EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
MPN: EP2SGX30DF780I4 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $248.5 | $248.50 |
| 10 | $232 | $2,320.00 |
| 100 | $215.75 | $21,575.00 |
| 500 | $198.4 | $99,200.00 |
| 1,000 | $178.25 | $178,250.00 |
EP2SGX30DF780I4 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceiver blocks that can be rewired after manufacture to implement arbitrary digital functions. Stratix II GX sits in the hierarchy: FPGA -> programmable logic -> programmable logic device -> integrated circuit, with the GX suffix denoting integrated multi-gigabit transceivers for serial connectivity.
Key features of the EP2SGX30DF780I4 include up to 622 MHz internal operation, embedded transceiver blocks supporting SERDES rates commonly used in Stratix II GX, dedicated DSP blocks for high-throughput arithmetic, and a fine-grained ALM (Adaptive Logic Module) architecture that improves logic utilization over previous generations. The device is supported by the Quartus II design toolchain.
The architecture uses ALM-based logic elements with Look-Up Table (LUT) cores, true dual-port M4K and M-RAM memory blocks, and embedded 18x18 multipliers. On-chip PLLs provide clock synthesis and skew management, while the integrated transceivers handle physical-layer serialization at line rates up to 6.375 Gbps depending on the protocol profile.
Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol development, ASIC prototyping, and digital signal processing where transceiver density matters. The 780-ball FC-FBGA package supports the high I/O count and transceiver bandwidth the device provides.
When designing with this part, plan power integrity carefully - Stratix II GX devices draw substantial current through multiple rails. Use Quartus II PowerPlay early estimates to size decoupling and thermal solution; verify I/O bank VCCIO assignments match your LVDS/SSTL/LVCMOS signaling before PCB layout.
This page combines distributor pricing, same-family Stratix drop-in alternatives, and design notes that go beyond what is summarized on manufacturer or distributor product pages.
Drop-in alternatives for EP2SGX30DF780I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780I4 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780I3N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30DF780C7N
✅ Drop-In✓ In Stock
$225 / Unit
View Datasheet →EP2SGX30DF780C7
✅ Drop-In✓ In Stock
$125.4 / Unit
View Datasheet →EP2SGX30DF780C5N
✅ Drop-In✓ In Stock
$1050 / Unit
View Datasheet →EP2SGX30DF780C5
✅ Drop-In✓ In Stock
$384.62 / Unit
View Datasheet →EP2SGX30DF780I4 Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Family | Stratix II GX |
| Logic Elements / Cells | 33,880 |
| Total RAM Bits | 1,369,728 |
| Number of LABs | 1,694 |
| User I/O Count | 361 |
| Nominal Supply Voltage (Core) | 1.2 V |
| Internal Operating Frequency | 622 MHz |
| Maximum Clock Frequency | 717 MHz |
| Process Technology | 90 nm CMOS |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 780-ball FC-FBGA, 29x29 mm, 1 mm pitch |
| Mounting Type | Surface Mount (Flip-chip BGA) |
EP2SGX30DF780I4 780-ball fc-fbga, 29x29 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX30DF780I4 (780-ball fc-fbga, 29x29 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780I4 is suitable for 6 applications: Telecom Backplane Aggregation, ASIC Prototyping, High-Speed Serial Interface Bridging, Custom Protocol Development, Digital Signal Processing, Industrial Control Systems.
Telecom Backplane Aggregation
The EP2SGX30DF780I4's 33,880 logic elements and integrated multi-gigabit transceivers make it well-suited for telecom backplane aggregation where multiple serial links must be muxed/demuxed in parallel. The 780-ball FC-FBGA package exposes enough I/O to drive 4-8 transceiver channels plus management interfaces. Used with LVDS or SSTL signaling on the backplane side, the 622 MHz internal fabric handles 10G-class aggregation. Note that Stratix II GX transceivers require matched-impedance routing - plan stack-up for 100-ohm differential pairs.
Recommended
ASIC Prototyping
Engineers use the EP2SGX30DF780I4 as an ASIC prototyping platform because the Stratix II GX ALM architecture maps efficiently to ASIC gate libraries. With 33,880 logic elements and 1,369 Kbits of embedded RAM, the device can host a moderate-complexity ASIC (~5-8M gates) using multi-FPGA partitioning. The 361 user I/O pins enable realistic I/O modeling, while the transceiver blocks reproduce serial ASIC interfaces (PCIe, XAUI, Serial RapidIO). Quartus II Design Partitions support incremental prototyping flows.
Recommended
High-Speed Serial Interface Bridging
The integrated transceivers of the EP2SGX30DF780I4 support protocol bridging between serial standards such as PCIe, XAUI, Serial RapidIO, and custom SERDES. At 622 MHz internal fabric speed with embedded transceivers, latency overhead is minimized for bridging applications. The 780-ball FC-FBGA exposes dedicated transceiver pins plus 361 user I/O for protocol processing. Power integrity is critical - designers must isolate transceiver supplies from noisy digital rails per Stratix II GX PCB guidelines.
