EP2A40F672I9 - APEX II FPGA 1.5M Gates 672-FBGA | Intel
MPN: EP2A40F672I9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $210 | $10,500.00 |
| 100 | $188 | $18,800.00 |
| 250 | $165 | $41,250.00 |
EP2A40F672I9 Overview
An FPGA (field-programmable gate array) is a type of programmable logic device that allows engineers to implement custom digital logic circuits after the silicon has been fabricated. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and SPLDs, and are widely used for glue logic, high-speed interfacing, DSP, and prototyping prior to ASIC tape-out. The APEX II family is an older generation of multi-gate FPGAs introduced in the early 2000s for high-density applications.
Key features of the EP2A40F672I9 include 1.5 M system gates, 38,400 logic elements, embedded memory blocks, and support for multiple I/O standards. The device is supplied from a 1.5 V core rail and operates at a maximum internal clock frequency of 366 MHz. It supports in-system programmability via the IEEE 1149.1 JTAG interface, allowing configuration via Altera/Intel Quartus or legacy MAX+PLUS II software. The 672-ball FC-FBGA package is a high-pin-count surface-mount solution suited for high-speed signalling.
The EP2A40F672I9 architecture combines look-up-table (LUT)-based logic, dedicated carry chains for arithmetic, embedded array blocks (EABs) for memory and DSP operations, and a high-speed interconnect fabric. Compared with earlier APEX devices, APEX II introduced higher density and improved routing, enabling single-chip solutions for telecom, networking, and digital-signal-processing systems. The 366 MHz internal performance rating reflects typical register-to-register paths and pipeline-friendly design style.
Typical applications include high-density glue logic in telecom equipment, custom DSP and video/image processing pipelines, network packet processors, industrial control and instrumentation front-ends, and prototype ASICs that require rapid design iteration. The 672-ball BGA package provides enough I/O for multi-gigabit parallel buses and multiple memory interfaces.
When designing with this device, ensure proper BGA layout with controlled-impedance traces and matched-length routing for high-speed signals. Power-decoupling, multi-rail sequencing (1.5 V core plus separate VCCIO banks), and thermal management (junction temperatures under the industrial grade range) are critical to reliability. Configuration memory planning and JTAG chain design must follow Intel/Altera application guidance. This page synthesizes distributor pricing, the APEX II family cross-reference, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2A40F672I9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F672I9 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F672I8
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2A40F672I8N
✅ Drop-In✓ In Stock
$1145 / Unit
View Datasheet →EP2A40F672I7
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP2A40F672I-9
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP2A40F672I7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F672I9 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements / Cells | 38,400 cells |
| System Gates | 1.5 M |
| Process Technology | 0.15 µm CMOS |
| Maximum Internal Frequency | 366 MHz |
| Core Supply Voltage | 1.5 V |
| Package | 672-pin FC-FBGA |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I) |
| Programming Interface | IEEE 1149.1 JTAG |
| Configuration Memory | SRAM-based, in-system programmable |
| Design Tool Support | Quartus / MAX+PLUS II |
| Device Marking Suffix Decode | I = Industrial grade; 9 = speed grade 9 |
EP2A40F672I9 672-pin fc-fbga Pin Configuration Guide
Pin configuration for EP2A40F672I9 (672-pin fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F672I9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F672I9 is suitable for 7 applications: Telecom Backplane Glue Logic, Custom DSP and FIR Filter Pipelines, Industrial Control and Instrumentation, Video and Image Processing Front-Ends, Network Packet Processor Bridging, ASIC Prototyping and Pre-Silicon Validation, Legacy System Sustainment and Drop-In Replacement.
Telecom Backplane Glue Logic
The EP2A40F672I9's 1.5 M system gates, 38,400 logic cells, and 366 MHz internal performance make it well suited to high-density glue logic between telecom backplane ASICs and processors. The 672-ball FC-FBGA exposes enough I/O for multi-gigabit parallel TDM buses and 32-bit/64-bit datapath bridging. Compared with a CPLD, this APEX II part provides four orders of magnitude more logic and dedicated carry chains for parity/CRC generation. Engineers typically place the device between a framer IC and a network processor, running at 100-200 MHz with deep pipelining.
Recommended
Custom DSP and FIR Filter Pipelines
The APEX II embedded array blocks (EABs) and fast carry chains allow the EP2A40F672I9 to implement multi-tap FIR filters, correlators, and FFT butterflies efficiently. At 366 MHz Fmax, designs targeting 100-150 MHz sample rates are comfortable with the timing margin. The 1.5 M gates can absorb several parallel filter instances, while the industrial temperature grade supports outdoor base-station deployments. Power is dominated by toggle rate; estimate thermal budgets using 1.5 V × Icc at the worst-case clocking pattern.
