EP2S60F672I4 - Stratix II FPGA 60K LE 672-FBGA | Intel
MPN: EP2S60F672I4 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1676.24 | $1,676.24 |
| 10 | $1550 | $15,500.00 |
| 100 | $1380 | $138,000.00 |
| 500 | $1190 | $595,000.00 |
| 1,000 | $1050 | $1,050,000.00 |
EP2S60F672I4 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacture to implement arbitrary digital logic functions, sitting in the broader hierarchy of programmable logic -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Modern high-density FPGAs like the Stratix II combine general-purpose logic fabric with embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, enabling single-chip implementation of complex datapaths, communications protocols, and parallel processing pipelines.
Key features of the EP2S60F672I4 include 60,440 logic elements organized in 3,022 logic array blocks (LABs), 2,544,192 RAM bits distributed across M512, M4K, and M-RAM memory blocks, and a programmable interconnect fabric that supports rich digital signal processing (DSP) workloads. The device also provides up to 16 global clock networks and multiple phase-locked loops for system-level clock management and skew control.
Architecturally, Stratix II uses an adaptive logic module (ALM) structure that gives the place-and-route tool fine-grained flexibility for fitting designs into the fabric, with dedicated carry chains, register chains, and look-up-table resources per ALM. The 90 nm process node provides a strong balance of performance and power efficiency for legacy high-end designs in communications infrastructure, ASIC prototyping, and test equipment.
Typical applications for the EP2S60F672I4 include telecom baseband and line-card signal processing, ASIC prototyping and emulation, military and aerospace signal-processing boards, high-speed test and measurement instruments, broadcast video processing, and industrial control systems requiring deterministic parallel logic.
When designing with this part, careful power-rail sequencing (1.2 V core, 3.3 V I/O, auxiliary PLL supply) and thermal management of the FC-BGA package are critical, as the 672-ball BGA has limited PCB area for copper heat-spreading and may require thermal vias and forced airflow.
This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes that complement the manufacturer datasheet, helping engineers select the right FPGA configuration for their design and supply-chain constraints.
Drop-in alternatives for EP2S60F672I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F672I4 (same form factor and footprint) β differing in Speed Grade, Package, RoHS Status, Operating Temperature, Package Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S60F672I4N
β Drop-Inβ In Stock
$220 / Unit
View Datasheet βEP2S60F672I5N
β Drop-Inπ Reference alternative (not in catalog)
EP2S60F672I3N
β Drop-Inβ In Stock
$125.4 / Unit
View Datasheet βEP2S60F672C5NGA
β Drop-Inβ In Stock
$115 / Unit
View Datasheet βEP2S60F672C5N
β Drop-Inβ In Stock
$170 / Unit
View Datasheet βEP2S60F672C4N
β Drop-Inβ In Stock
$325 / Unit
View Datasheet βEP2S60F672C3N
β Drop-Inβ In Stock
$1175 / Unit
View Datasheet βEP2S60F672I4 Maximum Ratings & Electrical Characteristics
| Series | Stratix II |
| Family | Stratix II FPGA |
| Logic Elements (LE) | 60,440 |
| Logic Array Blocks (LAB) | 3,022 |
| Total RAM Bits | 2,544,192 |
| User I/O Count | 492 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 711.24 MHz |
| Package Type | 672-ball FC-FBGA (Fine-pitch Chip-scale BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -4 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2S60F672I4 672-ball fc-fbga (fine-pitch chip-scale bga) Pin Configuration Guide
Pin configuration for EP2S60F672I4 (672-ball fc-fbga (fine-pitch chip-scale bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S60F672I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S60F672I4 is suitable for 6 applications: Telecom Baseband and Line-Card Signal Processing, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, High-Speed Test and Measurement Instruments, Broadcast Video Processing, Industrial Control and Deterministic Parallel Logic.
Telecom Baseband and Line-Card Signal Processing
The EP2S60F672I4 fits telecom baseband and line-card designs because its 60,440 logic elements and 2,544,192 embedded RAM bits deliver the parallel datapath throughput required for framer/mapper functions and packet processing. With 492 user I/Os in a 672-FBGA package, it accepts wide parallel buses for backplane interconnect and external PHY devices. Stratix II ALM structure and dedicated carry chains enable efficient CRC, scrambling, and forward-error-correction pipelines operating at hundreds of MHz. The industrial temperature grade supports outdoor cabinet and central-office deployments.
Recommended
ASIC Prototyping and Emulation
For ASIC prototyping and emulation, the EP2S60F672I4's 60,440 LE capacity and rich memory subsystem support multi-million-gate ASIC designs partitioned across multiple FPGAs. The 672-FBGA package provides 492 user I/Os needed for high-pin-count ASIC-to-FPGA mapping, while embedded M-RAM blocks emulate large register files and FIFOs natively. Quartus II time-driven place-and-route benefits from the Stratix II ALM structure for timing closure on aggressive emulation clocks. The 90 nm node gives predictable behavior well-matched to the target ASIC process corner.
