Intel

EP2C70F896I7N - Cyclone II FPGA, 68K LE, 896-BGA | Intel

MPN: EP2C70F896I7N ✗ End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss LVDS, LVTTL, LVCMOS, SSTL, HSTL Rds(on) 896-ball FineLine BGA (FBGA-896) Package 1,152 Kbits (250 M4K blocks) Memory
From $95.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $142 $142.00
10 $128.5 $1,285.00
100 $115.2 $11,520.00
500 $102.8 $51,400.00
1,000 $95.4 $95,400.00
ℹ️ All prices are in USD

EP2C70F896I7N Overview

The Intel (formerly Altera) EP2C70F896I7N is a high-density Cyclone II Field-Programmable Gate Array (FPGA) housed in a 896-ball FineLine BGA package, providing 68,416 logic elements, 250 M4K RAM blocks, and 150 embedded 18x18 multipliers for low-cost, high-volume digital logic integration. Built on a 90-nm CMOS process and operating from a 1.2 V core supply with multi-standard I/O banks, the device targets price-sensitive DSP, communications, and embedded-control applications.

A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, routing, and I/O can be configured by the user after manufacture. FPGAs sit between fixed-function ASICs and software-defined processors, offering hardware-level parallelism for DSP pipelines, custom bus interfaces, and protocol bridging. The Cyclone II family specifically targets the "low-cost FPGA" tier - it sacrifices the highest-speed transceivers of Stratix devices in exchange for a unit price that enables consumer, industrial, and educational deployment at scale.

Key features of the EP2C70F896I7N include 4,300 logic array blocks (LABs), 1,152 Kbits of embedded M4K RAM for on-chip buffering, dedicated DSP blocks supporting up to 150 18x18 multipliers for high-throughput MAC operations, and a flexible PLL-based clock network supporting LVDS, LVTTL, SSTL, and HSTL I/O standards. The 'I7' suffix denotes the industrial temperature grade (-40 C to +100 C junction) and the 'N' indicates lead-free / Pb-free termination.

Architecturally, the Cyclone II device pairs a four-input look-up-table (LUT)-based logic element with adjacent register and carry chain, allowing efficient implementation of arithmetic, register, and state-machine functions. Memory blocks (M4K) are true dual-port with parity and byte-enable support, and the DSP blocks implement dedicated multiply-accumulate (MAC) primitives that exceed general-purpose fabric throughput for filters and FFTs.

Typical applications include digital signal processing (DSP co-processors, motor control), industrial communications (PROFIBUS, EtherCAT, CAN bridging), video processing (display controllers, image preprocessing), and embedded system integration (custom microcontrollers, bus bridges). The wide logic capacity also suits firmware prototyping and ASIC emulation.

When designing with this part, plan I/O bank assignments early - each bank has its own VCCIO rail and supports a limited mix of standards. Use Altera/Intel Quartus II (legacy 13.0 service pack) for synthesis, place-and-route, and timing closure, and verify that 1.2 V core and 1.5 V/1.8 V/2.5 V/3.3 V VCCIO rails are sequenced per Cyclone II handbook guidance.

This page synthesizes distributor pricing, same-package Cyclone II drop-in alternatives, and practical FPGA bring-up design notes that are not consolidated in any single source.

Drop-in alternatives for EP2C70F896I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C70F896I7N (same form factor and footprint) — differing in Package, Process Technology, RoHS Status, Operating Temperature, Configuration Modes.

Intel
Package: 896-ball FBGA (FineLine BGA), 31x31 mm
Configuration Modes: Passive Serial (PS), Active Serial (AS), JTAG
Compare with EP2C70F896I7N →
Intel
Package: 896-ball FBGA
Process Technology: 90 nm low-k CMOS
Operating Temperature: 0C to +85C (commercial)
Compare with EP2C70F896I7N →
Intel
Package: FBGA-896
Configuration Modes: AS, PS, JTAG
Compare with EP2C70F896I7N →
Intel
Process Technology: 90 nm CMOS SRAM
Operating Temperature: Commercial (0C to +85C)
Compare with EP2C70F896I7N →
Altera
Package: 896-FBGA (FineLine BGA)
Process Technology: 90 nm low-k CMOS
RoHS Status: RoHS Compliant
Compare with EP2C70F896I7N →
Altera
Package: 896-BGA (FBGA-896)
Process Technology: 90 nm
Operating Temperature: -40°C to +85°C (Industrial)
Compare with EP2C70F896I7N →
Intel
Package: 896-ball FBGA
Process Technology: 90 nm
RoHS Status: Compliant (lead-free)
Compare with EP2C70F896I7N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2C70F896I8N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 896-ball FBGA
Cyclone II · Intel (formerly Altera) · 68,416 · 1,152,000 bits (4,608 Kbits via M9K blocks) · 150 · 4 · 622 · 1.2 V

