EP2SGX30DF780I4NK - Stratix II GX FPGA 33.8K LE 780-FBGA | Intel
MPN: EP2SGX30DF780I4NK ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.75 | $24,575.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198.5 | $198,500.00 |
EP2SGX30DF780I4NK Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic function is defined after manufacture by the customer rather than at the foundry, sitting in the taxonomy of programmable logic devices (PLD) → FPGA → high-density FPGA. Stratix II GX devices extend this taxonomy by embedding multi-gigabit transceivers alongside the programmable fabric, targeting high-speed serial I/O for line cards, video bridging, and wireless baseband processing. Understanding the role of the FPGA class clarifies why parts such as EP2SGX30DF780I4NK are specified by logic-element count, memory block count, transceiver count, and package ball map rather than by a fixed function name.
Key features of the EP2SGX30DF780I4NK include 1,694 logic array blocks (LABs) with adaptive logic module (ALM) architecture, 1,369,728 bits of embedded RAM arranged as TriMatrix memory blocks, four phase-locked loops (PLLs), and embedded high-speed transceivers capable of multi-gigabit operation. Industrial temperature grade (-40 °C to +100 °C) is indicated by the 'I' suffix, while 'N' denotes a lead-free / RoHS-compliant package and 'K' designates a specific speed grade or feature set per the Stratix II GX ordering code.
Architecturally, Stratix II GX devices pair the ALM-based logic fabric with dedicated transceiver circuitry, supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 780-pin FC-FBGA with 1 mm ball pitch provides the routing density required for hundreds of user I/Os and multiple transceiver channels, while keeping the die-to-package electrical path short enough for multi-gigahertz signalling.
Typical applications include high-speed serial interface bridging, telecommunications line-card backplanes, video broadcast infrastructure, military radar signal processing, and wireless baseband prototyping. Industrial temperature grade makes the EP2SGX30DF780I4NK suitable for outdoor telecom cabinets, factory automation controllers, and other non-thermally-controlled environments.
When designing with this device, ensure the Quartus II design software version supports Stratix II GX (Quartus II v9.1 or later with appropriate service packs), and verify that PCB layout accommodates the 1 mm pitch BGA escape routing. Power-supply sequencing must respect the 1.2 V core, 3.3 V I/O, and transceiver supply rails, including proper PLL filtering.
This page synthesizes distributor stock and pricing data, drop-in and same-family Intel Stratix II GX alternatives, and practical design notes that go beyond the manufacturer datasheet table.
Drop-in alternatives for EP2SGX30DF780I4NK — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780I4NK (same form factor and footprint) — differing in Package, Mounting Type, Process Technology, Logic Elements, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780I4N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30DF780I4
✅ Drop-In✓ In Stock
$178.25 / Unit
View Datasheet →EP2SGX30DF780I3N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30CF780I4N
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EP2SGX30CF780I4
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2SGX30CF780I5N
✅ Drop-In✓ In Stock
$1050 / Unit
View Datasheet →EP2SGX30DF780I4NK Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Logic Elements | 33880 |
| Logic Array Blocks (LABs) | 1694 |
| Total Memory Bits | 1369728 |
| User I/O Count | 361 |
| Nominal Core Supply Voltage | 1.2 V |
| Maximum Internal Clock Frequency | 717 MHz |
| Process Technology | 90 nm |
| Number of PLLs | 4 |
| Package | 780-ball FC-FBGA, 29 x 29 mm, 1 mm pitch |
| Package Outline Reference | MS-034AAM-1 |
| Temperature Grade | Industrial (-40C to +100C) |
| RoHS Status | Lead-free / RoHS compliant (N suffix) |
| Mounting Type | Surface Mount (BGA) |
EP2SGX30DF780I4NK ms-034aam-1 Pin Configuration Guide
Pin configuration for EP2SGX30DF780I4NK (ms-034aam-1 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780I4NK.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780I4NK is suitable for 7 applications: Telecommunications Line-Card Backplane Bridging, High-Speed Video Broadcast Infrastructure, Wireless Baseband Prototyping, Military Radar Signal Processing, Industrial Factory Automation Controllers, Medical Imaging Accelerator Cards, Test and Measurement Instrumentation.
