Altera

EP2SGX30DF780C4N - Stratix II GX 30K LEs FPGA 780-FBGA | Altera

Name: EP2SGX30DF780C4N - Stratix II GX 30K LEs FPGA 780-FBGA | Altera
Brand: Altera
SKU: EP2SGX30DF780C4N
Price: 171 USD
Availability: InStock

MPN: EP2SGX30DF780C4N ⚠ Last Time Buy

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1.15 V to 1.25 V Vdss 780-FBGA (29 x 29 mm, 1.0 mm pitch) Package 622 MHz Speed

From $171 USD / Unit

MOQ: 1 |

Price updated: 2026-09-08

Volume Pricing

Qty	Unit Price	Extended
1	$285	$285.00
10	$256.5	$2,565.00
100	$228	$22,800.00
500	$199.5	$99,750.00
1,000	$171	$171,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EP2SGX30DF780C4N Overview

The Altera EP2SGX30DF780C4N is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) with integrated high-speed transceivers, offering 33,880 logic elements and 1,369,728 RAM bits in a 780-ball flip-chip BGA (780-FBGA, 29x29 mm, 1 mm pitch) package. According to the manufacturer datasheet, the device operates from a 1.15 V to 1.25 V core supply and supports up to 622 MHz internal frequency with a -40C to +85C commercial temperature range. The part is a CMOS FPGA fabricated in a 90 nm process, providing 361 user I/O pins and 1,694 logic array blocks (LABs).

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> high-performance transceiver FPGA. They are used wherever designers need parallel processing, custom I/O timing, hardware-accelerated DSP, or high-speed serial links that an ASIC, MCU, or DSP cannot economically deliver. The Stratix II GX family specifically targets applications that combine logic density with multi-gigabit transceivers (MGTs) for serial connectivity.

Key features include embedded transceiver blocks supporting multiple serial protocols, dedicated DSP blocks for high-throughput signal processing, TriMatrix on-chip memory up to ~1.37 Mbits, and support for source-synchronous and high-speed external memory interfaces (DDR/DDR2/QDR). The device integrates up to 12 transceivers depending on package variant, with per-channel data rates suitable for PCIe, XAUI, Serial RapidIO, and custom serial links. The 780-FBGA package provides 361 user I/Os and a flip-chip thermal path for reliable operation at high toggle rates.

Architecturally, Stratix II GX uses an ALM-based adaptive logic module that improves on prior 4-input LUT architectures, increasing effective logic density and reducing fabric congestion. The transceiver tiles are physically isolated and clocked independently from the core fabric, allowing parallel development of high-speed serial and parallel logic on the same die. Configuration is via SRAM, so the bitstream reloads from external flash or a host processor on every power-up.

Typical applications include telecommunications line cards, software-defined radio baseband processing, high-speed serial protocol bridging, ASIC prototyping, and high-performance DSP pipelines. Engineers select Stratix II GX for designs that demand both high logic capacity and integrated multi-gigabit serial I/O without the cost and risk of an ASIC.

When designing with this part, plan power-rail sequencing carefully because core (1.2 V), PLL analog, and transceiver supplies have separate tolerance bands; failure to sequence them can stress the transceivers during bring-up. Use the Quartus II design suite (legacy) or consult the Stratix II GX handbook for transceiver channel bonding and pre-emphasis settings. The device is now in legacy/EOL status, so verify long-term availability before committing to a new design.

This page synthesizes distributor pricing, drop-in alternatives, lifecycle notes, and practical design guidance that the manufacturer datasheet alone does not provide.

Drop-in alternatives for EP2SGX30DF780C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2SGX30DF780C4N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, RoHS Status, Mounting Type.

EP2SGX30CF780C4

Intel

Package: 780-BBGA (flip-chip)

Mounting Type: Surface Mount