EP2SGX30DF780C3N - Stratix II GX FPGA, 33.9K LE, 780-FBGA | Intel
MPN: EP2SGX30DF780C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162.5 | $1,625.00 |
| 100 | $138.75 | $13,875.00 |
| 500 | $115 | $57,500.00 |
| 1,000 | $95.5 | $95,500.00 |
EP2SGX30DF780C3N Overview
What is an FPGA with embedded transceivers? A Field-Programmable Gate Array is a programmable logic device that engineers configure after manufacturing, providing a flexible hardware platform that can implement any digital function up to its resource limits. When the fabric is augmented with multi-gigabit transceivers, the same silicon can drive high-speed serial links - backplane SerDes, fibre-channel, Serial RapidIO, PCIe, or custom chip-to-chip protocols - without external PHYs. The Stratix II GX family extends the general Stratix II architecture (logic array, TriMatrix memory, DSP blocks) with hardened PMA/PCS transceiver blocks and reference-clock PLL infrastructure, occupying a position above soft-logic-only FPGAs but below ASSPs in the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor).
Key differentiating features of the EP2SGX30DF780C3N include 6.375 Gbps per-channel transceiver support, TriMatrix embedded SRAM blocks for flexible FIFO and buffer construction, dedicated DSP blocks for high-throughput multiplication and accumulation, and a 1.0 mm-pitch FC-FBGA package that enables dense board layout while supporting the high pin count needed for multi-channel serial interfaces and wide parallel buses. The C3 speed grade and N suffix indicate a commercial-temperature, lead-free, RoHS-compliant ordering option.
The Stratix II GX architecture implements an ALM (Adaptive Logic Module) fabric rather than the classical 4-input LUT, giving finer-grained logic packing and shorter typical critical paths. TriMatrix memory provides three block sizes (MLAB, M512, M4K) with dedicated routing, allowing the FPGA to instantiate single-port, dual-port, shift-register, or ROM structures without consuming general logic. Embedded transceiver CRUs recover clock and data from inbound serial streams without external components.
Typical applications include high-speed serial backplane bridging, telecom line-card aggregation, video-broadcast SDI/HD-SDI routing, military secure-radio baseband processing, and ASIC prototyping for protocols that require multi-gigabit serial I/O. Designers use the part when they need a moderate-density FPGA fabric plus 4-20 SERDES channels on a single die to replace a multi-chip PHY + FPGA solution.
When laying out a board with the EP2SGX30DF780C3N, dedicate continuous ground and 1.2 V core supply planes under the package, route each transceiver differential pair with 100 ohm differential impedance and length matching to within the datasheet budget, and isolate the PLL analog supplies with their own filtered rails. The 780-ball FC-FBGA requires PCB fabrication with 1.0 mm-pitch vias and laser-drilled microvia stack-ups to fan out the inner balls.
This page consolidates distributor pricing for the EP2SGX30DF780C3N, drop-in alternatives within the Stratix II GX family, and PCB-layout considerations specific to the 780-FBGA package - information that complements the manufacturer datasheet.
Drop-in alternatives for EP2SGX30DF780C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780C3N (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, RoHS Status, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780C3
✅ Drop-In✓ In Stock
$797.98 / Unit
View Datasheet →EP2SGX30DF780C4N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30DF780C5N
✅ Drop-In✓ In Stock
$1050 / Unit
View Datasheet →EP2SGX30CF780C3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP2SGX30CF780C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$379 / Unit
View Datasheet →EP2SGX30CF780C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$160 / Unit
View Datasheet →EP2SGX30DF780C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements (LEs) | 33,880 |
| Logic Cells / Blocks | 33,880 |
| Embedded Memory Bits | 1,369,728 |
| User I/Os | 361 |
| LABs / CLBs | 1694 |
| Internal Frequency | 622 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Number of Pins / Balls | 780 |
| Package Type | FC-FBGA (29 x 29 mm, 1.0 mm pitch) |
| Operating Temperature | -40 C to +85 C |
| Logic Family | CMOS |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP2SGX30DF780C3N fc-fbga (29 x 29 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2SGX30DF780C3N (fc-fbga (29 x 29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780C3N is suitable for 7 applications: Multi-Gigabit Backplane Aggregation, Telecom Line-Card Signal Processing, Video Broadcast SDI / HD-SDI Routing, ASIC Prototyping with Multi-Gigabit I/O, Industrial High-Speed Data Acquisition, Military / Aerospace Secure-Radio Baseband, Test and Measurement Instrumentation.