✓ In Stock

$198 / Unit

View Datasheet →

EP2C70F896C8N

✅ Drop-In ⚠️ 参数待验证
Altera
📦 896-ball FBGA
Cyclone II · Cyclone II · 68,416 · 1,152,000 bits · 622 · 68,416 · 150 (18x18) · 4

✓ In Stock

$189.55 / Unit

View Datasheet →

EP2C70F896C7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 896-ball FBGA
Cyclone II · Intel (formerly Altera) · 68,416 · 4,276 · 1,152,000 · 150 · 622 · 4

✓ In Stock

$175 / Unit

View Datasheet →

EP2C70F896C8

✅ Drop-In ⚠️ 参数待验证
Intel
📦 896-ball FBGA
Cyclone II · Intel (formerly Altera) · 68,416 · 1,152,000 · 622 · 4536 · 90 nm CMOS SRAM · 1.2 V

✓ In Stock

$225 / Unit

View Datasheet →

EP2C70F896C7

✅ Drop-In ⚠️ 参数待验证
Intel
📦 896-ball FBGA
Cyclone II · 68,416 · 1,152,000 · 150 · 622 · 896-ball FBGA · C7 (commercial, slowest) · 1.2 V

✓ In Stock

$268.75 / Unit

View Datasheet →

EP2C70F896C6N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 896-ball FBGA
Cyclone II · 68,416 · 4,276 · 1,152,000 bits · 250 · 150 · 622 · 4

✓ In Stock

$274.8 / Unit

View Datasheet →

EP2C70F896I7N Maximum Ratings & Electrical Characteristics

Family Cyclone II
Logic Elements (LE) 68,416
Logic Array Blocks (LAB) 4,300
Embedded Memory 1,152 Kbits (250 M4K blocks)
Embedded 18x18 Multipliers 150
Maximum User I/O Pins 622
PLLs 4
Package 896-ball FineLine BGA (FBGA-896)
Supply Voltage - Core 1.2 V
Process Technology 90 nm CMOS
Operating Temperature Grade Industrial (-40 C to +100 C junction)
Lead-Free / Pb-Free Yes (N suffix)
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL
Configuration Active serial (EPCS), passive serial, JTAG
RoHS Status Compliant

EP2C70F896I7N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — General-purpose user I/O, bank 1
Pin B1 I/O — General-purpose user I/O, bank 1
Pin C1 I/O — General-purpose user I/O, bank 1
Pin D1 VCCIO1 — I/O bank 1 supply
Pin E1 GND — Ground
Pin F1 I/O — General-purpose user I/O, bank 2
Pin G1 I/O — General-purpose user I/O, bank 2
Pin H1 I/O — General-purpose user I/O, bank 2

Typical Applications

EP2C70F896I7N is suitable for 6 applications: DSP Co-Processor / Filter Acceleration, Industrial Motor Control, Video / Image Preprocessing Pipeline, Custom Bus Bridge / Protocol Converter, ASIC Emulation and Prototyping, Embedded Industrial Controller / Soft MCU.

🎧

DSP Co-Processor / Filter Acceleration

The EP2C70F896I7N is well matched to DSP co-processing roles where a host processor offloads MAC-intensive kernels. Its 150 dedicated 18x18 hardware multipliers deliver sustained throughput for FIR/IIR filters, FFTs, and matrix math that an MCU alone cannot achieve, while the 250 M4K RAM blocks (1,152 Kbits) hold coefficient tables and overlap windows without external buffering. In a typical pipeline, the host writes samples to a mailbox buffer, the FPGA computes the kernel block-by-block, and DMA returns results. Compared with a DSP-only MCU, the FPGA achieves roughly 5-10x higher sample rates on 256-tap FIRs at the same clock. Quartus II's DSP Builder integration lets designers drop in Simulink blocks that synthesize directly into the Cyclone II DSP blocks.

