EP2S60F672C4N - 60K LE Stratix II FPGA, 672-FBGA | Intel
MPN: EP2S60F672C4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $432 | $4,320.00 |
| 25 | $395 | $9,875.00 |
| 100 | $358 | $35,800.00 |
| 250 | $325 | $81,250.00 |
EP2S60F672C4N Overview
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit within the broader programmable-logic hierarchy: programmable logic device (PLD) -> FPGA -> high-performance FPGA (Stratix / Virtex class) -> programmable SoC. The Stratix II family in particular pioneered the adaptive logic module (ALM) architecture that replaced the older 4-input LUT, doubling effective logic capacity per area compared to the original Stratix.
Key features of the EP2S60F672C4N include 492 user I/O pins, an embedded memory capacity of 2,544,192 bits distributed across TriMatrix memory blocks (MRAM, M4K, M512), dedicated DSP blocks for high-throughput signal processing, and support for multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI-X). The 672-pin FC-FBGA package provides a compact footprint with low inductance for high-speed signaling, suitable for high-density backplane and memory-interface designs.
Typical applications include telecommunications baseband and line-card processing, high-speed serial-protocol bridging, ASIC prototyping, and DSP-intensive image and video pipelines. The combination of dedicated multipliers, large on-chip memory, and abundant I/O makes the EP2S60 a workhorse for pre-Stratix IV prototype platforms and long-lifecycle industrial designs.
When designing with the EP2S60, pay close attention to decoupling (the Stratix II family draws substantial inrush current during configuration), JTAG chain integrity, and Quartus II software version compatibility - Quartus 7.2 or later with the Stratix II device library is required to generate bitstreams. Heat dissipation at full utilization can require active cooling on a 4-layer board.
This page synthesizes distributor stock data from DigiKey, Mouser, Octopart and Arrow, drop-in same-package alternatives from the Stratix II family, and practical FPGA bring-up notes not found in the manufacturer's datasheet. Pricing references are stated as of 2026-09-09.
Drop-in alternatives for EP2S60F672C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S60F672C4N (same form factor and footprint) β differing in Speed Grade, Package, RoHS Status, Operating Temperature, Total RAM Bits.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S60F672C4
β Drop-Inβ In Stock
$1080 / Unit
View Datasheet βEP2S60F672C3N
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View Datasheet βEP2S60F672C3
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View Datasheet βEP2S60F67214N
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View Datasheet βEP2S60F672C3NGA
β Drop-Inβ In Stock
$1150 / Unit
View Datasheet βEP2S60F672C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Process Technology | 90 nm |
| Logic Elements (LE) | 60,440 |
| Adaptive Logic Modules (ALM) | 24,176 |
| Embedded Memory (bits) | 2,544,192 |
| Maximum User I/O | 492 |
| Core Voltage | 1.2 V |
| Maximum Fabric Clock | 711.24 MHz |
| Package | 672-pin FC-FBGA |
| Package Type | FineLine Ball-Grid Array |
| Speed Grade | C4 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Configuration Method | JTAG, Fast Passive Parallel, Active Serial |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Lead-Free / RoHS | Yes (lead-free finish) |
EP2S60F672C4N fineline ball-grid array Pin Configuration Guide
Pin configuration for EP2S60F672C4N (fineline ball-grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S60F672C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S60F672C4N is suitable for 6 applications: Telecommunications Line-Card Processing, ASIC Prototyping and Emulation, High-Performance DSP Signal Processing, Video and Image Processing, Industrial Control and Test Equipment, Military and Aerospace Embedded Systems.
Telecommunications Line-Card Processing
The EP2S60F672C4N is well suited for telecom line-card designs where 60,440 logic elements and 2.4 Mbit embedded memory handle packet classification, traffic shaping, and protocol termination. The Stratix II fabric delivers up to 711 MHz fabric clock, enabling multi-gigabit Ethernet MACs, ATM SAR functions, and IPv4/v6 forwarding tables on a single device. The 492 user I/O pins route to multiple external PHYs and SFP cages without external bus multiplexing. Designers typically pair the EP2S60 with external DDR or QDR-II SRAM for deep lookup tables; the dedicated I/O banks support SSTL-2 and HSTL signaling required by these memories. Compared to ASIC implementations, the EP2S60 enables rapid standards evolution - designers can update line-rate protocols by reconfiguring flash rather than respinning silicon.
Recommended
ASIC Prototyping and Emulation
Engineers frequently use the EP2S60F672C4N as an ASIC prototyping platform because the Stratix II fabric approximates gate-for-gate with mid-complexity ASICs. 60,440 LEs plus dedicated multiplier blocks and 2.4 Mbit block RAM allow partitioning of an ASIC netlist across multiple EP2S60 devices using TDM or chip-over-fibre bridging. The 672-ball FC-FBGA package exposes 492 user I/Os for connecting to multi-FPGA prototyping backplanes at hundreds of MHz. Compared to smaller FPGAs, the EP2S60 halves the number of devices required to prototype million-gate ASICs, reducing bring-up time. Quartus II software with Synplify or Precision synthesis supports standard ASIC flows including Verilog, VHDL, and SystemVerilog with timing constraints.
