EP2AGX260FF35I3NAA - Arria II GX FPGA 260K LE | Altera | BGA
MPN: EP2AGX260FF35I3NAA β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $377.02 | $377.02 |
| 10 | $360 | $3,600.00 |
| 100 | $340 | $34,000.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $305 | $305,000.00 |
EP2AGX260FF35I3NAA Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and (in modern families) high-speed transceivers. FPGAs sit at the same level in the broader taxonomy as ASICs and microcontrollers, but unlike ASICs they can be re-programmed in the field to implement custom digital logic, glue logic, parallel processing pipelines, or even entire soft-core processor systems. The Arria II GX family targets mid-range applications that require a balance of logic density, on-chip memory, and integrated multi-gigabit transceivers without the power and cost of a Stratix-class device.
Key features of the EP2AGX260FF35I3NAA include 8 user I/O banks supporting a wide range of single-ended and differential I/O standards (LVDS, LVPECL, HSTL, SSTL), dedicated DDR2/DDR3 memory controller hard IP, and 6 PLLs for clock management. The device operates across an industrial temperature range of -40C to +100C and supports the FF35 speed grade with I3 (-40C to +100C industrial) designation. The integrated transceivers support protocols including PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, eliminating the need for external PHY chips in many designs.
Typical applications include telecom baseband processing, software-defined radio (SDR), military radar signal processing, video broadcast infrastructure, and high-speed serial protocol bridging. The combination of 244K logic elements with 12 Mbit embedded RAM makes the EP2AGX260 particularly well suited for data path intensive functions such as FFT processing, packet classification, and digital up/down conversion.
When designing with this 1152-ball FBGA device, careful PCB layout with microvia stack-up, matched-length high-speed traces, and a robust power distribution network with multiple decoupling capacitors are mandatory. Thermal management should account for the industrial temperature grade and possible high transceiver utilization.
This page synthesizes distributor pricing, drop-in alternative cross-references within the Arria II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX260FF35I3NAA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX260FF35I3NAA (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX260FF35I3N
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet βEP2AGX260FF35I3G
β Drop-Inβ In Stock
$1985 / Unit
View Datasheet βEP2AGX260FF35C6N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2AGX260FF35C5N
β Drop-Inβ In Stock
$1545 / Unit
View Datasheet βEP2AGX260FF35C4N
β Drop-Inβ In Stock
$3125 / Unit
View Datasheet βEP2AGX260FF35C6G
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2AGX260FF35C5G
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2AGX260FF35C4G
β Drop-Inβ In Stock
$1420 / Unit
View Datasheet βEP2AGX260FF35I3NAA Maximum Ratings & Electrical Characteristics
| Device Family | Arria II GX |
| Logic Elements | 244,188 |
| Embedded Memory Bits | 12,038,144 |
| Hardware Multipliers (18x18) | 612 |
| Package | 1152-ball FBGA (FF35) |
| Speed Grade | I3 (Industrial -40C to +100C) |
| Operating Temperature Range | -40C to +100C |
| Transceivers | Up to 12 channels |
| Max Transceiver Data Rate | 8.5 Gbps |
| User I/O Banks | 8 |
| PLLs | 6 |
| Process Technology | 40 nm TSMC |
| Supply Voltage | 0.9 V core |
| Memory Controller Hard IP | DDR2/DDR3 |
| RoHS Status | Compliant (Lead-free) |
| Mounting Type | Surface Mount |
EP2AGX260FF35I3NAA 1152-ball fbga (ff35) Pin Configuration Guide
Pin configuration for EP2AGX260FF35I3NAA (1152-ball fbga (ff35) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX260FF35I3NAA.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX260FF35I3NAA is suitable for 6 applications: Telecom Baseband Processing, Software Defined Radio (SDR), Military Radar Signal Processing, Video Broadcast Infrastructure, Industrial Machine Vision Inspection, High-Speed Protocol Bridging and Aggregation.
