Baseband Processing, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Broadcast Video Engine and Image Processing, High-End Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Network Storage and Server Acceleration.
Telecommunications Baseband Processing
The Intel EP2S130F1020I4RB is well suited to telecom baseband and channel-card designs because of its 12 embedded transceiver channels operating at up to 6.375 Gbps, supporting protocols such as Serial RapidIO, XAUI, and gigabit Ethernet. The 132,540 logic elements provide ample capacity for multi-channel PHY/MAC stacks, while the 742 user I/O pins route parallel data buses and backplane interfaces to companion ASICs and DSPs. Industrial temperature rating (-40C to +100C) allows deployment in outdoor base stations and central-office equipment without derating. The 1.2V core voltage simplifies multi-rail power design; transceivers typically draw from a separate 1.4V or 1.5V analog supply via on-chip PLLs.
Recommended
ASIC Prototyping and Emulation
Designers use the EP2S130F1020I4RB as a high-capacity emulation substrate for ASIC prototyping because its 132,540 logic elements (equivalent to ~6.75 million system gates) can hold large synthesizable blocks. Multiple EP2S130 devices can be tiled on a prototyping board using LVDS or SSTL interconnect to emulate multi-million-gate ASICs. The TriMatrix embedded memory serves as on-chip transaction storage, and dedicated DSP blocks accelerate arithmetic-heavy verification. Industrial temperature rating enables lab-to-field transition without thermal rework. Note that Quartus II supports limited Stratix II flows; for modern emulation projects, Stratix IV/V are recommended.
Recommended
Military and Aerospace Signal Processing
The industrial -40C to +100C operating range and the robust 1020-pin FC-FBGA package of the EP2S130F1020I4RB make it suitable for rugged defense electronics, including electronic-warfare subsystems, radar front-end processing, and secure communications. The 12 transceiver channels support high-speed sensor links, while the on-chip DSP blocks perform FFTs, pulse compression, and beamforming in real time. Designers should perform MIL-STD-810 vibration and thermal-shock verification; the FC-FBGA package has known susceptibility to solder-joint fatigue under high-G shock and may require underfill or corner staking in deployable systems.
Recommended
Broadcast Video Engine and Image Processing
The 132,540 logic elements, dedicated DSP blocks, and 6.75 Mbit of embedded memory in the EP2S130F1020I4RB support broadcast-grade video pipelines such as SD/HD/3G-SDI processing, scaling engines, color-space converters, and overlay generators. The 742 user I/O pins accommodate multi-channel parallel video buses plus control interfaces, while 12 transceivers support SDI over SMPTE 2022/Coaxial or DVB-ASI transport streams. Designers should leverage the TriMatrix M-RAM blocks as line buffers to reduce external memory pressure. Industrial temperature rating supports production in outdoor LED walls and broadcast trucks where ambient temperatures can exceed 70C.
Recommended
High-End Industrial Imaging and Machine Vision
Industrial line-scan and area-scan cameras using CoaXPress, Camera Link, or GigE Vision benefit from the EP2S130F1020I4RB's combination of high logic density and embedded transceivers. The 12 transceivers aggregate multiple Camera Link channels or carry a single CoaXPress link at up to 6.25 Gbps, while the on-chip DSP blocks execute real-time image pre-processing (defect detection, color conversion, lens correction) before passing compressed data downstream. The industrial -40C to +100C temperature rating enables placement inside sealed factory housings adjacent to motors or heaters without active cooling.
Recommended
Test and Measurement Instrumentation
The EP2S130F1020I4RB is used in high-channel-count oscilloscopes, logic analyzers, and protocol testers where its 12 transceivers aggregate multi-Gbps serial lanes (PCIe Gen2, SATA, USB 3.0, XAUI) and its 742 user I/O pins expose parallel probe interfaces. The dedicated DSP blocks perform real-time protocol decoding, eye-diagram measurement, and bit-error-rate analysis at line rate. Industrial temperature rating enables deployment in field-test equipment racks. Designers should pay attention to the 1.2V core supply's tolerance to ensure clean analog probing; recommend a low-noise LDO such as the TI TPS7A4701 to power sensitive analog blocks.