🏭

Industrial Motor Control

The EP2C70F896I7N's industrial temperature grade (-40 C to +100 C junction), combined with 622 user I/O pins for parallel feedback sampling, suits three-phase motor drive control loops. The 150 18x18 multipliers execute Park/Clarke transforms and PI controllers at switching frequencies above 50 kHz, while the 4 PLLs generate precisely phased PWM carriers per inverter leg. Hardware encoder counters can be implemented in soft IP to decode quadrature signals at sub-microsecond latency. The 896-ball FBGA supports the high I/O count required for multi-axis drives (typically 24-36 PWMs plus 6-12 feedback channels). When paired with gate drivers and isolated current shunts, the FPGA replaces a DSP + microcontroller pair at lower BOM cost.

🎥

Video / Image Preprocessing Pipeline

Video preprocessing benefits from the EP2C70F896I7N's parallel logic and on-chip memory. The 250 M4K blocks (1,152 Kbits) implement line buffers for 720p/1080p pipelined video without external SRAM, and the 150 hardware multipliers accelerate convolution kernels for edge detection, color space conversion, and noise reduction. LVDS-capable pins pair directly with CMOS image sensors and DSI/CSI receivers. In a typical camera module, the FPGA bridges between sensor, image signal processor, and host MCU, offloading pixel-rate tasks the MCU would starve on. Quartus II's VIP suite provides standard blocks (Sobel, median, gamma correction) that map efficiently to Cyclone II DSP blocks.

🌐

Custom Bus Bridge / Protocol Converter

When system architects need to bridge legacy or proprietary buses (PROFIBUS, EtherCAT, CAN, I2C, SPI, parallel ADC/DAC) to a host CPU, the EP2C70F896I7N provides the logic and I/O flexibility to implement custom soft peripherals. With 622 user I/Os, the device can attach to wide parallel buses and multiple serial channels concurrently, while the 4 PLLs generate precise clock domains for each bus. Industrial users frequently implement PROFIBUS-DP slaves or EtherCAT slave controllers entirely in the FPGA, eliminating the need for a dedicated ASIC. The 1.2 V core and adjustable VCCIO per bank allow mixed-voltage interfacing (3.3 V logic on one bank, 1.8 V on another).

🖥️

ASIC Emulation and Prototyping

Engineers use the EP2C70F896I7N as an ASIC prototyping platform because the 68,416 logic elements provide enough capacity to map mid-complexity ASIC RTL before committing to silicon. The 150 multipliers and 1,152 Kbits of RAM allow pre-silicon validation of DSP-heavy or memory-heavy designs at near-ASIC clock rates. Quartus II's incremental compilation lets teams partition large designs by function block, shortening iteration cycles. The industrial temperature grade also supports in-vehicle prototyping where lab-temperature parts would not be representative. Multiple EP2C70 boards can be paralleled with high-speed LVDS links for very large emulation targets.

🧩

Embedded Industrial Controller / Soft MCU

A Cyclone II EP2C70F896I7N can implement one or more soft microcontrollers (Nios II/e or Nios II/f) along with custom peripherals, replacing a discrete MCU in space-constrained or functionally-rich designs. The 68,416 LE accommodate a Nios II/f core plus Ethernet MAC, UART, SPI, and PWM peripherals with substantial logic headroom. This approach lets designers add or remove peripherals per board variant by changing the FPGA bitstream alone. The 4 PLLs generate the CPU clock plus peripheral clocks from a single crystal. Industrial users value the deterministic Nios II timing, which is easier to certify than software-only solutions for safety-critical systems.

