EP2SGX30CF780I5N - 33.88K Logic Cells Stratix II GX FPGA | Intel
MPN: EP2SGX30CF780I5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1620 | $16,200.00 |
| 100 | $1380 | $138,000.00 |
| 500 | $1190 | $595,000.00 |
| 1,000 | $1050 | $1,050,000.00 |
EP2SGX30CF780I5N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader semiconductor integrated circuit hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs contain configurable logic blocks (CLBs), programmable interconnect, and I/O blocks that engineers can reconfigure post-manufacturing to implement custom digital logic, signal processing pipelines, or even soft processors. The Stratix II GX family specifically integrates high-speed serial transceivers alongside the programmable fabric, making it suited for wired communication, broadcast video, and defense applications where serial I/O bandwidth matters.
Key features of the EP2SGX30CF780I5N include a 90 nm CMOS process technology, 1.2 V core supply operation, industrial-grade temperature range of -40C to +85C, embedded transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks, TriMatrix embedded memory, and enhanced clock management with phase-locked loops (PLLs). The 33,880 logic cells are organized into Logic Array Blocks (LABs) with a combinatorial delay of approximately 4.006 ns per LAB, enabling deterministic timing closure for high-speed designs.
The 780-ball FC-FBGA (Fine-pitch Ball Grid Array, Flip-Chip) package provides the high pin density required for the device's wide I/O count and high-performance signaling. This BGA package is mounted via surface-mount reflow processes and requires X-ray inspection to verify solder joint integrity. The industrial temperature grade (suffix 'I') makes the part suitable for non-automotive industrial, telecom, and test equipment deployments.
Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom baseband processing, video broadcast and image processing pipelines, software-defined radio (SDR), military and aerospace signal processing, and ASIC prototyping where designers validate logic before committing to a mask set.
When designing with this part, ensure your PCB layout supports flip-chip BGA escape routing with microvia or via-in-pad technology. Quartus II design software (legacy versions are still used for Stratix II GX) is required for synthesis, place-and-route, and bitstream generation. Verify transceiver reference clock jitter performance against your protocol's eye-mask requirements before committing to layout.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2SGX30CF780I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30CF780I5N (same form factor and footprint) — differing in Package, Speed Grade, Logic Elements, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30CF780C5N
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP2SGX30CF780I4N
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EP2SGX30CF780C7
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30CF780C6
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP2SGX30CF780C5
✅ Drop-In✓ In Stock
$248 / Unit
View Datasheet →EP2SGX30CF780C4N
✅ Drop-In✓ In Stock
$379 / Unit
View Datasheet →EP2SGX30CF780I5N Maximum Ratings & Electrical Characteristics
| Logic Cells | 33,880 |
| Logic Array Blocks (LABs) | 33,880 |
| Internal Frequency | 622 MHz max |
| Combinatorial Delay per LAB | 4.006 ns |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | FC-FBGA-780 |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Terminal Form | Ball (BGA) |
| Logic Family | CMOS, Stratix II GX |
| Number of Terminals | 780 |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Transceivers | Integrated multi-gigabit serial transceivers |
| Embedded Memory | TriMatrix memory blocks |
| DSP Blocks | Integrated DSP blocks |
EP2SGX30CF780I5N 29 x 29 mm Pin Configuration Guide
Pin configuration for EP2SGX30CF780I5N (29 x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30CF780I5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30CF780I5N is suitable for 6 applications: Telecom Baseband Processing, Software-Defined Radio (SDR), High-Speed Serial Interface Bridging, Video Broadcast and Image Processing, Military and Aerospace Signal Processing, ASIC Prototyping.
Telecom Baseband Processing
The EP2SGX30CF780I5N fits telecom baseband processing because its 33,880 logic cells and integrated multi-gigabit transceivers handle multi-channel DSP pipelines at 622 MHz internal frequency. Industrial temperature grade (-40C to +85C) meets telecom equipment environmental specs. Compared to ASICs, the FPGA allows protocol updates post-deployment, and versus smaller FPGAs, the 33K-cell capacity absorbs full baseband channel stacks without external companion chips. Quartus II compiled bitstreams run deterministically across telecom line-card duty cycles.
Recommended
Software-Defined Radio (SDR)
The EP2SGX30CF780I5N is well suited to SDR platforms because its multi-gigabit transceivers digitize wideband RF directly, while the 33,880 logic cells host the entire baseband DSP stack including FFTs, channelizers, and demodulators. Industrial temperature grade supports outdoor and ruggedized SDR deployments. The 1.2 V core supply and 90 nm CMOS process balance power consumption against DSP throughput, and Quartus II IP libraries include pre-verified FFT and DDC cores that target this exact device.
Recommended
High-Speed Serial Interface Bridging
The EP2SGX30CF780I5N targets serial interface bridging applications because its embedded transceivers natively support PCI Express, Serial RapidIO, and Gigabit Ethernet protocols up to multi-gigabit line rates. The 780-ball FC-FBGA package exposes enough I/O for multiple serial channels plus parallel system interfaces. Industrial temperature grade suits edge-server and telecom-cabinet environments, and the Quartus II toolchain ships protocol-specific reference designs targeting this device for rapid PCIe Gen1/Gen2 endpoint and root-port development.