Multi-Gigabit Backplane Aggregation
The EP2SGX30DF780C3N's 6.375 Gbps embedded transceiver channels make it a strong fit for backplane aggregation cards that fan out multiple serial links into a shared fabric. With up to 20 SERDES channels and 33,880 logic elements, the device can implement PCS, MAC, and switching functions directly in the FPGA while keeping each serial channel at full line rate. Designers use the 780-FBGA's 361 user I/Os to attach parallel backplane buses and control planes alongside the high-speed links, replacing a discrete PHY plus smaller FPGA combination on a single chip.
Recommended
Telecom Line-Card Signal Processing
Telecom line cards require high-speed serial I/O for OTN, SONET, or Ethernet framer interfaces plus substantial DSP capability for clock recovery, framing, and protocol termination. The EP2SGX30DF780C3N integrates DSP blocks alongside the transceiver CRUs, allowing designers to implement clock-data recovery, framer logic, and protocol adaptation in a single FPGA. The industrial temperature grade (-40 C to +85 C) and the 1.0 mm-pitch FBGA make the part suitable for the dense, thermally constrained line-card form factors common in central-office equipment.
Recommended
Video Broadcast SDI / HD-SDI Routing
SDI and HD-SDI serial digital video standards operate in the 270 Mbps to 1.485 Gbps range, well within the EP2SGX30DF780C3N's 6.375 Gbps transceiver capability. The FPGA fabric can implement cable equalizer adaptation, descrambling, and channel switching across many SDI streams simultaneously. The 361 user I/Os are sufficient to break out multiple SDI receivers, ancillary data lines, and parallel control buses. The device's industrial temperature rating supports broadcast equipment that must operate in unconditioned equipment rooms.
Recommended
ASIC Prototyping with Multi-Gigabit I/O
ASIC prototyping platforms need high-density logic plus accurate SERDES behavior to validate protocols like PCI Express, Serial RapidIO, and fibre channel before tapeout. The EP2SGX30DF780C3N provides production-faithful transceiver performance and 33,880 logic elements that map directly to mid-range ASIC designs. The Stratix II GX development kit from Altera includes reference designs and BitBlaster/USB-Blaster programming support, accelerating the bring-up of prototype boards. The 780-FBGA's 1.0 mm pitch allows dense prototype PCBs with controlled-impedance routing for the SERDES channels.
Recommended
Industrial High-Speed Data Acquisition
Industrial data-acquisition systems often combine high-speed ADCs with serializer outputs (JESD204B) plus fieldbus or Ethernet connectivity, both of which the EP2SGX30DF780C3N can handle. The transceiver channels accept the JESD204B serial lanes while the FPGA fabric performs decimation, triggering, and protocol packaging for downstream processing. The 1.2 V core and industrial temperature range fit factory-floor power and thermal budgets. The 361 user I/Os allow parallel GPIO, trigger, and timing connections alongside the high-speed serial paths.
Recommended
Military / Aerospace Secure-Radio Baseband
Secure-radio baseband subsystems need flexible DSP plus cryptographic acceleration and high-speed links to RF front ends. The EP2SGX30DF780C3N's transceiver channels support the proprietary serial links commonly used between baseband and RF sections, while the FPGA fabric implements waveform processing, crypto, and packet scheduling. The industrial temperature grade and the ruggedized FBGA package suit aerospace and defense platforms. The Stratix II GX family is widely documented in legacy defense design wins, simplifying obsolescence management and second-source qualification.
