EP2SGX30DF780C5 - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
MPN: EP2SGX30DF780C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $591.73 | $591.73 |
| 10 | $532.56 | $5,325.60 |
| 100 | $473.38 | $47,338.00 |
| 500 | $421.07 | $210,535.00 |
| 1,000 | $384.62 | $384,620.00 |
EP2SGX30DF780C5 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor integrated circuit whose logic fabric, routing, and I/O can be electrically programmed after manufacturing, making it part of the programmable logic hierarchy (FPGA -> PLD -> programmable logic -> semiconductor). FPGAs are widely used in applications requiring high-speed parallel processing, custom I/O protocols, and rapid prototyping where ASIC NRE costs are not justified. Stratix II GX parts specifically target high-speed serial I/O designs such as communications, broadcast video, and military/aerospace systems.
Key features include 4 transceiver blocks supporting up to 3.125 Gbps per channel, dedicated DDR/DDR2/QDR memory interface hardware with read/write leveling, 16 global clock networks, and enhanced DSP blocks. The device integrates 4 PLL/DLL blocks per quadrant with reprogrammable phase shifts. The 780-ball FBGA (29 x 29 mm, 1 mm pitch) supports up to 361 user I/Os (per Mouser summary) for LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X interfacing.
The Stratix II GX architecture uses an ALM (Adaptive Logic Module) structure rather than traditional 4-input LUTs, giving finer granularity and lower logic utilization. Transceivers operate from 600 Mbps to 3.125 Gbps with dynamic reconfiguration and support for PCI Express, Serial RapidIO, XAUI, and CPRI protocols. Configuration is via enhanced configuration plus error detection with CRC and watchdog timer.
Typical applications include high-speed serial backplanes, broadcast video processing, telecom line cards, PCIe endpoint devices, and DSP co-processing. When designing with this device, ensure the PCB supports 1 mm-pitch BGA breakout with microvia or HDI stack-up, and reference Altera's Stratix II GX Handbook for transceiver channel placement and power distribution network design.
Drop-in alternatives for EP2SGX30DF780C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780C5 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780C4
✅ Drop-In✓ In Stock
$112 / Unit
View Datasheet →EP2SGX30DF780C3
✅ Drop-In✓ In Stock
$797.98 / Unit
View Datasheet →EP2SGX30DF780C4N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30DF780C3N
✅ Drop-In✓ In Stock
$95.5 / Unit
View Datasheet →EP2SGX30CF780C5
✅ Drop-In✓ In Stock
$248 / Unit
View Datasheet →EP2SGX30CF780C5N
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP2SGX30DF780C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements (LE) | 33,880 |
| LABs/CLBs | 1694 |
| Total RAM Bits | 1,369,728 bits |
| Number of Logic Cells | 33,880 cells |
| Maximum User I/Os | 361 |
| Transceiver Channels | 4 (up to 3.125 Gbps each) |
| Internal Frequency (max) | 609.76 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +85C (commercial) |
| Package | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Speed Grade | -5 |
EP2SGX30DF780C5 780-ball fbga (fc-fbga), 29 x 29 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX30DF780C5 (780-ball fbga (fc-fbga), 29 x 29 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780C5 is suitable for 6 applications: High-Speed Serial Backplane, Broadcast Video Processing, PCI Express Endpoint Device, DSP Co-Processing Card, Telecom Line Card, Industrial Control and Test Equipment.
High-Speed Serial Backplane
The EP2SGX30DF780C5 is well suited for high-speed serial backplane designs in telecom and datacom line cards. Its 4 integrated transceivers operate up to 3.125 Gbps per channel with dynamic reconfiguration and protocol support for XAUI, Serial RapidIO, and PCI Express. The 33,880 logic elements plus 1.4 Mbit embedded RAM provide enough fabric for SERDES adaptation, link training, and protocol stack processing. The 780-ball FBGA with 361 user I/Os exposes parallel LVDS lanes for backplane routing, and the dedicated DDR/DDR2/QDR memory controllers enable direct attachment of external packet buffer memory. Designers typically implement this with the transceiver channels placed on the edge of the package to minimize signal length to the backplane connector.
Recommended
Broadcast Video Processing
The EP2SGX30DF780C5 fits broadcast video processing and SDI/HD-SDI routing applications that require high-speed serial I/O for uncompressed video transport. With 3.125 Gbps transceivers, the device handles SMPTE 424M (3G-SDI) data rates per channel with headroom for cable equalization and reclocking. The 33,880 logic elements accommodate video format conversion, color space processing, and frame buffer management, while the 1.4 Mbit embedded RAM supports line buffers for deinterlacing and scaling. Commercial temperature grade -40C to +85C suits broadcast equipment environments. The 780-FBGA package provides the high pin density needed for parallel video bus expansion alongside serial SDI ports.
Recommended
PCI Express Endpoint Device
The EP2SGX30DF780C5 is widely used as a PCI Express endpoint device in test equipment, frame grabbers, and DSP accelerator cards. The integrated transceivers support PCIe Gen1 with x1 or x4 lane configurations through Altera's hard IP block, eliminating soft-logic overhead. The 780-FBGA package exposes the PCIe reference clock and PERn/PETn pairs cleanly on dedicated pins with matched length routing. The 33,880 logic elements provide capacity for DMA engines, device drivers, and application-layer processing. Quartus II includes the PCIe Compiler tool that generates the complete protocol stack and pin assignments for this device.
