EP2SGX90EF1152I4N - 90k LEs Stratix II GX FPGA, 1152-BGA | Intel
MPN: EP2SGX90EF1152I4N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1780 | $17,800.00 |
| 100 | $1695 | $169,500.00 |
| 500 | $1620 | $810,000.00 |
| 1,000 | $1550 | $1,550,000.00 |
EP2SGX90EF1152I4N Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic fabric, routing, and I/O can be configured after manufacture to implement arbitrary digital functions. FPGAs occupy the middle ground between fixed-function ASICs and software-defined processors: ASICs offer higher volume efficiency but no post-silicon flexibility, while FPGAs trade cost-per-unit for rapid prototyping, field upgradability, and parallel hardware acceleration. Within the taxonomy of programmable logic, the EP2SGX90EF1152I4N sits in the high-end transceiver-equipped tier, alongside other Stratix II GX and contemporary Virtex-5 LXT/SXT FPGAs, used wherever multi-gigabit serial links, high logic density, and deterministic latency must coexist.
Key device features include a 717-732 MHz internal operating frequency, embedded multiplier/DSP blocks, a flexible PLLEU clock network, and high-speed LVDS and memory interfaces. The GX variant adds multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CPRI. The 1152-ball FBGA package provides sufficient I/O and power/ground integrity for transceiver and DDR2/QDR II memory applications, with industrial-grade operating temperature support and lead-free compliance per the verified manufacturer data.
The architecture combines logic elements, embedded RAM (TriMatrix), DSP blocks, and transceivers on a single die, with a hierarchical interconnect optimized for high fan-out. Hard intellectual property (IP) blocks for memory controllers and PLLs reduce soft-logic overhead and free fabric for application logic, while the 90 nm process delivers a favorable performance-per-watt ratio for its generation.
Typical applications include high-speed serial backplane bridging, wireless baseband processing, video and imaging pipelines, test and measurement equipment, and defense/aerospace signal processing. The integrated transceivers make it well suited for line-card designs requiring multi-gigabit links, while the large logic and memory capacity supports deep packet buffers and wide datapaths.
When designing with this part, allocate transceiver channels first (pin/bank assignments are fixed by package), then DDR2/QDR II memory interfaces (which consume dedicated DQS pins), and place the configuration scheme (EPC16 or JTAG) on dedicated pins. The 1152-ball FBGA requires a multi-layer PCB with controlled-impedance routing for transceivers and matched-length traces for DDR2 interfaces.
This page synthesizes distributor pricing, package dimensions, drop-in alternatives from the Stratix II GX and adjacent families, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP2SGX90EF1152I4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152I4N (same form factor and footprint) β differing in Package, Operating Temperature Grade, Transceivers, Family, Series.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1152I4
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$3750 / Unit
View Datasheet βEP2SGX90EF1152I3N
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View Datasheet βEP2SGX90EF1152C5N
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View Datasheet βEP2SGX60EF1152I4N
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View Datasheet βEP2SGX130GF1508I4N
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View Datasheet βEP2SGX90EF1152I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Total Memory Bits | 4,520,448 |
| Number of LABs/CLBs | 4,548 |
| Number of Logic Elements/Cells | 90,960 |
| Total RAM Bits | 4,520,448 |
| Number of I/O | 558 |
| Number of Transceivers | 12 |
| Operating Frequency | 717 MHz to 732.1 MHz |
| Process Technology | 90 nm CMOS |
| Package | 1152-BBGA (FBGA-1152, MS-034AAR-1) |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Lead Free | Yes |
EP2SGX90EF1152I4N 1152-bbga (fbga-1152, ms-034aar-1) Pin Configuration Guide
Pin configuration for EP2SGX90EF1152I4N (1152-bbga (fbga-1152, ms-034aar-1) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152I4N is suitable for 6 applications: Multi-Gigabit Serial Backplane Bridging, Wireless Baseband Processing, High-Definition Video Processing Pipelines, Test and Measurement Instrumentation, Defense and Aerospace Signal Processing, Industrial Protocol Bridge and Gateway.
Multi-Gigabit Serial Backplane Bridging
The EP2SGX90EF1152I4N's 12 integrated multi-gigabit transceivers support backplane protocols such as XAUI, Serial RapidIO, and PCI Express, enabling 4-lane and 8-lane aggregation across line cards. The 90,960 logic elements accommodate MAC-layer processing, link-training state machines, and protocol-aware buffering, while 4.5 Mbits of TriMatrix memory provide per-channel elastic buffers and statistics counters. Compared with a Stratix IV solution, this 90 nm part delivers comparable link performance at lower per-unit cost where power and density headroom are not primary constraints. PCB layout must enforce 100-ohm differential routing and length matching within 150 mils for the transceiver channels.
Recommended
Wireless Baseband Processing
The EP2SGX90EF1152I4N is well suited to wireless baseband signal processing for 3G/4G fronthaul and small-cell applications, where its 12 transceivers carry CPRI or OBSAI links to remote radio heads and its 90,960 LEs implement FFT, channelization, and digital up/down-conversion. Embedded DSP blocks accelerate multiply-accumulate operations critical to crest-factor reduction and digital pre-distortion, while TriMatrix memory stores tap-delay line and HARQ buffers. The industrial -40C to +100C temperature grade supports outdoor base-station enclosures, and the FBGA-1152 package provides the power/ground integrity required for sustained multi-gigabit operation.