Recommended Products Summary

EPCS16SI16N 16-Mbit serial configuration flash for Cyclone II FPGA boot Used in: DSP Co-Processor / Filter Acceleration, Video / Image Preprocessing Pipeline, Embedded Industrial Controller / Soft MCU EP2C35F484C8N Intel Used in: DSP Co-Processor / Filter Acceleration EPCS64SI16N 64-Mbit configuration flash for large FPGA bitstreams with motor-control soft IP Used in: Industrial Motor Control, Custom Bus Bridge / Protocol Converter EP2C5F256I8N Intel Used in: Industrial Motor Control EP2C35F672C8N Altera Used in: Video / Image Preprocessing Pipeline EP2C20F484C8N Altera Used in: Custom Bus Bridge / Protocol Converter EPCS128SI16N 128-Mbit configuration flash for large multi-block bitstreams Used in: ASIC Emulation and Prototyping EP2AGZ300FF35I4N Intel Used in: ASIC Emulation and Prototyping EP2C50F484C8N Intel Used in: Embedded Industrial Controller / Soft MCU
What is the logic element count of EP2C70F896I7N?
The EP2C70F896I7N contains 68,416 logic elements organized into 4,300 logic array blocks (LABs). According to the Altera Cyclone II Device Handbook (CII51001-3.2), this is the largest member of the Cyclone II family, positioned between the EP2C50 and the discontinued Cyclone III mid-density tiers for high-volume logic integration.
Does EP2C70F896I7N require a heatsink at full utilization?
Estimated: At a 1.2 V core supply and typical dynamic current of approximately 1.5 A under full logic utilization, the device dissipates roughly 1.8 W. Combined with the BGA-896 thermal resistance of approximately 16 C/W (theta_JB), the junction rises about 29 C above board. A 4-layer PCB with continuous ground/power planes is generally sufficient; no external heatsink is required at industrial temperatures.
What is the difference between EP2C70F896I7N and EP2C70F896I8N?
Both parts share the same 896-ball FBGA package and 68,416 logic-element Cyclone II die, but the I7N suffix designates the industrial temperature grade (-40 C to +100 C junction) while the I8N suffix denotes the same industrial grade with a higher speed bin. They are pin-to-pin compatible, so the I7N is typically chosen when timing margin is not critical.
How much embedded memory does EP2C70F896I7N have?
The EP2C70F896I7N integrates 1,152 Kbits of on-chip memory implemented as 250 M4K true dual-port RAM blocks. Per the Cyclone II handbook, each M4K block supports 4 Kbits plus parity and can be configured as SRAM, ROM, or FIFO with byte-enable support for buffering and DSP data paths.
Is EP2C70F896I7N suitable for DSP applications?
Yes, the EP2C70F896I7N is explicitly suitable for DSP. It contains 150 dedicated 18x18 hardware multipliers supporting signed and unsigned multiplication. This allows implementation of high-throughput FIR/IIR filters, FFTs, and motor-control loops that exceed fabric-only throughput by 5-10x.
Where can I buy EP2C70F896I7N online?
Authorized distributors listing the EP2C70F896I7N include IC-Components, Jotrin, Censtry, and Microchip USA, as well as the open market via FindChips and Octopart. Pricing as of 2026-09-08 ranges from $142 at qty 1 down to approximately $95 at qty 1000; verify RoHS paperwork and date code with the supplier before high-volume release.
What is the lead time for EP2C70F896I7N?
As of 2026-09-08, the EP2C70F896I7N is in NRND (Not Recommended for New Designs) status at Intel, so lead times from authorized channels are typically 8-14 weeks. Open-market and franchised brokers sometimes hold inventory; always check traceability paperwork and date code to avoid counterfeit parts on the secondary market.
Is EP2C70F896I7N in stock at major distributors?
Authorized Intel distributors including Avara (formerly the Altera channel) and Arrow typically do not stock the EP2C70F896I7N in production quantities due to its NRND status as of 2026-09-08. Real-time stock should be checked on FindChips and Partstack; broker inventory is available but with variable lead times.
EP2C70F896I7N vs EP2C70F896C8N - which is better for industrial use?
For industrial applications, the EP2C70F896I7N is the better choice because it carries the industrial temperature grade (-40 C to +100 C junction). The EP2C70F896C8N uses the commercial grade (0 C to +85 C); choosing it for an industrial product violates the datasheet derating. Both share the same 896-ball BGA and pinout.
EP2C70F896I7N vs EP2C50F896I7N - which should I choose?
Choose the EP2C70F896I7N when you need the largest Cyclone II logic capacity (68,416 LE vs 50,528 LE) and maximum embedded memory. Choose the EP2C50F896I7N when your design fits within approximately 50K LE - both share the 896-ball BGA footprint, so the EP2C70 is a safe drop-in upgrade path on existing boards.
What is the best drop-in replacement for EP2C70F896I7N?
The best drop-in replacement for the EP2C70F896I7N is the EP2C70F896C8N (same 896-ball FBGA, same Cyclone II die, commercial temperature) if your application operates between 0 C and +85 C, or the EP2C70F896I8N (same die, faster speed bin, industrial temperature) for higher performance. All three share identical pinout and can be soldered to the same PCB footprint.
Can a Cyclone IV EP4CE75F23N substitute the EP2C70F896I7N?
No, the Cyclone IV EP4CE75 family uses a different package (256-pin FBGA or 484-pin BGA) and a different die, so it is not pin-compatible with the EP2C70F896I7N's 896-ball BGA. Substituting it requires a PCB redesign - it is a 'functional alternative' but not a drop-in replacement. Cyclone II EP2C70 variants remain the only true drop-in options.
Where to download EP2C70F896I7N datasheet PDF?
The EP2C70F896I7N datasheet is included in the Cyclone II Device Handbook (document CII51001-3.2), hosted by Altera/Intel and mirrored on datasheet repositories such as datasheet.iiic.cc and alldatasheet.com. The handbook contains device features, pin tables, package outlines, and PCB layout guidelines for board designers.
Where to find EP2C70F896I7N pinout?
The pinout for the EP2C70F896I7N 896-ball FBGA package is documented in Section I of the Cyclone II Device Handbook. Intel's Quartus II pin planner (legacy 13.0sp1) can also export per-pin assignments for the F896 package; use the device pin table to map each ball to its I/O bank and function.
What design tool should I use for EP2C70F896I7N development?
Use Intel Quartus II 13.0sp1 (the final service pack supporting Cyclone II) for synthesis, place-and-route, and timing closure. The toolchain includes the Qsys system integrator, TimeQuest timing analyzer, and a programmer for EPCS configuration flash. Newer Quartus Prime releases do not support Cyclone II - stick with the 13.0sp1 toolchain.