Recommended
DSP Co-Processing Card
The EP2SGX30DF780C5 works well as a DSP co-processor card in medical imaging, radar signal processing, and software-defined radio applications. The device's enhanced DSP blocks provide dedicated multiply-accumulate hardware that accelerates FFT, FIR, and matrix operations. With 1.4 Mbit of embedded RAM, intermediate FFT stages can be processed in-chip without external memory bottlenecks. The transceivers enable high-speed ADC/DAC interface through protocols like JESD204 (with soft IP) or LVDS-based parallel ADC interfaces. The 780-FBGA package supports the high pin count needed for parallel ADC/DAC data buses plus serial control channels.
Recommended
Telecom Line Card
The EP2SGX30DF780C5 is a proven telecom line card FPGA for legacy SONET/SDH, CPRI, and OBSAI framer designs deployed in base station baseband units. The transceivers support CPRI data rates up to 3.072 Gbps with deterministic latency required by mobile base station architectures. The 33,880 logic elements handle protocol encapsulation, mapping, and traffic management, while dedicated SERDES hardware eliminates the need for external PHY chips. Commercial temperature grade suits controlled-environment central office deployments. Long-term availability through Intel's extended lifecycle program supports multi-year telecom platform refresh cycles.
Recommended
Industrial Control and Test Equipment
The EP2SGX30DF780C5 fits industrial control and automated test equipment (ATE) applications requiring custom timing, protocol conversion, and parallel I/O fan-out. The 361 user I/Os handle multiple LVDS or LVCMOS buses simultaneously, while transceivers provide high-speed links to host controllers or other test instruments. The 1.4 Mbit embedded RAM supports pattern storage for ATE stimulus generation. Industrial users appreciate the legacy long-term availability of the 780-FBGA package, as designs can be maintained for decades without forced requalification. The -40C to +85C operating range suits factory floor environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780C4 | EP2SGX30DF780C3 | EP2SGX30DF780C4N | EP2SGX30DF780C3N | EP2SGX30CF780C5 | EP2SGX30CF780C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FBGA (29x29 mm) | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same | 780-ball FBGA (29x29 mm) - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | -5 | -4 (faster) | -3 (fastest) | -4 (faster) | -3 (fastest) | -5 | -5 |
| Transceivers | 4 channels, 3.125 Gbps | 4 channels, 3.125 Gbps | 4 channels, 3.125 Gbps | 4 channels, 3.125 Gbps | 4 channels, 3.125 Gbps | 0 channels (suffix C) | 0 channels (suffix C, Pb-free) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Process / Core Voltage | 90nm / 1.2V | 90nm / 1.2V | 90nm / 1.2V | 90nm / 1.2V | 90nm / 1.2V | 90nm / 1.2V | 90nm / 1.2V |
Key Differentiators
- Integrated 3.125 Gbps transceivers with hard PCIe Gen1 IP (vs EP2SGX30CF780C5)
- 33,880 logic elements in 780-FBGA with 361 user I/Os (vs EP2S60F672C5)
- Stratix II GX ALM architecture vs traditional 4-LUT (vs Stratix (original) family FPGAs)
Design Notes
The 780-ball FBGA package uses 1mm pitch, requiring HDI PCB stack-up with laser-drilled microvias for breakout routing. Plan at least a 4-2-4 or 6-layer stack-up with dedicated transceiver ground reference planes. Transceiver channels should be routed on the outer layers or stripline on inner layers with controlled impedance of 100 ohm differential, with length matching to within 5 mils per channel. Reference Altera's Stratix II GX Handbook PCB Design Guidelines section for full channel layout recommendations and via-to-pad anti-pad sizing.
Power sequencing for the EP2SGX30DF780C5 must follow Altera's recommended power-up sequence: VCCIO first (3.3V or 2.5V), then VCC (1.2V core), then VCCAUX, with monotonic ramp times and maximum delta of 100ms between rails. Use a multi-rail controller with PG (power-good) signal cascading. Decoupling: place 0.1uF X7R capacitors on every VCC pin within 100 mils, plus bulk capacitors (10uF to 47uF tantalum or ceramic) at each power plane entry. Transceiver PLLs require dedicated filtered analog supplies (VCCH_GXB, VCCA_GXB) with ferrite bead isolation.
Estimated: at maximum logic utilization with all 4 transceivers active, the EP2SGX30DF780C5 can dissipate up to 8-10W typical. The 780-FBGA has no integrated heatsink, so thermal relief relies on PCB copper area, thermal vias under the BGA, and optionally a heatsink attached with thermal interface material. Place thermal via arrays (0.3mm drill, 1.2mm pitch) directly under the BGA to conduct heat to internal copper planes. Without these, junction temperature can exceed 100C at elevated ambient. Reference Altera's Thermal Design Guide for Stratix II devices.
Do not confuse the EP2SGX30DF780C5 (with transceivers, suffix D) with the EP2SGX30CF780C5 (no transceivers, suffix C). The ball map differs at the transceiver pins - the C variant repurposes them as additional user I/Os. When migrating between speed grades (-5 to -4 to -3), verify that the Quartus II fitter settings and timing constraints are regenerated, since each speed grade has different timing parameters. Finally, JTAG configuration pins (TCK, TMS, TDI, TDO) must be pulled to defined states if JTAG is not used to avoid floating inputs.
Compliance Information
RoHS status not confirmed in verified web data; the N-suffix variants (e.g. EP2SGX30DF780C4N) are explicitly lead-free per Intel/Altera ordering nomenclature. Not AEC-Q100 qualified (commercial/industrial FPGA, not automotive).
