EP2SGX30DF780I5N - 33,880 Cell Stratix II GX FPGA, FC-FBGA-780 | Intel
MPN: EP2SGX30DF780I5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2SGX30DF780I5N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs occupy the top of the programmable-logic hierarchy, sitting above CPLDs (which are simpler, lower-density, non-volatile devices) and below fixed-function ASICs in terms of integration density. The Stratix II GX architecture specifically embeds high-speed serial transceivers for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, enabling single-chip implementation of multi-gigabit serial interfaces without external PHYs.
Key features of the EP2SGX30DF780I5N include 33,880 logic cells, multiple embedded transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput signal processing, abundant block RAM for buffering and packet storage, and the fine-pitch 29 mm FC-FBGA package for high signal integrity on dense multi-layer PCBs. Its industrial temperature grade and I5 speed grade place it in the higher-performance tier of the Stratix II GX family, well-suited to networking line cards, basestation baseband, and high-end test equipment.
Typical applications include high-speed serial protocol bridging (PCI Express to Gigabit Ethernet, Serial RapidIO switching), DSP co-processing for radar, software-defined radio, telecom muxponders, and ASIC prototyping. Industrial-grade parts are also commonly used in long-life-cycle embedded systems such as avionics, defense radios, and process-control networking modules.
When designing with this part, plan for multi-layer PCB stack-up with controlled-impedance serial channels, ample decoupling around the 780 BGA balls, and a Quartus II design flow with the Stratix II GX device library. Power sequencing, JTAG configuration, and thermal dissipation through the flip-chip BGA should be validated before high-volume release.
Drop-in alternatives for EP2SGX30DF780I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780I5N (same form factor and footprint) — differing in Speed Grade, Package, Mounting Type, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780I4N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30DF780I4
✅ Drop-In✓ In Stock
$178.25 / Unit
View Datasheet →EP2SGX30DF780I3N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30DF780C7N
✅ Drop-In✓ In Stock
$225 / Unit
View Datasheet →EP2SGX30DF780C5N
✅ Drop-In✓ In Stock
$1050 / Unit
View Datasheet →EP2SGX30DF780I5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Cells | 33,880 (33,380 logic elements) |
| Logic Array Blocks (LABs) | 33,880 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Internal Clock Frequency (max) | 622.08 MHz |
| Number of Pins / Balls | 780 |
| Package Type | FC-FBGA-780 (Flip-Chip Fine-pitch BGA) |
| Package Size | 29 x 29 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Lead Free (per Kynix listing) |
| Speed Grade | I5 |
| Temperature Grade Suffix | Industrial |
EP2SGX30DF780I5N 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX30DF780I5N (29 x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780I5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780I5N is suitable for 7 applications: Multi-Gigabit Serial Protocol Bridging, Telecom Basestation Baseband Processing, ASIC Prototyping and Emulation, Software-Defined Radio (SDR), High-Speed Test and Measurement Equipment, Defense and Avionics Embedded Systems, Broadcast Video Processing.
Multi-Gigabit Serial Protocol Bridging
The EP2SGX30DF780I5N's integrated transceivers and 33,880 logic cells make it ideal for bridging PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI within a single chip. Its industrial temperature range and I5 speed grade allow deployment in outdoor telecom cabinets. The 780-ball FC-BGA supports the many high-speed serial lanes plus parallel configuration and memory interfaces required for full protocol stack implementation, eliminating external PHY ICs.
Recommended
Telecom Basestation Baseband Processing
With abundant DSP blocks and block RAM, the EP2SGX30DF780I5N handles baseband DSP for 3G/4G picocell and femtocell modems. The 622.08 MHz internal clock supports the symbol-rate processing budgets for WCDMA and LTE physical layers, while embedded transceivers interface directly to RF front-ends via CPRI or OBSAI. The industrial temperature grade is essential for outdoor radio units exposed to seasonal temperature swings.
Recommended
ASIC Prototyping and Emulation
The 33,880 logic cells of the EP2SGX30DF780I5N are sufficient to prototype mid-complexity ASIC RTL before tape-out, allowing pre-silicon software bring-up and verification. Multiple FPGAs can be wired together via the transceivers to emulate larger ASICs. The FC-BGA package provides high signal-integrity multi-GHz serial channels that match the I/O characteristics of typical ASIC pad rings.
Recommended
Software-Defined Radio (SDR)
Wideband SDR platforms benefit from the EP2SGX30DF780I5N's DSP blocks, transceivers, and large block RAM - the combination supports real-time channelization, FFTs, and modulation/demodulation across HF, VHF, and UHF bands. The I5 speed grade and 1.2 V core deliver a favourable performance-per-watt for portable tactical radios, while the industrial temperature range supports military/aerospace deployment profiles.
