EP2SGX90EF1152I5 - Stratix II GX FPGA, 90K LEs, 1152-BGA | Intel
MPN: EP2SGX90EF1152I5 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP2SGX90EF1152I5 Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and increasingly hard intellectual-property (IP) cores such as transceivers and processors. In the broader system hierarchy, an FPGA sits between programmable logic devices (CPLDs) and application-specific integrated circuits (ASICs): more flexible than ASICs, faster and more capable than CPLDs, and positioned as the workhorse for prototyping, low-volume production, and hardware acceleration.
Key features of the EP2SGX90EF1152I5 include integrated 6.375 Gbps transceivers for backplane and chip-to-chip serial links, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory with parity and ECC options, and support for external memory interfaces such as DDR2 and QDRII+. The industrial temperature grade (-40C to +100C ambient, with junction up to +125C) makes it suitable for harsh-environment applications including industrial automation, military/aerospace, and outdoor telecommunications equipment.
The Stratix II GX architecture introduces an adaptive logic module (ALM) that breaks the classical 4-LUT model into a more flexible 8-input fracturable LUT, improving logic packing efficiency. The transceiver blocks support multiple protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet through hard PCS layers, offloading PHY-state-machine work from the programmable fabric.
Typical applications include high-speed serial interface bridging, software-defined radio baseband processing, ASIC prototyping, radar signal processing, and high-performance DSP data paths. Designers commonly pair this device with external DDR2/QDR memory and clock generators such as the CDCE62005 or with companion PHY devices for PCIe or SRIO.
When designing with this device, plan thermal management carefully: BGA-1152 with all transceivers active can dissipate 10-15 W, requiring a multilayer PCB with thermal vias under the package and, in many cases, a heatsink or forced-air cooling. JTAG configuration via the enhanced configuration device (EPC) family is the most common production programming method.
This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not consolidated in the manufacturer datasheet, making it easier for hardware engineers to evaluate the EP2SGX90EF1152I5 against modern alternatives.
Drop-in alternatives for EP2SGX90EF1152I5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152I5 (same form factor and footprint) β differing in Package, Operating Temperature, Transceivers, Total RAM Bits, Speed Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1152I5N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2SGX90EF1152C5N
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX90EF1152C5
β Drop-Inβ In Stock
$225 / Unit
View Datasheet βEP2SGX90EF1152I4N
β Drop-Inβ In Stock
$1550 / Unit
View Datasheet βEP2SGX90EF1152I4
β Drop-Inβ In Stock
$3750 / Unit
View Datasheet βEP2SGX90EF1152C4N
β Drop-Inβ In Stock
$695 / Unit
View Datasheet βEP2SGX90EF1152I3N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2SGX90EF1152C3N
β Drop-Inβ In Stock
$1280 / Unit
View Datasheet βEP2SGX90EF1152I5 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Configurable Logic Blocks (CLBs) | 90,960 |
| Transceivers | Up to 20 multi-gigabit transceivers at 6.375 Gbps |
| Combinatorial Delay | 4.006 ns |
| Maximum Internal Clock Frequency | 622.08 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Package | 1152-ball FineLine BGA (FBGA-1152) |
| Terminal Form | Ball |
| Package Code | BGA |
| Temperature Grade | Industrial (-40C to +100C ambient) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP2SGX90EF1152I5 bga Pin Configuration Guide
Pin configuration for EP2SGX90EF1152I5 (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152I5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152I5 is suitable for 6 applications: High-Speed Serial Interface Bridging, Software-Defined Radio Baseband Processing, ASIC Prototyping and Emulation, Radar and Signal-Intelligence Processing, High-Performance DSP Data Path Acceleration, Industrial Control and Factory Automation.
High-Speed Serial Interface Bridging
The EP2SGX90EF1152I5 fits high-speed serial interface bridging because it integrates up to 20 multi-gigabit transceivers at 6.375 Gbps with hard PCS layers for PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet. This eliminates the need for external PHY chips and allows one FPGA to bridge between incompatible protocols (for example, PCIe Gen1 to Serial RapidIO) on a single board. The 90,960 logic elements provide sufficient fabric capacity for protocol-state-machine state and DMA engines, while the FBGA-1152 package exposes enough user I/O for parallel side-band management interfaces. Compared with a discrete PHY plus CPLD solution, the integrated transceiver approach saves PCB area, reduces BOM cost, and improves signal integrity by keeping high-speed serial traces inside the package.