Telecommunications Line-Card Backplane Bridging
The EP2SGX30DF780I4NK's embedded multi-gigabit transceivers and 361 user I/Os make it ideal for telecom line-card backplane bridging. The Stratix II GX fabric supports protocols such as Serial RapidIO, SPI-4.2, and PCI Express, allowing the device to glue optical transponders to network processors without external PHYs. With 33,880 logic elements and 1.3 Mbit of TriMatrix memory, designers can implement packet queuing, traffic shaping, and link-layer state machines on-chip, reducing bill-of-materials cost. Compared to a multi-chip SERDES-plus-FPGA solution, the integrated transceivers shorten the PCB routing distance, lower jitter, and reduce BOM cost. Designers should use the 1 mm-pitch 780-FBGA to route high-speed differential pairs with controlled impedance and length matching per Stratix II GX guidelines.
Recommended
High-Speed Video Broadcast Infrastructure
Broadcast video routers and contribution encoders use FPGAs like the EP2SGX30DF780I4NK to bridge SDI, HDMI, and IP-based ST 2022 / ST 2110 video streams. The device's integrated transceivers handle 3G-SDI and SMPTE 2022 coax links while the ALM fabric performs format conversion, scaling, and embedding. Industrial temperature grade ensures reliable operation in equipment-room chassis where ambient temperatures vary widely. With 361 user I/Os, the FPGA can drive multiple parallel video buses plus GPIO for control-plane signalling. The 780-FBGA provides sufficient I/O density for typical 8-12 channel video processing cards. Recommended companion chips include SDI cable equalizers and HDMI retimers from third-party vendors.
Recommended
Wireless Baseband Prototyping
Wireless infrastructure prototyping platforms use Stratix II GX devices like the EP2SGX30DF780I4NK for LTE, WiMAX, and early 5G baseband experimentation. The 33,880 logic elements, four PLLs, and embedded transceivers provide enough compute and SERDES bandwidth for multi-antenna MIMO signal chains. Designers implement FFT/IFFT blocks, channel coders, and CPRI/OBSAI fronthaul interfaces on the same die. Industrial temperature grade suits outdoor macro-cell base-station prototypes. Quartus II DSP Builder and the ALM DSP blocks accelerate baseband IP integration. Compared with a DSP-plus-ASIC approach, an FPGA enables rapid algorithm iteration across multiple OFDM numerologies without mask charges.
Recommended
Military Radar Signal Processing
Defense and aerospace radar systems rely on FPGAs such as the EP2SGX30DF780I4NK for real-time digital signal processing on phased-array antenna data. The ALM fabric accelerates FFT, pulse compression, and CFAR detection algorithms, while the embedded transceivers stream digitized RF samples from A/D converters to the FPGA at multi-gigabit rates. The industrial temperature grade, when paired with ruggedized PCB and conformal coating, supports ground-mobile and naval radar platforms. With 1.3 Mbit of TriMatrix memory, designers can buffer multiple PRI (pulse repetition interval) snapshots for moving-target indication. The 780-FBGA and 1 mm pitch require ITAR-aware PCB manufacturing but enable dense, vibration-tolerant assemblies.
Recommended
Industrial Factory Automation Controllers
Factory automation line controllers leverage the EP2SGX30DF780I4NK for EtherCAT, PROFINET, and SERCOS III master interfaces, plus high-speed deterministic motion control loops. The 361 user I/Os and multi-gigabit transceivers support multiple industrial Ethernet channels alongside parallel encoder and resolver interfaces. Industrial temperature grade (-40 C to +100 C) is essential for control cabinets without air conditioning. The 33,880 LEs are sufficient to implement a soft PLC plus multi-axis motion planner on a single chip, reducing BOM count versus a microcontroller-plus-ASIC solution. The 780-FBGA with 1 mm pitch fits standard 6-layer control-board stacks.
Recommended
Medical Imaging Accelerator Cards
Medical imaging systems such as ultrasound and CT scanners use FPGAs like the EP2SGX30DF780I4NK for beamforming, image reconstruction, and real-time filtering. The device's parallel ALM fabric performs FIR filtering and back-projection at rates suitable for mid-tier ultrasound carts, while the embedded transceivers stream digitized RF from probe heads. The 1.3 Mbit of TriMatrix memory buffers beamformed scan lines for downstream processing. Industrial temperature grade supports mobile cart platforms. Compared with a GPU-based reconstruction pipeline, the FPGA delivers deterministic latency critical for real-time imaging. Designers must follow IEC 60601-1 isolation rules when integrating the 780-FBGA into medical-grade chassis.