Recommended
Custom Protocol Development
The EP2SGX30DF780I4 is commonly used by equipment vendors developing proprietary serial protocols that need FPGA reconfigurability. Engineers can implement PHY and MAC layers in the 33,880 logic elements while the integrated transceivers handle line coding at rates appropriate to Stratix II GX. The 1,369,728 embedded RAM bits buffer protocol data; the 361 user I/O enables connection to multiple test instruments. Quartus II SignalTap logic analyzer supports in-system debug.
Recommended
Digital Signal Processing
The EP2SGX30DF780I4 contains embedded 18x18 multipliers and DSP blocks suitable for FIR filters, FFTs, and adaptive signal processing at sample rates up to ~250 MHz. The 33,880 logic elements provide glue logic and control; the embedded memory buffers delay lines and FFT twiddle factors. Industrial temperature grade suits defense and industrial DSP applications. For higher DSP throughput, design multiple EP2SGX30DF780I4 devices in a pipeline.
Recommended
Industrial Control Systems
The EP2SGX30DF780I4's industrial temperature grade (-40C to +85C) and high-reliability BGA package suit harsh-environment industrial controllers. The 361 user I/O interface with sensors, actuators, and fieldbus networks; the logic capacity handles real-time control loops. The 1.2 V core supply is regulator-friendly. Designers must follow IPC-9701 thermal cycling guidelines for BGA solder joint reliability in industrial environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780I3N | EP2SGX30DF780C7N | EP2SGX30DF780C7 | EP2SGX30DF780C5N | EP2SGX30DF780C5 |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (DF780) | 780-ball FC-FBGA (DF780) - same | 780-ball FC-FBGA (DF780) - same | 780-ball FC-FBGA (DF780) - same | 780-ball FC-FBGA (DF780) - same | 780-ball FC-FBGA (DF780) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 33,880 | 33,880 - same | 33,880 - same | 33,880 - same | 33,880 - same | 33,880 - same |
| User I/O | 361 | 361 - same | 361 - same | 361 - same | 361 - same | 361 - same |
| Speed Grade | I4 (industrial, mid-fast) | I3 (industrial, slower) | C7 (commercial, slowest) | C7 (commercial, slowest, Pb) | C5 (commercial, faster than I4) | C5 (commercial, faster, Pb) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Mid-density Stratix II GX with full transceiver capability (vs EP2SGX90EF1152I4N)
- Stratix II GX with integrated multi-gigabit transceivers (vs EP2SGX30CF780I4 (non-GX))
- Industrial-grade temperature silicon (vs EP2SGX30DF780C5N (commercial grade))
Design Notes
Estimated: The Stratix II GX core draws substantial current at 1.2 V. From PowerPlay early estimates for a 33,880-LE utilization at 622 MHz, core current is typically 1-3 A depending on toggle rate. Designers must provision separate 1.2 V, 2.5 V, 3.3 V, and transceiver supply rails with low-noise LDMs (Low Dropout Monitors). Each transceiver channel requires dedicated analog supply filtering; follow Stratix II GX PCB layout guidelines for power plane splitting. Total worst-case power can exceed 15 W, requiring thermal management.
The 780-ball FC-FBGA at 1 mm pitch requires microvia PCB technology (HDI - High Density Interconnect) with stacked or staggered microvias. Standard 8-layer stack-ups can host this part but require laser-drilled vias. Use 50-ohm controlled-impedance routing for single-ended I/O and 100-ohm differential routing for transceiver channels. Length matching tolerance for transceiver lanes is typically within 150 mils per Intel guidelines. Decoupling capacitors must be placed within 100 mils of each power pin.
Estimated: The FC-FBGA package dissipates heat primarily through the die and BGA balls. For 15 W dissipation and 1 mm pitch BGA, thermal vias under the package thermal pad (if exposed) or spreader are required. Industrial-grade operation to +85C requires junction-to-ambient thermal resistance below 2 C/W for reliability, typically achieved with 4-layer PCBs and bottom-side copper flooding. Use JEDEC JESD51 thermal test methodology to characterize your design.
Stratix II GX transceivers require matched 100-ohm differential routing with AC-coupling capacitors on each transmit lane. Reference Intel's Stratix II GX PCB Design Guidelines for lane-to-lane skew budgets (typically <20 ps for 6.375 Gbps signals). Use IBIS-AMI models for channel simulation; the Stratix II GX IBIS-AMI models are available from Intel's design tools. Eye-diagram compliance must be verified at the receiver side with proper de-emphasis and equalization settings.
Common mistakes: (1) Using non-HDI PCB technology - the 1 mm pitch BGA balls cannot be reliably fan-out with through-hole vias alone. (2) Sharing transceiver analog supplies with digital logic - keep them isolated with ferrite beads. (3) Incorrect VCCIO bank voltages - verify each I/O bank matches your I/O standard before configuration. (4) Omitting the JTAG chain pull-up resistors - active-high or active-low per Quartus II programmer settings.
Compliance Information
RoHS, REACH, AEC-Q100, lead-free, and halogen-free status not explicitly stated in verified web data. The 'I4' suffix indicates industrial temperature grade only. For automotive designs, AEC-Q100 is not applicable to standard Stratix II GX parts - use automotive-qualified Cyclone or newer automotive-grade FPGAs.