Recommended
High-Performance DSP Signal Processing
The Stratix II DSP blocks deliver up to 384 18x18-bit dedicated multipliers operating at full fabric speed, making the EP2S60F672C4N well suited for high-throughput DSP applications. Common use cases include multi-channel radar baseband processing, software-defined radio (SDR) front-ends, MRI image reconstruction, and ultrasound beamforming. The combination of 2.4 Mbit embedded memory and 60K LEs allows streaming data to be buffered and processed in real time without external SRAM for many designs. Designers implementing radar pulse compression or FFT pipelines typically achieve 300-500 MHz clock rates on the DSP blocks. Compared to a DSP processor, the EP2S60 offers 10-100x throughput per watt for parallel filter and FFT workloads.
Recommended
Video and Image Processing
Video processing systems requiring real-time pixel-rate manipulation use the EP2S60F672C4N for scaling, deinterlacing, color-space conversion, and overlay generation. The 492 user I/Os directly interface to digital video ports (DVI/HDMI transmitters, BT.656, BT.1120) and frame buffers in DDR or SDRAM. The Stratix II LVDS I/O support enables direct connection to FlatLink or FPD-Link serializer/deserializer pairs commonly used in flat-panel displays. The 2.4 Mbit embedded memory is sufficient for line buffers in deinterlacing and scaling algorithms without external memory in lower-resolution designs. Compared to discrete DSP + ASSP approaches, the EP2S60 allows the entire video pipeline in one programmable device, simplifying PCB design.
Recommended
Industrial Control and Test Equipment
Long-lifecycle industrial control, instrumentation, and ATE systems use the EP2S60F672C4N for custom backplane interfacing, protocol bridging, and timing-critical test vector generation. The Stratix II family's continued availability through brokers makes the EP2S60 attractive for products with 10-15 year deployment horizons where ASIC respins are economically infeasible. With 492 I/Os and support for LVDS, RS-485, and 5 V-tolerant I/O standards (via external buffering), the EP2S60 interfaces directly to legacy industrial buses. The 1.2 V core and 90 nm process yield predictable thermal performance in sealed enclosures. The C4 speed grade provides adequate timing margin for deterministic industrial protocols such as PROFIBUS and EtherCAT slave implementations.
Recommended
Military and Aerospace Embedded Systems
Defense and aerospace systems, where long-term part availability and ruggedized operation are required, use the EP2S60F672C4N in avionics databuses, radar front-ends, and electronic warfare subsystems. The 672-ball FC-FBGA package supports the thermal and mechanical stress profiles typical of MIL-STD-810 environments when properly qualified. The Stratix II family provides SEU mitigation features such as CRC-based configuration scrubbing that are essential for space-grade applications. Designers typically implement triple-mode redundancy and EDAC-protected memory using the 2.4 Mbit embedded block RAM. Compared to newer FPGA families, the EP2S60 has a long legacy design library and is well documented in legacy DO-254 and EDA flows.
Recommended
Recommended Products Summary
Engineering reference data for EP2S60F672C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S60F672C4 | EP2S60F672C3N | EP2S60F672C3 | EP2S60F67214N | EP2S60F672C3NGA |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| Maximum User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
| Speed Grade | C4 | C4 | C3 (faster) | C3 (faster) | C4 industrial | C3 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| RoHS Compliance | Yes (-N suffix) | No (no -N suffix) | Yes | No | Yes | Yes |
Key Differentiators
- RoHS-compliant lead-free finish in standard commercial speed grade (vs EP2S60F672C4)
- Drop-in compatible with faster speed grade for design margin recovery (vs EP2S60F672C3N)
- Industrial temperature variant available for ruggedized applications (vs EP2S60F67214N)
Design Notes
Estimated: the Stratix II EP2S60 core draws approximately 1-2 A from the 1.2 V VCCINT rail at full fabric utilization, plus 1-3 A from VCCIO rails depending on I/O toggle rate. Designers should deploy a multi-phase buck regulator with at least 100 uF bulk + 0.1 uF + 10 nF decoupling per VCCINT pin group per the Stratix II pin connection guidelines. PLLVCCA requires a quiet 2.5 V linear regulator and ferrite bead isolation from VCCINT to minimize PLL jitter.
The 672-ball FC-FBGA requires a 1.0 mm ball pitch PCB with microvia (laser-drilled) stack-up and ENIG or immersion-silver surface finish. Use a minimum 6-layer PCB with dedicated ground and power planes; the Stratix II handbook recommends continuous power planes under the BGA to maximize decoupling effectiveness. Matched-length differential pairs (within 150 mil) are required for LVDS links above 400 MHz.
Estimated: Configuration failure is the most common EP2S60 bring-up issue. Confirm MSEL pins are strapped correctly for the selected configuration mode (AS, PS, FPP, JTAG) - mismatched MSEL causes silent configuration failure. The CONFIG_DONE pin should be pulled up to 3.3 V via 10 kohm; a stuck-low CONFIG_DONE after power-up indicates bitstream CRC error or missing clock to the configuration controller. JTAG chain integrity must be verified with the Quartus II JTAG chain debugger before attempting AS configuration.
Estimated: At 1.2 V core and ~1.5 A ICCINT under heavy DSP utilization, the EP2S60 dissipates roughly 1.8 W internally. The 672-ball FC-FBGA has theta_JA around 12-15 C/W on a 4-layer JEDEC test board with adequate thermal vias. Designers targeting industrial temperature should deploy a small heatsink or thermal pad if continuous junction temperature exceeds 85C ambient with full I/O toggle activity.
Compliance Information
RoHS compliant per -N suffix in part number. Not AEC-Q100 qualified (commercial grade only). REACH compliance per Intel material declaration. Halogen-free status not explicitly listed in available data - set to 'unknown'.