Recommended
Industrial Control and Instrumentation
Industrial-grade temperature qualification (-40 °C to +100 °C ambient) and 38,400 logic cells make the EP2A40F672I9 appropriate for programmable logic controllers, motor-control front-ends, and process-instrumentation signal chains. The 672-ball FC-FBGA package supports parallel ADC/DAC buses, encoder interfaces, and EtherCAT/Ethernet MAC glue. Designs typically use the JTAG port for in-system updates during commissioning and field service. Compared with microcontrollers, this FPGA delivers deterministic latency on parallel datapaths that CPUs cannot match.
Recommended
Video and Image Processing Front-Ends
The EP2A40F672I9 supports parallel RGB/YCbCr video pipelines with on-the-fly color-space conversion, scaling, and gamma correction. With 1.5 M gates, a designer can implement multi-tap 2-D filters and frame-rate conversion logic on a single chip. The 672-ball FC-FBGA provides ample I/O for 24/30/36-bit parallel video buses plus DDR memory interfaces for line buffers. Operating at 366 MHz internal, the device can drive 720p/1080p processing at the required pixel-clock rates with comfortable margins.
Recommended
Network Packet Processor Bridging
Bridging between network processors and PHY/MAC layers requires fast lookup engines, checksum offload, and protocol-format conversion — exactly the workload the EP2A40F672I9's 1.5 M gates can absorb. The 672-ball FC-FBGA exposes enough pins for 4 × 1 Gbps Ethernet MACs plus SPI/PCI host interfaces. Industrial temperature grade makes it suitable for outdoor cell-site routers. Designs typically instantiate CAM-based classifiers using EABs and run them at 100-150 MHz for wire-speed lookups.
Recommended
ASIC Prototyping and Pre-Silicon Validation
Before committing to an ASIC tape-out, design teams use the EP2A40F672I9 as a prototyping vehicle to validate RTL against real-world I/O and timing. The 1.5 M gates accommodate multi-million-gate ASIC partitions broken into clock-domain islands, and JTAG-based debug accelerates bring-up. Industrial temperature grade supports automotive and industrial customer demos. The 672-ball FC-FBGA exposes enough I/O for emulating high-pin-count ASICs; for larger ASICs, multiple APEX II devices can be bridged.
Recommended
Legacy System Sustainment and Drop-In Replacement
Many defense, aerospace, and industrial systems designed in the early 2000s use APEX II FPGAs as their main logic engine. The EP2A40F672I9 and its speed-grade variants (I8, I7) form a drop-in family for sustaining these systems when the original parts become unrepairable. Because the 672-ball FC-FBGA footprint is shared across the family, board re-spin is unnecessary. Designers should perform timing re-verification when downgrading from speed grade 9 to 7/8.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F672I9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F672I8 | EP2A40F672I8N | EP2A40F672I7 | EP2A40F672I-9 | EP2A40F672I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA | 672-pin FC-FBGA |
| Speed Grade | 9 | 8 | 8 | 7 | 9 | 7 |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Lead-Free (N suffix) | No | No | Yes | No | No | Yes |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Process Technology | 0.15 µm | 0.15 µm | 0.15 µm | 0.15 µm | 0.15 µm | 0.15 µm |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Identical die and 672-pin FC-FBGA footprint as speed-grade-9 alternatives (vs EP2A40F672I8)
- Drop-in compatibility with N-suffix lead-free variants (vs EP2A40F672I8N)
- Same APEX II die as commercial-temperature variants (vs EP2A40F672C9)
- Higher logic density per package than APEX 20K predecessors (vs EP20K600CF672)
Design Notes
The 672-pin FC-FBGA requires a high-density PCB with microvia stack-ups (typically 4-6 layers minimum with laser-drilled vias). Matched-impedance routing for high-speed signals (LVDS, SSTL) should be verified with the PCB manufacturer's stack-up calculator. Decoupling: place 0.1 µF X7R ceramics every 10-15 power pins and bulk 10-47 µF tantalums or polymer caps near the BGA edges. Power-rail sequencing (1.5 V core must ramp before VCCIO banks) prevents I/O back-power latch-up.
Estimated: at typical 1.5 V core operation with 50% toggle activity, expect 3-6 W dissipation. With FC-FBGA, the die is flip-chip attached to the package substrate, so θJA is highly board-dependent (typically 8-15 °C/W on a 1 oz 6-layer board with thermal vias). Place thermal via arrays under the BGA land pattern to spread heat into inner copper planes. For sealed enclosures, derate by 1 °C per 200 m above sea level per the APEX II datasheet guidelines.
Do not assume APEX II is supported in modern Quartus Prime releases — pin Quartus II to versions ≤ 13.0 or use MAX+PLUS II for the APEX II flow. Configuration memory is volatile: the bitstream must be reloaded at every power-up via a configuration PROM, JTAG, or microcontroller. The JTAG chain must include proper TCK termination and IR length matching when chaining multiple devices. Speed-grade 7 parts do not meet 366 MHz Fmax — re-run timing analysis when downgrading from speed grade 9.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data; the APEX II family predates many of these compliance requirements. Consult Intel's material declaration or the APEX II datasheet's regulatory section for authoritative compliance values. N-suffix ordering codes typically indicate lead-free finishes.