Engineering reference data for EP2C70F896I7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2C70F896I7N when your design needs the largest Cyclone II logic capacity (68,416 LE) plus industrial temperature operation and Pb-free / RoHS compliance in a single 896-ball FBGA footprint. It is the right choice for DSP co-processors, motor-control firmware, video preprocessing, custom bus bridges, and ASIC emulation at industrial temperatures. Choose the EP2C70F896I8N instead if you need a faster speed bin (timing margin improvements) at industrial temperatures - pin-compatible drop-in. Choose the EP2C70F896C8N only for commercial-temperature (0-85 C) products, accepting reduced thermal headroom. If your design fits within 50K logic elements, drop to the EP2C50F896I7N for cost savings on the same footprint. The Cyclone II family is in NRND status, so plan a Cyclone IV or Cyclone V migration path for new long-life products.

Comparison with Alternatives

Parameter This Product EP2C70F896I8N EP2C70F896C8N EP2C70F896C7N EP2C70F896C8 EP2C70F896C7 EP2C70F896C6N
Package 896-ball FBGA 896-ball FBGA - same 896-ball FBGA - same 896-ball FBGA - same 896-ball FBGA - same 896-ball FBGA - same 896-ball FBGA - same
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Logic Elements 68,416 68,416 (same die) 68,416 (same die) 68,416 (same die) 68,416 (same die) 68,416 (same die) 68,416 (same die)
Embedded Memory 1,152 Kbits (250 M4K) 1,152 Kbits (same) 1,152 Kbits (same) 1,152 Kbits (same) 1,152 Kbits (same) 1,152 Kbits (same) 1,152 Kbits (same)
18x18 Multipliers 150 150 (same) 150 (same) 150 (same) 150 (same) 150 (same) 150 (same)
Temperature Grade Industrial (-40 C to +100 C) Industrial (-40 C to +100 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C) Commercial (0 C to +85 C)
Speed Bin I7 (fastest industrial) I8 (faster industrial) C8 (fastest commercial) C7 (commercial) C8 (fastest commercial) C7 (commercial) C6 (slowest commercial)
Lead-Free / RoHS Yes (Pb-free, RoHS) Yes Yes Yes No (Pb) No (Pb) Yes