Recommended
High-Definition Video Processing Pipelines
The 558 user I/O and 4.5 Mbits of embedded memory on the EP2SGX90EF1152I4N enable multi-stream HD-SDI and DisplayPort processing for broadcast video routers, video conferencing codecs, and medical imaging equipment. The high logic count supports de-interlacing, scaling, color-space conversion, and frame-rate conversion in real time without external ASSP dependencies. The transceiver channels can drive 3G-SDI over fiber or interface to HDMI/DP repeater chips, while the 717-732 MHz fabric comfortably meets the throughput required for 1080p60 RGB pipelines. Quartus II design tools provide Video and Image Processing (VIP) suite IP for rapid development.
Recommended
Test and Measurement Instrumentation
The EP2SGX90EF1152I4N's combination of 90,960 LEs, 12 transceivers, and 4.5 Mbits of memory is ideal for digital storage oscilloscopes, logic analyzers, and protocol testers. The transceiver channels capture multi-gigabit serial traffic (PCIe, USB 3.0, SATA) while the fabric implements deep trigger sequencers, real-time compression, and on-screen display. The 1152-ball FBGA package offers the I/O and power integrity for 558 high-speed signals without exceeding standard board-stack-up constraints. Industrial temperature rating supports laboratory and field-deployed equipment.
Recommended
Defense and Aerospace Signal Processing
The EP2SGX90EF1152I4N's industrial temperature range and high logic density support radar, electronic-warfare, and secure-communication signal-processing subsystems where multi-gigabit serial links connect to ADC/DAC front-ends. The 12 transceivers enable direct ADC-to-FPGA (JESD204-style or proprietary) connectivity and backplane distribution. The TriMatrix memory provides delay-line and correlator storage for matched-filter and pulse-Doppler processing, and the DSP blocks accelerate FFT and matrix operations. The lead-free 1152-ball FBGA is suitable for ITAR-controlled programs with appropriate long-lifecycle planning.
Recommended
Industrial Protocol Bridge and Gateway
The EP2SGX90EF1152I4N's 558 user I/O, 12 transceivers, and large logic fabric are well matched to multi-protocol industrial gateways that bridge PROFINET, EtherCAT, Modbus TCP, and serial field-bus to backhaul Ethernet and PCIe links. The fabric implements deterministic cycle-time scheduling, time-sensitive networking (TSN) shaping, and protocol-stack acceleration, while the transceivers drive SFP/SFP+ backhaul to supervisory networks. The 4.5 Mbits of memory buffer high-water-mark queueing and statistics, and the 1152-ball FBGA supports the heterogeneous signal mix (LVDS, LVCMOS, differential) typical of industrial I/O modules.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152I4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152I4 | EP2SGX90EF1152I3N | EP2SGX90EF1152C5N | EP2SGX60EF1152I4N | EP2SGX130GF1508I4N |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA (FBGA-1152) | 1152-BBGA (FBGA-1152) - same | 1152-BBGA (FBGA-1152) - same | 1152-BBGA (FBGA-1152) - same | 1152-BBGA (FBGA-1152) - same | 1508-BGA (FBGA-1508) - larger |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 60,440 | 132,540 |
| Number of Transceivers | 12 | 12 | 12 | 12 | 8 | 20 |
| Total Memory Bits | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 2,544,192 | 6,747,840 |
| Speed Grade | I4 (industrial, mid-speed) | I4 (same) | I3 (slower) | C5 (commercial, slower) | I4 (same) | I4 (same) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | -40C to +100C | -40C to +100C |
Key Differentiators
- Highest-density Stratix II GX option in 1152-ball FBGA package (vs EP2SGX60EF1152I4N)
- Industrial temperature grade for harsh-environment deployments (vs EP2SGX90EF1152C5N)
- Mid-range speed grade (I4) balances performance and yield (vs EP2SGX90EF1152I3N)
Design Notes
The 1152-ball FBGA package requires a multilayer PCB (typically 8-12 layers) with 1.0 mm ball pitch. Use Intel's package-symbol and pin-out files in Quartus II Pin Planner to generate precise ball assignments. Route transceiver channels as 100-ohm differential pairs with length matching within 150 mils, and provide a continuous ground reference plane under the BGA for power/ground integrity. Decoupling capacitors should be placed on the BGA-side of the package, with a mix of 100 nF, 10 nF, and 1 uF values to cover the frequency spectrum of the multi-gigabit transceivers.
Estimate: at 100% logic utilization with 12 transceivers operating at 3.125 Gbps, total power consumption can approach 15-20 W. Provide a minimum 4-layer PCB with dedicated VCCINT, VCCA, VCCPD, and VCCIO planes, and use a multi-rail power supply such as a dedicated regulator module. Sequence the supplies per the Stratix II GX power-up guidelines: VCCINT first, then VCCPD, then VCCIO, and finally VCCA for the transceivers to avoid latch-up. Add 100 uF bulk capacitance near the package and 0.1 uF + 10 uF local decoupling per power pin group.
Do not mix transceiver channels and general-purpose I/O on the same bank without consulting the pin-out file. Do not exceed the maximum transceiver lane count per side of the device (typically 6 per side on the 1152-FBGA) to avoid signal-integrity issues. Ensure the configuration scheme (EPC16, AS, PS, or JTAG) is correctly assigned and that the CONF_DONE and nSTATUS pins are pulled up per datasheet. Finally, always run Quartus II fitter reports to verify that the design meets timing across all operating conditions, particularly the I4 industrial speed grade derating.
Compliance Information
Lead-free per verified manufacturer data. RoHS and REACH status not directly confirmed in provided web data; refer to the manufacturer datasheet for definitive compliance statements. AEC-Q100 is not applicable as this is a commercial/industrial-grade FPGA.