Telecom Baseband Processing
The EP2AGX260FF35I3NAA is a workhorse FPGA for 3G/4G baseband signal processing in telecom infrastructure such as remote radio heads and base station line cards. Its 12 multi-gigabit transceivers up to 8.5 Gbps carry CPRI/OBSAI fronthaul and Serial RapidIO backhaul, while 612 18x18 hardware multipliers and 12 Mbit embedded RAM sustain high-throughput channelization, FFT/IFFT pipelines, and crest-factor-reduction (CFR) processing. The industrial -40C to +100C temperature grade handles outdoor cabinet deployment. Quartus II platform designer integrates CPRI and Serial RapidIO IP cores, eliminating external serializer/deserializer chips and reducing BOM cost.
Recommended
Software Defined Radio (SDR)
The EP2AGX260FF35I3NAA delivers the parallel DSP horsepower required for wideband software-defined radio platforms used in defense, public-safety, and spectrum-monitoring applications. With 244,188 logic elements and 612 hardware multipliers, it implements multi-channel DDC/DUC, polyphase filter banks, and digital down-conversion for RF bandwidths exceeding 100 MHz. The 12 embedded transceivers support direct ADC/DAC interfacing at sample rates up to 8.5 Gbps. Industrial temperature rating suits vehicle-mounted and field-deployable SDR enclosures. Quartus II DSP Builder accelerates MATLAB-to-FPGA workflow for algorithm iteration.
Recommended
Military Radar Signal Processing
Radar signal processing demands the combination of high logic density, large on-chip memory, and deterministic latency that the EP2AGX260FF35I3NAA provides. The 12 Mbit embedded RAM holds range-Doppler maps in real time, while 612 multipliers perform pulse compression, MTI filtering, and beamforming math. The I3 industrial speed grade and 40 nm TSMC process deliver proven reliability for military platforms. Integrated transceivers at 8.5 Gbps connect to high-speed ADC/DAC daughter cards used in phased-array antennas. The FF35 1152-ball FBGA supports ruggedized conformal-coated PCB stacks.
Recommended
Video Broadcast Infrastructure
Broadcast video routers, contribution encoders, and 3G-SDI/12G-SDI infrastructure rely on FPGAs like the EP2AGX260FF35I3NAA to handle uncompressed 4K/UHD video multiplexing, format conversion, and JPEG-XS or MPEG compression. The 244,188 logic elements sustain multiple 12G-SDI data paths concurrently, and 12 multi-gigabit transceivers drive 12G-SDI copper and fiber interconnects. On-chip DDR3 hard controllers pair with external RDRAM/RLDRAM for line-buffer storage. The industrial temperature grade ensures operation in central apparatus rooms without active cooling.
Recommended
Industrial Machine Vision Inspection
Multi-camera industrial inspection lines use the EP2AGX260FF35I3NAA as the central image-acquisition and pre-processing hub. CoaXPress or Camera Link interfaces ingest 4-8 high-resolution camera streams at multi-gigabit rates using the on-chip transceivers, while 612 hardware multipliers accelerate Bayer demosaicing, edge detection, and convolutional filter preprocessing in real time. The 12 Mbit embedded RAM buffers full HD frames without external memory contention. Industrial -40C to +100C operation handles shop-floor temperature swings; the FF35 BGA is well suited to high-density PCB designs common in PoE-powered smart cameras.