Recommended
High-Speed Test and Measurement Equipment
Logic analysers, protocol analysers, and BERT testers use the EP2SGX30DF780I5N for its multi-gigabit transceivers plus high logic density. Industrial temperature is well-suited to lab and field-deployed test gear. The I5 speed grade ensures tight timing margins on parallel capture buses and high-speed serial acquisition paths, while the 780-ball FC-BGA supports the dense mixed-signal PCB layouts typical of test equipment.
Recommended
Defense and Avionics Embedded Systems
Long-life-cycle defense platforms select the EP2SGX30DF780I5N for its industrial temperature grade, mature Quartus II tool flow, and Intel/Altera's extended product longevity commitments. It performs radar signal preprocessing, secure communications encryption acceleration, and avionics bus bridging in systems where a multi-year production run is essential and re-spinning a PCB is not acceptable. The FC-BGA package meets the rugged shock and vibration requirements of MIL-STD-810.
Recommended
Broadcast Video Processing
The EP2SGX30DF780I5N handles uncompressed HD/3G-SDI video routing, conversion, and effects processing in broadcast studio and outside-broadcast trucks. Its transceivers accept and emit SMPTE 424M/425M serial video while the 33,880 logic cells implement scaling, colour-space conversion, and frame synchronisation. Industrial temperature supports the variable climate of mobile broadcast deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780I4N | EP2SGX30DF780I4 | EP2SGX30DF780I3N | EP2SGX30DF780C7N | EP2SGX30DF780C5N |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-780 (29 x 29 mm, 1.0 mm pitch) | FC-FBGA-780 (same) | FC-FBGA-780 (same) | FC-FBGA-780 (same) | FC-FBGA-780 (same) | FC-FBGA-780 (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I5 | I4 | I4 | I3 | C7 | C5 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Internal Clock (max) | 622.08 MHz | ~622 MHz (lower due to I4 grade) | ~622 MHz (lower due to I4 grade) | ~500 MHz (lower due to I3 grade) | ~622 MHz (faster, C7 grade) | ~622 MHz (faster, C5 grade) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest available speed grade within industrial temperature range (vs EP2SGX30DF780I4N / EP2SGX30DF780I3N)
- Industrial temperature range suitable for harsh-environment deployment (vs EP2SGX30DF780C5N / EP2SGX30DF780C7N)
- Flip-chip BGA for highest signal-integrity serial performance (vs EP2SGX30CF780I5N)
Design Notes
Estimated: The 780-ball FC-FBGA-780 with 1.0 mm pitch requires a high-density multi-layer PCB (typically 8-12 layers with thin dielectrics). Use of a flip-chip BGA demands precise laminate stack-up control; pair the BGA with a high-Tg (>=170C) PCB material such as FR-4 high-Tg or low-loss Panasonic MEGTRON 6 to handle the 1.2 V core current transients. Decoupling must follow the Altera/Intel Stratix II GX power distribution network (PDN) guidelines with bulk, mid-frequency, and high-frequency caps placed adjacent to the relevant power/ground balls.
Flip-chip BGAs dissipate heat through the die directly into the PCB land pattern and any attached heatsink. Estimated: at full transceiver utilization and 33,880 logic-cell toggle, total power can approach 10-15 W. Provide a continuous thermal via array under the die-up region of the FC-BGA and consider a top-side heatsink with thermal interface material. Validate with the Stratix II GX PowerPlay early-power estimator before committing PCB real estate.
Multi-gigabit transceiver channels on the EP2SGX30DF780I5N demand controlled-impedance differential routing (typically 100 ohm differential for transceiver channels, 50 ohm single-ended for general-purpose I/O). Keep 100 ohm differential pairs length-matched within the tolerance specified for your protocol (often 5 mil for 3.125 Gbps XAUI). Reference each layer to a solid ground plane with no plane splits beneath the BGA escape region, and route AC-coupling capacitors immediately adjacent to the transceiver balls.
Common design mistakes with the EP2SGX30DF780I5N include: (1) using the wrong pinout file (always import the FC-BGA-780 .qsf from Quartus II rather than transcribing pin assignments from a PDF), (2) failing to enable all required transceiver channels in the pin planner leading to un-bonded balls at the FC-BGA corners, (3) ignoring configuration scheme selection (AS, PS, JTAG, or Fast Passive Parallel) which determines which balls are dedicated vs user-available, and (4) mixing I-grade and C-grade temperature parts on the same PCB - the Quartus II fitter may pass timing at room temperature but fail cold-start at -40C if the C-grade variant is used.
Compliance Information
Lead-free and RoHS-compliant per Kynix listing ("LEAD FREE, FBGA-780"). AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Halogen-free status not stated in the verified data; consult Intel/Altera product declaration for confirmation.
