EP2C70F896I8 - Cyclone II FPGA, 70K LEs, 622 I/O, 896-BGA | Altera
MPN: EP2C70F896I8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $417.61 | $417.61 |
| 10 | $387 | $3,870.00 |
| 50 | $355 | $17,750.00 |
| 100 | $320 | $32,000.00 |
| 250 | $295 | $73,750.00 |
EP2C70F896I8 Overview
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor whose logic fabric is defined by a user-supplied bitstream rather than fixed during fabrication. Within the broader hierarchy, the EP2C70F896I8 sits as follows: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Cyclone II devices specifically address the gap between fixed-function ASICs and high-density FPGAs by balancing logic capacity, embedded multipliers, and on-chip memory at low unit cost.
Key features of the EP2C70F896I8 include up to 622 user I/O pins organized across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, four phase-locked loops (PLLs) for clock management, embedded multipliers (18x18) for DSP-style arithmetic, and dedicated configuration circuitry supporting multiple boot modes. The device also offers dedicated external memory interfaces and a JTAG boundary-scan chain for board-level test.
Architecturally, the Cyclone II device combines logic array blocks (LABs), embedded memory blocks (M4K RAM), embedded multipliers, and programmable routing channels. The 90 nm process enables high logic density at low static power consumption, while the 1.2 V core supply keeps total power budgets tractable for portable and embedded designs. The 896-BGA package provides ample signal and power pin allocation for high-utilization designs.
Typical applications include industrial motor control, video processing pipelines, software-defined radio front ends, automotive infotainment prototypes, and PCIe endpoint prototyping. The combination of embedded multipliers and on-chip memory is particularly well suited to digital filter and FFT implementations in DSP subsystems.
When designing with this device, pay close attention to decoupling capacitor placement around the BGA power pins and verify that the Quartus II design software supports the target configuration scheme. Note that Cyclone II is a legacy family: confirm long-term availability through authorized distributors before committing to new production runs.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone II family, and practical design notes that go beyond the manufacturer datasheet to support engineering decisions.
Drop-in alternatives for EP2C70F896I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C70F896I8 (same form factor and footprint) — differing in Package, Process Technology, RoHS Status, Operating Temperature, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C70F896I7N
✅ Drop-In✓ In Stock
$95.4 / Unit
View Datasheet →EP2C70F896C8N
✅ Drop-In✓ In Stock
$189.55 / Unit
View Datasheet →EP2C70F896C8
✅ Drop-In✓ In Stock
$225 / Unit
View Datasheet →EP2C70F896C7N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2C70F896C7
✅ Drop-In✓ In Stock
$268.75 / Unit
View Datasheet →EP2C70F896C6N
✅ Drop-In✓ In Stock
$274.8 / Unit
View Datasheet →EP2C70F896I8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements | 68,416 |
| Logic Array Blocks (LABs) | 4,276 |
| Embedded Memory | 1,152,000 bits (1152 Kbit) |
| Total RAM Bits | 1152000 |
| User I/O Pins | 622 |
| Number of CLBs | 4276 |
| Package | 896-BGA (FBGA-896) |
| Supply Voltage (Core) | 1.2 V |
| Logic Family | CMOS |
| Process Technology | 90 nm |
| Number of PLLs | 4 |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Speed Grade | 8 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Lead-Free | Yes |
EP2C70F896I8 896-bga (fbga-896) Pin Configuration Guide
Pin configuration for EP2C70F896I8 (896-bga (fbga-896) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C70F896I8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C70F896I8 is suitable for 7 applications: Industrial Motor Control, Video Processing Pipeline, Software-Defined Radio Front End, PCIe Endpoint Prototyping, Automotive Infotainment Prototyping, Embedded DSP and Filter Implementations, Test and Measurement Instrumentation.
Industrial Motor Control
The EP2C70F896I8's 68,416 logic elements and embedded 18x18 multipliers make it well suited to field-oriented control (FOC) and space-vector PWM generation for three-phase motor drives. With 622 user I/O pins, the device can simultaneously interface multiple encoder inputs, Hall sensors, and high-side/low-side gate-driver channels. Industrial temperature rating (-40°C to +85°C) supports factory-floor deployment. Place decoupling within 5 mm of every BGA power pin and follow Cyclone II board-layout guidelines for the 896-BGA.
Recommended
Video Processing Pipeline
The EP2C70F896I8 integrates 1,152,000 bits of M4K RAM, enough to buffer several video lines in a real-time scaling or de-interlacing pipeline. With 622 user I/O pins in the 896-BGA, the device can drive LVDS video links, BT.656/1120 parallel buses, and HDMI/DVI bridge chips simultaneously. Embedded 18x18 multipliers handle 2D FIR filtering and chroma interpolation at common video rates. The industrial temperature grade allows chassis-internal and outdoor kiosk deployment.