Recommended
High-Speed Protocol Bridging and Aggregation
Enterprise and carrier networks require protocol bridges between Ethernet, PCI Express, Serial RapidIO, and custom backplanes - a core use case for the EP2AGX260FF35I3NAA. The 12 embedded transceivers at 8.5 Gbps simultaneously support 10 Gigabit Ethernet (XAUI/10GBase-R), PCIe Gen1/Gen2 endpoints/root ports, and SRIO links. Hard IP blocks reduce latency below equivalent soft-core implementations. Industrial temperature grade suits carrier-grade network appliances and outdoor small cells. Quartus II IP catalog includes certified PCIe and 10G Ethernet cores with hardware evaluation boards for rapid prototyping.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX260FF35I3NAA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX260FF35I3N | EP2AGX260FF35I3G | EP2AGX260FF35C6N | EP2AGX260FF35C5N | EP2AGX260FF35C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-ball FBGA (FF35) | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same |
| Speed Grade | I3 (Industrial) | I3 (Industrial) | I3 (Industrial) | C6 (Commercial) | C5 (Commercial) | C4 (Commercial) |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| Embedded Memory | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits | 12,038,144 bits |
| Hardware Multipliers | 612 | 612 | 612 | 612 | 612 | 612 |
| Transceivers | 12 ch up to 8.5 Gbps | 12 ch up to 8.5 Gbps | 12 ch up to 8.5 Gbps | 12 ch up to 8.5 Gbps | 12 ch up to 8.5 Gbps | 12 ch up to 8.5 Gbps |
Key Differentiators
- Highest-density Arria II GX member with 244,188 logic elements and 12 Mbit embedded memory (vs EP2AGX190FF35I5N)
- 12 multi-gigabit transceivers up to 8.5 Gbps with hard PCIe Gen2/SRIO/CPRI IP (vs EP2AGX125EF35I5G)
- Industrial -40C to +100C I3 speed grade versus commercial 0C to +85C C6 variant (vs EP2AGX260FF35C6N)
Design Notes
The 1152-ball FF35 FineLine BGA exposes only ~70% of the die to PCB thermal vias through the center array; thermal dissipation is highly dependent on inner-ball via patterns. For continuous transceiver operation above 6 Gbps, place a thermal via array (0.2 mm pitch, 0.5 mm drill) directly under the BGA central thermal balls and stitch to a large inner-plane copper pour. Reference Altera application note AN-358-1 for FF35 thermal ball mapping. Without thermal vias, junction temperature may exceed 100C at industrial upper ambient.
The 1152-ball FF35 package uses a 1.0 mm ball pitch. PCB stack-up must use microvia (laser-drilled) technology with at least 4-6 routing layers to break out the center array. Use an ENIG or immersion-silver surface finish to ensure reliable BGA solder joint formation. Reference the Altera Arria II GX Device Handbook Pin-Out file and AN-528 for recommended PCB stack-ups and decoupling capacitor placement. Matched-length (within 150 mil) impedance-controlled routing is mandatory for transceiver channels above 5 Gbps.
The EP2AGX260FF35I3NAA requires multiple supply rails: 0.9V core, 1.1V PLL, 1.5V/1.8V/2.5V/3.0V I/O, and dedicated 1.0V/1.2V transceiver analog supplies. Use a sequenced power-up controller such as the LTC2923 to enforce Altera's required power-on sequence (core before I/O before transceivers). Bulk decoupling of 330 uF polymer per rail plus 0.1 uF/0.01 uF/0.001 uF ceramic capacitor networks within 100 mil of every BGA power pin is essential. Inrush current can exceed 8 A at cold-start.
Differential transceiver channel traces must be length-matched to within 5 mil and routed with 85-100 ohm differential impedance on the top layer with a continuous ground reference plane beneath. Avoid crossing transceiver pairs with noisy digital signals; route them on dedicated layers separated by ground planes. The transceiver reference clocks require 100 ohm differential routing and isolated guard traces. The 8 user I/O banks each have independent voltage references; group I/O standards within a bank and provide dedicated VREF decoupling when using HSTL/SSTL.
Do not populate the EP2AGX260FF35I3NAA without first verifying that your Quartus II version supports the FF35 package and I3 speed grade; older Quartus versions (10.0 and earlier) lack the FF35 pin-out file. Configuration mode (JTAG, AS, PS, FPP) must be selected correctly via MSEL pins; incorrect MSEL strapping prevents configuration. Do not reuse configuration flash binary built for a different package - the bitstream is package-aware and a mismatched bitstream can cause configuration errors or non-functional I/O.
Compliance Information
RoHS compliant per Electronics-Diodes and Altera-Price product listings (Lead free / RoHS Compliant). AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC in the AEC-Q100 sense. Conflict minerals status reported compliant by Altera.