Key Differentiators

  • Largest Cyclone II member with 68,416 LE (vs EP2C50F896I7N)
  • Industrial temperature grade in NRND status (vs EP2C70F896C8N)
  • Same-die drop-in flexibility across speed and temperature bins (vs EP2C70F896I8N)

Design Notes

The EP2C70F896I7N requires four power rails: VCCINT (1.2 V core), VCCIO per I/O bank (1.5/1.8/2.5/3.3 V), VCC_PLL (1.2 V analog PLL supply), and VCCA (2.5 V). Estimated quiescent current at full logic utilization is approximately 1.5 A on VCCINT (1.8 W) plus bank-dependent I/O current. Decouple each rail with 0.1 uF X7R capacitors within 5 mm of each supply pin, plus a 10 uF bulk capacitor per rail at the regulator output. Power-rail sequencing per the Cyclone II handbook is mandatory - VCCIO must not precede VCCINT by more than 200 ms to avoid latch-up.

The 896-ball FBGA uses a 1.0 mm ball pitch and demands a 4-layer PCB minimum with controlled-impedance routing for LVDS pairs. Estimated: 6 mil trace / 6 mil space rules are required to escape the inner balls. Use via-in-pad or microvia-on-pad for the inner-row balls to keep the breakout manageable. A continuous ground plane beneath the device is mandatory for signal return paths and thermal dissipation (theta_JB is approximately 16 C/W). Match LVDS pair lengths to within 150 mil for signals above 500 Mbps.

Configure the EP2C70F896I7N with a serial configuration flash (EPCS16 for bitstreams up to ~16 Mbit, EPCS64 for larger). Use the Altera/Intel Quartus II 13.0sp1 programmer to convert SOF to .jic or .pof format. JTAG mode (10-pin header per IEEE 1149.1) supports both programming and runtime debug with SignalTap II logic analyzer. Active serial mode requires the MSEL[2:0] pins be pulled to specific logic levels per the Cyclone II handbook; incorrect strapping prevents configuration.

Common bring-up issues include: (1) leaving unused I/O banks powered down while driving signals into them - always tie VCCIO of used banks to the I/O supply voltage; (2) forgetting the CRC error pin pull-up during AS configuration - the FPGA will not flag configuration failures reliably without it; (3) ignoring I/O bank I/O standards mixing rules - each bank supports only one VCCIO voltage; (4) placing too many LVDS pairs on one bank and running out of PLL clock output pairs - plan PLL allocation early. Estimated: typical design cycles take 3-5 iterations to achieve timing closure at industrial temperatures.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Pb-free (N suffix) per Altera Cyclone II handbook. Industrial temperature grade supports automotive under-hood and outdoor deployments, but is not AEC-Q100 qualified. Halogen-free status not confirmed in datasheet. Conflict-minerals compliance per Altera/Intel CMRT filings.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

EP2C70F896I7N EP2C70F896I7N datasheet Cyclone II EP2C70 FPGA Altera EP2C70 896 BGA Cyclone II 68K logic elements FPGA EP2C70F896I7N DSP co-processor EP2C70F896I7N motor control FPGA EP2C70F896I7N vs EP2C70F896I8N EP2C70F896I7N buy price stock Cyclone II 150 multipliers 1.1 Mbit memory EP2C70F896I7N Quartus II support FPGA 896-ball FineLine BGA industrial Cyclone II drop-in replacement NRND

Related Components & Terms

Intel Altera EP2C70F896I7N Cyclone II FPGA Field-Programmable Gate Array 896-ball FBGA FineLine BGA 68,416 logic elements 150 18x18 multipliers 1,152 Kbits M4K memory DSP block PLL LVDS Quartus II Nios II EPCS JTAG IEEE 1149.1 Industrial temperature grade RoHS AEC-Q100 lead-free NRND soft core ASIC emulation
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