Recommended
Video Broadcast and Image Processing
The EP2SGX30CF780I5N serves video broadcast and image processing because its 33,880 logic cells implement multi-stream HD video processing pipelines and its DSP blocks accelerate motion estimation and color-space conversion. The 622 MHz internal clock handles 1080p60 pixel rates with margin for advanced deinterlacing and scaling algorithms. Industrial temperature grade meets broadcast equipment rack specs, and the device's external memory interfaces support DDR2/DDR3 frame buffers required for full-HD processing.
Recommended
Military and Aerospace Signal Processing
The EP2SGX30CF780I5N fits military and aerospace signal processing because its industrial temperature range (-40C to +85C) handles avionics bay and ground-mobile thermal environments, and its deterministic 4.006 ns LAB delay supports hard real-time DSP latency budgets. The 90 nm CMOS process is mature and the part has long-term lifecycle support via Intel's military program. Multi-gigabit transceivers enable encrypted data-link and radar front-end interfacing, with Quartus II supporting MIL-STD design flows.
Recommended
ASIC Prototyping
The EP2SGX30CF780I5N is commonly used as an ASIC prototyping vehicle because its 33,880 logic cells map RTL blocks one-to-one from a pre-mask design, and its high-speed transceivers model ASIC SerDes interfaces. Quartus II supports incremental compile flows that allow partition-level debug during ASIC validation. Industrial temperature grade enables system-level bring-up in chassis environments, and the FC-FBGA-780 footprint is compatible with multiple prototyping board vendors in the FPGA emulation ecosystem.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30CF780I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30CF780C5N | EP2SGX30CF780I4N | EP2SGX30CF780C7 | EP2SGX30CF780C6 | EP2SGX30CF780C5 | EP2SGX30CF780C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-780 (29x29 mm, 1 mm pitch) | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same |
| Logic Cells | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | 5 (I5) | 5 | 4 (faster) | 7 (slower) | 6 | 5 | 4 (faster) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Internal Frequency | 622 MHz max | 622 MHz max | 622 MHz max | 622 MHz max | 622 MHz max | 622 MHz max | 622 MHz max |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Integrated Transceivers | Yes (multi-gigabit) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade in speed grade 5 (vs EP2SGX30CF780C5N)
- Mid-range speed grade with broad Quartus II support (vs EP2SGX30CF780I4N)
- Industrial temp vs commercial temp at slower speed (vs EP2SGX30CF780C7)
Design Notes
The FC-FBGA-780 package with 1.0 mm ball pitch requires microvia or via-in-pad PCB technology to escape the inner ball rows. Standard 0.4 mm via-pitch designs will not escape a 1 mm pitch BGA; use HDI (High-Density Interconnect) stack-up with laser-drilled microvias in a 1-2-1 or 2-4-2 build-up. Plan for at least 6 PCB layers with dedicated ground and power planes beneath the BGA, and allocate a continuous copper pour under the package for thermal dissipation and controlled impedance reference.
Estimated: At full logic utilization and 622 MHz operation, the EP2SGX30CF780I5N dissipates approximately 5 to 8 W of power into the FC-FBGA package. The FC-FBGA exposes a top-side thermal pad connection through the die-to-package substrate, so attach a heat spreader or heat sink with thermal interface material. For chassis designs without active airflow, derate junction temperature by 10-15C from datasheet max to account for thermal resistance stack-up including the BGA solder joint and PCB inner-plane spreading.
Three pitfalls to avoid with the EP2SGX30CF780I5N: (1) Do not mix I-grades and C-grades in the same production panel - speed-grade and temperature-grade mismatches cause timing closure failures at low temperature or thermal shutdown at high temperature. (2) Quartus II design software is required (not Quartus Prime) because the Stratix II GX family is end-of-life for the newer tool. (3) FC-FBGA packages require X-ray inspection after reflow - optical inspection alone cannot verify solder joint integrity beneath the package.
The multi-gigabit transceivers require controlled-impedance routing with 100-ohm differential pairs (for protocols like PCIe and Serial RapidIO) or 50-ohm single-ended with calibration (for legacy protocols). Maintain length matching within the transceiver channel-to-channel skew budget (typically 20-50 ps). Reference clock jitter must be below 1 ps RMS for the highest data rates; use a dedicated low-jitter clock generator rather than distributing from a noisy FPGA PLL output. Keep high-speed serial traces on the top microvia layer with no layer transitions where possible.
The EP2SGX30CF780I5N requires multiple supply rails: 1.2 V core, 2.5 V or 3.3 V I/O, 1.2 V or 1.5 V transceiver analog, and 1.2 V transceiver digital. Power-on sequencing matters - core voltage must reach 90 percent before I/O voltage ramps to prevent I/O driver back-powering through ESD clamps. Use a multi-rail power management IC with built-in sequencing, or a supervisor circuit to enforce the correct start-up order. Decoupling must include both bulk capacitors (47-100 uF) at the package perimeter and high-frequency 0.1 uF and 1 nF capacitors directly under the BGA on the bottom side.
Compliance Information
RoHS, REACH, and lead-free status were not provided in the verified web data and could not be verified; consult Intel product compliance documentation directly. AEC-Q100 does not apply - this is a commercial/industrial-grade FPGA, not an automotive-qualified part.