Recommended
Software-Defined Radio Front End
The Cyclone II architecture's combination of embedded multipliers and ample logic density makes the EP2C70F896I8 an effective platform for SDR digital down-conversion, channelization, and baseband processing. Four PLLs generate the multiple clock domains required by ADC/DAC sample rates and FPGA fabric. The 622 user I/O pins route high-speed LVDS data from dual-channel ADCs to internal FFT and demodulator blocks. Industrial temperature rating suits portable/military radio enclosures.
Recommended
PCIe Endpoint Prototyping
The EP2C70F896I8 supports embedded PCIe hard IP on certain package variants, enabling rapid prototyping of PCIe endpoint cards in FPGA form factor. The 622 user I/O pins expose multiple SerDes-capable banks, while 4 PLLs drive the 100 MHz reference and derived application clocks. Designers should verify PCIe block availability for the F896 package via the Cyclone II device handbook before allocating board real-estate to the edge connector.
Recommended
Automotive Infotainment Prototyping
Although the EP2C70F896I8 is industrial-grade rather than AEC-Q100 qualified, its 70K logic capacity is useful for prototyping CAN/LIN gateway logic, instrument-cluster graphics, and audio DSP before committing to a hard ASIC. The 1,152,000 embedded RAM bits accommodate frame buffers and audio sample rings. For production automotive programs, migrate to Cyclone IV or Cyclone V with AEC-Q100 qualification.
Recommended
Embedded DSP and Filter Implementations
The EP2C70F896I8's embedded 18x18 multipliers and configurable M4K RAM blocks make it efficient for FIR, IIR, and FFT implementations. With 1,152,000 embedded memory bits, the device can hold hundreds of filter coefficients and several lines of working data, reducing external memory pressure. Industrial temperature rating allows deployment in outdoor DSP sensor modules. Use the dedicated PLL outputs to align ADC sampling with internal DSP clock domains.
Recommended
Test and Measurement Instrumentation
With 622 user I/O pins and 4 PLLs, the EP2C70F896I8 can implement multi-channel logic analyzer capture, pattern generator timing engines, and protocol-aware test fixtures. The 1,152,000 embedded memory bits store capture buffers and pattern tables, while the industrial temperature range supports laboratory and production-floor environments. Quartus II tool flow supports boundary-scan via JTAG for board-level test integration.
Recommended
Recommended Products Summary
Engineering reference data for EP2C70F896I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C70F896I7N | EP2C70F896C8N | EP2C70F896C8 | EP2C70F896C7N | EP2C70F896C7 | EP2C70F896C6N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 896-BGA | 896-BGA - same | 896-BGA - same | 896-BGA - same | 896-BGA - same | 896-BGA - same | 896-BGA - same |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 | 68,416 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 8 | 7 (slower) | 8 (same) | 8 (same) | 7 (slower) | 7 (slower) | 6 (slowest) |
| Embedded Memory (bits) | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 |
| User I/O Pins | 622 | 622 | 622 | 622 | 622 | 622 | 622 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lead-Free / RoHS | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Same 896-BGA footprint across all 6 drop-in alternatives (vs EP2C70F672I8 (672-BGA))
- Industrial temperature range versus commercial temperature alternatives (vs EP2C70F896C8N (commercial))
- Same '8' speed grade as commercial alternatives but with industrial rating (vs EP2C70F896C8N (commercial, same speed grade))
Design Notes
Estimated: For the 896-BGA EP2C70F896I8, place at least one 0.1 uF decoupling capacitor within 5 mm of every BGA power ball, plus a 10 uF bulk capacitor per power rail. Use 4-layer PCB stack-up with continuous power and ground planes under the BGA to provide low-impedance return paths. Follow the Cyclone II board-layout guidelines in the device handbook for via-in-pad construction and BGA escape routing rules.
Do not confuse EP2C70F896I8 with EP2C70F672I8 - both are Cyclone II 70K devices in the I8 speed grade, but they use different packages (896-BGA vs 672-BGA) with different pinouts and are NOT drop-in compatible. Also note that 'I' denotes industrial temperature range; 'C' denotes commercial. Choosing the wrong temperature grade for an outdoor deployment can cause field failures.
The 622 user I/O pins of the EP2C70F896I8 are organized into multiple I/O banks with independent voltage references. Per the Cyclone II datasheet, each bank supports a different mix of LVTTL, LVCMOS, SSTL, and HSTL standards; mixing incompatible standards in a single bank can damage the device. Route high-speed LVDS pairs with matched lengths (delta < 50 mil) and 100 ohm differential impedance for reliable signaling.
Estimated: For typical designs utilizing 50-70% of the EP2C70F896I8's logic and memory resources at 100 MHz toggle rate, expect roughly 1-2 W of dynamic power dissipation. The 896-BGA exposes the die through the substrate, so thermal dissipation via the PCB is generally adequate without an external heatsink. For high-utilization industrial deployments in enclosed chassis, verify junction temperature using the Altera PowerPlay Early Power Estimator.
Compliance Information
RoHS compliant per Altera product page. Industrial temperature range but not AEC-Q100 qualified - not suitable for automotive production programs without qualification. REACH and conflict minerals status not explicitly stated in verified data.