Recommended
Military and Aerospace Signal Processing
The EP2S60F672I4's industrial temperature grade (-40C to +100C) and mature 90 nm Stratix II silicon make it a fit for military and aerospace signal-processing boards where reliability and long-term availability are paramount. Its 60,440 LE and embedded DSP-friendly fabric support radar, electronic-warfare, and secure-comms baseband functions, while the 492 user I/Os handle multiple ADC/DAC channels and serial interfaces. Designers rely on the 672-FBGA package for controlled-impedance routing and mechanical robustness under vibration profiles common to airborne platforms.
Recommended
High-Speed Test and Measurement Instruments
In high-speed test and measurement instruments such as protocol analyzers and logic analyzers, the EP2S60F672I4's parallel logic capacity and 492 I/Os enable deep capture buffers and parallel sample processing. The 2,544,192 embedded RAM bits store raw sample windows before compression, while M-RAM blocks handle very deep trigger histories. The device's industrial temperature grade supports bench and lab environments, and the 672-FBGA package's controlled-impedance routing preserves signal fidelity for sub-nanosecond edge rates from the comparator front end.
Recommended
Broadcast Video Processing
The EP2S60F672I4 supports broadcast video processing such as SD/HD/3G-SDI routing, color-space conversion, and chroma keying, thanks to its 60,440 LE fabric and 2,544,192 embedded RAM bits for line and frame buffers. The 492 user I/Os accept multiple parallel video buses and high-speed serial digital video links, while Stratix II ALM structure preserves critical-path timing for pixel-rate pipelines. The industrial temperature grade ensures reliable operation in broadcast equipment racks with constrained airflow.
Recommended
Industrial Control and Deterministic Parallel Logic
For industrial control systems such as PLC backplanes, motion controllers, and deterministic parallel I/O aggregators, the EP2S60F672I4 delivers 60,440 LEs of deterministic logic with 492 I/Os for sensor/actuator fan-in and backplane connectivity. The 672-FBGA package's mechanical stability suits enclosed industrial enclosures, while embedded M4K blocks handle deterministic FIFO buffering for real-time fieldbus protocols. The industrial temperature grade supports factory-floor and outdoor cabinet environments with extended thermal cycling.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F672I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F672I4N | EP2S60F672I5N | EP2S60F672I3N | EP2S60F672C5NGA | EP2S60F672C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (F672) | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | -4 | -4 | -5 (faster Fmax) | -3 (slower Fmax) | -5 | -5 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lead-Free Finish | Standard | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (RoHS-GA) | Yes (lead-free) |
| Total RAM Bits | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| User I/O Count | 492 | 492 | 492 | 492 | 492 | 492 |
Key Differentiators
- Industrial temperature grade at the standard speed grade -4 (vs EP2S60F672C5NGA)
- Balance of speed and availability at speed grade -4 (vs EP2S60F672I5N)
- Identical silicon to EP2S60F672I4N with lead-free finish (vs EP2S60F672I4N)
Design Notes
The EP2S60F672I4 requires four main power rails: 1.2 V VCCINT (core), 1.2 V VCCD_PLL (PLL analog), 3.3 V VCCIO (I/O banks), and VCCPD (3.3 V pre-driver). Sequence VCCINT before VCCIO and hold PLLs in reset until supplies are stable. Decouple each ball group with 0.1 uF X7R ceramics within 5 mm, plus bulk polymer tantalums for transient load steps on the M-RAM blocks.
Estimated: at 90% utilization of 60,440 LEs with 50% toggle rate, the Stratix II fabric dissipates approximately 4-6 W of dynamic power on a 1.2 V core. The 672-FBGA package relies on the PCB for heat-spreading - design a 6-layer stack-up with at least 1 oz copper in the core and stitch thermal vias beneath the central BGA ball array. Add forced airflow above 5 W dissipation to maintain junction below 100C.
Route the 672-ball FC-FBGA escape with microvia-in-pad construction (0.1 mm pitch compatible) and length-matched differential pairs for high-speed LVDS and SERDES signals. Keep BGA break-out on the top layer only, with via-in-pad filled and planarized. Maintain a continuous reference plane beneath the BGA to provide a controlled-impedance return path - critical for sub-500 ps edge rates.
Stratix II I/O banks support LVDS, SSTL, HSTL, and LVCMOS standards with per-bank VCCIO voltages. Match trace impedance to 50 ohm SE or 100 ohm differential and avoid stubs. Use the Quartus II pin planner to assign I/O standards and drive strengths that match the connected memory or transceiver bus - mismatches cause signal-integrity failures at first hardware bring-up.
Because EP2S60F672I4 is NRND, do not commit to it for new long-life-cycle designs without an active last-time-buy plan. Configure the FPGA only with Intel Quartus II 13.0 (final supported version) - newer Quartus releases dropped Stratix II support. Keep one Quartus II license seat in your build infrastructure for the lifetime of any deployed system.
Compliance Information
RoHS compliant per DigiKey listing. Reach, halogen-free, and lead-free specific markings are not stated in the verified data; plain I4N variant is the lead-free equivalent. AEC-Q100 not applicable to FPGAs.