Recommended
Test and Measurement Instrumentation
High-end test and measurement instruments such as protocol analyzers, BER testers, and logic analyzers use the EP2SGX30DF780I4NK as a pattern generator or capture engine. The multi-gigabit transceivers drive and sample high-speed serial lanes (PCIe, USB 3.0, SATA), and the 33,880 LEs implement protocol-aware state machines. Industrial temperature grade supports lab-bench and field-deployed test sets. The 361 user I/Os provide ample probe channels for parallel stimulus/response. The 1.2 V core and multiple PLL outputs simplify clocking architectures for jitter injection and wander generation. Compared with a fixed-function protocol analyzer, the FPGA offers reconfigurability across evolving serial standards.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780I4NK — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780I4N | EP2SGX30DF780I4 | EP2SGX30DF780I3N | EP2SGX30CF780I4N |
|---|---|---|---|---|---|
| Package | 780-FBGA, 29x29 mm, 1 mm pitch | 780-FBGA, 29x29 mm, 1 mm pitch - same | 780-FBGA, 29x29 mm, 1 mm pitch - same | 780-FBGA, 29x29 mm, 1 mm pitch - same | 780-FBGA, 29x29 mm, 1 mm pitch - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 33880 | 33880 | 33880 | 33880 | 33880 |
| Total Memory Bits | 1369728 | 1369728 | 1369728 | 1369728 | 1369728 |
| User I/Os | 361 | 361 | 361 | 361 | 361 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial |
| Speed Grade | I4 | I4 | I4 | I3 (slower) | I4 |
| Package Variant (D vs C) | D variant | D variant | D variant | D variant | C variant |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Integrated multi-gigabit transceivers eliminate external SERDES PHYs (vs Xilinx Virtex-5 SX95T (same era, cross-brand equivalent class))
- K-suffix screening for higher reliability applications (vs EP2SGX30DF780I4 (without K))
- Industrial temperature grade for non-thermally-controlled environments (vs Commercial temperature variants EP2SGX30CF780C5N / C7N)
Design Notes
The 780-FBGA at 1 mm pitch requires a multilayer PCB (typically 8+ layers) with laser-drilled microvias for inner-row escape. Use the Stratix II GX device handbook ball-out to plan fanout; recommend via-in-pad with filled-and-capped microvias to meet the 1 mm pitch BGA escape rules. Maintain continuous reference planes under the BGA for high-speed transceiver lane integrity, and length-match SERDES differential pairs per Stratix II GX channel-bonding guidelines.
Stratix II GX devices require multiple supply rails: 1.2 V VCCINT (core), 3.3 V VCCIO (I/O banks), and dedicated transceiver supplies (VCCA, VCCP, VCCH) plus PLL analog supplies. Per Altera-Intel design guidelines, follow the power-up sequencing requirement that VCCINT must ramp before or with VCCIO to avoid latch-up. Use a sequencer IC or carefully designed RC network. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors within 100 mil of every supply pin, with bulk capacitance distributed around the BGA perimeter.
The FC-FBGA package dissipates heat primarily through the die-to-PCB thermal path, so a thermal via array under the central balls is essential. Estimated: with industrial-grade ambient of 70 C and a typical Stratix II GX design at 60 percent utilization, expect 4-6 W dissipation. Use the Stratix II GX thermal model from the device handbook to compute junction temperature, and provide at least 25 thermal vias (0.3 mm drill) under the BGA center connected to inner copper planes for adequate heat spreading.
Common pitfalls include: (1) using Quartus versions older than v9.1 SP2 which lack final Stratix II GX device support; (2) ignoring the K-suffix marking difference and assuming it changes functionality - K is typically a screening option, not a logic variant; (3) selecting the C-package variant (EP2SGX30CF780) when the design depends on D-package transceiver lane mapping; (4) failing to specify lead-free (N-suffix) when RoHS compliance is required. Always confirm the ordering code against the Stratix II GX device handbook before committing to production.
Compliance Information
RoHS / lead-free compliance indicated by the 'N' suffix per Altera-Intel ordering convention. Industrial temperature grade '-40C to +100C' is designated by the 'I' in 'I4'. Halogen-free status not explicitly published in the provided data; marked 'unknown'. AEC-Q100 not applicable (FPGAs are not automotive-qualified under AEC-Q100 in this family).