Recommended
Network Storage and Server Acceleration
Enterprise storage controllers using the EP2S130F1020I4RB benefit from its high logic density to implement hardware-accelerated RAID engines, deduplication, and TCP/IP offload. The 12 transceivers interface to SAS/SATA 6 Gbps or 10 GbE, while the 742 user I/O pins route DDR2/DDR3 memory channels to external DRAM for large cache tables. Industrial temperature rating supports deployment in data-center top-of-rack switches. Note that modern equivalents (Stratix V, Arria 10, Agilex) deliver higher density-per-watt and on-chip transceivers up to 28 Gbps; new designs should consider migration.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1020I4RB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1020I4N | EP2S130F1020I4 | EP2S130F1020C5NRB | EP2S130F1020C5N |
|---|---|---|---|---|---|
| Package | 1020-pin FC-FBGA | 1020-pin FC-FBGA (same) | 1020-pin FC-FBGA (same) | 1020-pin FC-FBGA (same) | 1020-pin FC-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 132,540 | 132,540 (same) | 132,540 (same) | 132,540 (same) | 132,540 (same) |
| User I/O | 742 | 742 | 742 | 742 | 742 |
| Speed Grade | I4 (industrial) | I4 (same) | I4 (same) | C5 (slower) | C5 (slower) |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Transceivers | 12 (up to 6.375 Gbps) | 12 | 12 | 12 | 12 |
| Packaging Format | Tape & Reel (RB) | Tray (N) | Tray (no suffix) | Tape & Reel (RB) | Tray (N) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial I4 speed grade (-40C to +100C) for harsh-environment deployments (vs EP2S130F1020C5NRB)
- Same-die drop-in availability in tape-and-reel format (vs EP2S130F1020I4)
- Largest Stratix II package exposing all 742 user I/O and 12 transceivers (vs EP2S130F1020C5)
Design Notes
The 1020-pin FC-FBGA package of the EP2S130F1020I4RB requires a multilayer PCB (typically 8+ layers) with 0.8mm ball pitch and via-in-pad (VIP) or microvia technology. Signal integrity for the 12 transceivers operating up to 6.375 Gbps demands controlled-impedance routing (100 ohm differential for serial links) with continuous reference planes and matched-length tuning within 5-10 ps. Designers should follow Intel/Altera Stratix II board design guidelines for stackup, decoupling, and length-matching. Decoupling requires dozens of 0.1 uF and 0.01 uF ceramic capacitors distributed under the BGA, plus bulk 22-47 uF capacitors on each supply rail (VCCINT, VCCIO, VCCA, VCCD_PLL).
At typical high utilization (70-80% logic, all 12 transceivers active, ~50% toggle rate), the EP2S130F1020I4RB can dissipate 6-10 W; under worst-case design conditions this can exceed 12 W. The 1020-pin FC-FBGA exposes the die through the package substrate but typically requires thermal vias to an internal copper plane or a heat-spreader attached with thermal interface material. Without active airflow, the part may exceed its 100C junction limit in enclosed industrial enclosures; a calculated heatsink design or forced-air cooling should be validated with a thermal probe on the package top during bring-up. Industrial temperature range parts (I4) are binned for higher leakage and may consume slightly more power than commercial equivalents.
A frequent issue when bringing up EP2S130F1020I4RB boards is configuring the configuration mode pins (MSEL) incorrectly; the device supports AS, PS, PPS, JTAG, and FPP modes selected by the MSEL[2..0] pins tied to VCCIO or GND. Verify MSEL pin settings match the chosen EPCS/EPCQ configuration flash, otherwise configuration will silently fail. Also note that the Stratix II requires a POR (power-on reset) time of typically 50-100 ms during which the I/O pins are tri-stated; designs sensitive to bus contention should add external pull-ups or sequence-dependent power sequencing. Finally, do not connect VCCA_PLL directly to VCCINT - each PLL has a separate analog supply that should be filtered.
The 12 embedded transceivers in the EP2S130F1020I4RB require their own analog supply (VCCA, typically 1.4V or 1.5V) and must be isolated from the digital core supply by a ferrite bead or filter network to prevent PLL jitter injection. Each transceiver channel pair should be AC-coupled (with 0.01-0.1 uF capacitors) when interfacing to external copper traces or backplane. Differential pair length matching should hold intra-pair skew below 5 ps and inter-pair skew within 50 ps for protocols like XAUI at 3.125 Gbps. Use IBIS-AMI models from Intel (available on request) for channel simulation before tape-out.
Compliance Information
RoHS, REACH, lead-free and halogen-free status were not present in the Verified Web Data for this part; marked as unknown. AEC-Q100 is not applicable (this is an FPGA, not an automotive-grade IC). For automotive deployment, contact Intel for confirmation or migrate to a Stratix IV/V/10 automotive-qualified part.