Recommended
Test and Measurement Instrumentation
Test equipment such as logic analyzers, protocol exercisers, and bit-error-rate testers benefit from the EP2SGX30DF780C3N's combination of high-density logic and accurate multi-gigabit transceivers. The FPGA can drive stimulus patterns at 6.375 Gbps while simultaneously capturing and analyzing response data through the same SERDES channels, replacing rack of discrete pattern-generator and error-detector boxes. The 780-FBGA's 361 user I/Os accommodate probe interfaces, front-panel displays, and host PC connectivity in the same device.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780C3 | EP2SGX30DF780C4N | EP2SGX30DF780C5N | EP2SGX30CF780C3N | EP2SGX30CF780C4N | EP2SGX30CF780C5N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-780 (DF780, 29x29 mm, 1.0 mm pitch) | FBGA-780 (DF780) - same | FBGA-780 (DF780) - same | FBGA-780 (DF780) - same | FBGA-780 (CF780) - same pin count, different package code | FBGA-780 (CF780) - same | FBGA-780 (CF780) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 33,880 | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) |
| Speed Grade | C3 (fastest commercial) | C3 | C4 (one grade slower) | C5 (two grades slower) | C3 | C4 | C5 |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps (slightly tighter timing margin) | Up to 6.375 Gbps (relaxed margin) | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lead-Free / RoHS | Yes (N suffix) | No (SnPb balls) | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C (industrial) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Param Match (this_product = 100%) | 100% | 100% (no RoHS) | 90% | 80% | 90% | 80% | 70% |
Key Differentiators
- Fastest commercial speed grade available in the EP2SGX30 family (vs EP2SGX30DF780C4N)
- Lead-free RoHS-compliant terminal finish (vs EP2SGX30DF780C3)
- Industrial temperature grade (-40 C to +85 C) (vs EP2SGX30DF780C4N)
Design Notes
Estimated: the 780-ball FC-FBGA at 1.0 mm pitch typically requires an 8- or 10-layer PCB stack-up with laser-drilled microvias for inner-ball fan-out. Use a 4-1-4 or 5-2-5 stack-up so that each BGA ball can be routed out on the top layer plus one microvia to an inner layer. Maintain 100 ohm differential impedance on all SERDES TX/RX pairs and 50 ohm single-ended on user I/Os, with reference planes uninterrupted under the entire BGA footprint. Place transceiver AC-coupling capacitors within 250 mil of the corresponding BGA balls and route the differential pairs length-matched to within the datasheet budget (typically 5 mil for 6.375 Gbps signals).
The Stratix II GX device requires multiple supply rails: VCCINT (1.2 V core), VCCIO (per bank, 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V), VCCA (analog PLL supply), and VCCR / VCCT (transceiver analog supplies, typically 1.2 V and 2.5 V). Decouple each supply with a combination of 10 uF bulk, 0.1 uF, and 0.01 uF ceramic capacitors placed within 100 mil of the corresponding power balls. Isolate the transceiver analog supplies from the digital core supplies with ferrite beads or dedicated regulator islands to prevent switching noise from coupling into the SERDES CDR loops.
Estimated: at full SERDES utilization (20 channels at 6.375 Gbps) the EP2SGX30DF780C3N can dissipate in the range of 5-8 W depending on toggle rate. The FC-FBGA package exposes the die through the substrate center, so use thermal vias in the BGA land pattern directly under the package thermal pad region. Connect the thermal vias to an inner ground plane with a continuous thermal copper pour on the top and bottom layers. At maximum dissipation, a small heatsink or heat-spreader may be required to keep junction temperature below 100 C for industrial-grade operation.
Do not assume the C3 and C4 speed grades are drop-in replacements for one another in a fully constrained design - the C4 timing margins are tighter and may not meet setup/hold on a critical path that was previously closing on C3. Always re-run the Quartus TimeQuest timing analyzer after swapping speed grades. A second common pitfall is mis-mapping the reference-clock PLL input pins: the Stratix II GX has dedicated REFCLK pins that must be used for transceiver reference clocks, not general-purpose user I/O. Finally, ensure that configuration mode (AS, AP, PS, JTAG) is selected correctly via MSEL pins before attempting to program the device.
Compliance Information
N suffix on EP2SGX30DF780C3N indicates lead-free finish per JEDEC JESD97 e3, RoHS-compliant. REACH, halogen-free, and conflict-mineral declarations are not specified in the verified web data and are marked unknown.