Recommended
Software-Defined Radio Baseband Processing
The EP2SGX90EF1152I5 is well suited to software-defined radio baseband processing because its dedicated DSP blocks deliver high multiply-accumulate throughput for FIR filters, FFTs, and channelization tasks. With 622 MHz maximum internal clock and embedded 18x18 multipliers, the device can process multiple wideband channels in parallel, while the integrated transceivers digitize the IF or RF stream directly. The 90 nm CMOS process and industrial temperature grade allow deployment in outdoor base-station enclosures. Compared with a DSP-processor-only approach, the FPGA implementation achieves 10-100x higher throughput per watt for parallel DSP kernels and supports real-time reconfiguration as waveforms evolve.
Recommended
ASIC Prototyping and Emulation
The EP2SGX90EF1152I5 is widely used as an ASIC prototyping and emulation vehicle because the 90,960 logic elements map large ASIC blocks for hardware-software co-verification before tape-out. Multiple FPGAs can be interconnected via the integrated transceivers to emulate million-gate ASICs. The FBGA-1152 package exposes hundreds of user I/Os for bringing out ASIC pins to logic analyzers, and Quartus II provides incremental compile flows that designers can leverage for fast iteration. The industrial temperature grade also supports ASIC validation in environmental chambers. Compared with proprietary emulation farms, a Stratix II GX prototyping cluster is a fraction of the cost and is owned outright by the design team.
Recommended
Radar and Signal-Intelligence Processing
The EP2SGX90EF1152I5 fits radar and signal-intelligence (SIGINT) processing workloads because the combination of 4.5 Mbits of embedded TriMatrix memory and dedicated DSP blocks supports high-bandwidth FFT pipelines that must run in real time. The transceivers accept direct ADC outputs at gigasample-per-second rates, and the industrial temperature grade ensures operation in vibration- and temperature-stressed platforms such as shipboard or airborne enclosures. The BGA-1152 package with 622 MHz fabric clock enables deterministic latency for phased-array beamforming. Compared with a GPU or DSP-cluster solution, the FPGA implementation offers lower and more deterministic latency for closed-loop control and is radiation-tolerant-friendly through third-party MIL-graded variants.
Recommended
High-Performance DSP Data Path Acceleration
The EP2SGX90EF1152I5 is appropriate for high-performance DSP data-path acceleration such as real-time video transcoding, medical imaging reconstruction, and scientific instrumentation. The dedicated DSP blocks implement multiply-accumulate, multiply-add, and complex-multiply operations at high tap counts, while the TriMatrix memory provides local data buffers that minimize external memory round-trips. Hard memory controllers connect to DDR2/QDRII external memory for working storage. Compared with a software-DSP solution, the FPGA delivers deterministic latency, higher throughput per watt, and the ability to update algorithms in the field by reloading the configuration bitstream.
Recommended
Industrial Control and Factory Automation
The EP2SGX90EF1152I5 fits industrial control and factory automation because its industrial temperature grade tolerates -40C to +100C ambient operation in unconditioned control cabinets. The integrated transceivers support industrial Ethernet protocols such as EtherCAT, PROFINET, and SERCOS III through soft-IP stacks, while the high logic density allows consolidation of multiple controllers and motion-control loops onto a single device. The BGA-1152 package provides hundreds of LVTTL/LVDS pairs for parallel I/O to sensors, motor drivers, and safety relays. Compared with a multi-chip PLC architecture, a single FPGA reduces board area, BOM cost, and the latency between sensing and actuation loops.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152I5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152I5N | EP2SGX90EF1152C5N | EP2SGX90EF1152I4N | EP2SGX90EF1152C3N |
|---|---|---|---|---|---|
| Package | 1152-ball FBGA | 1152-ball FBGA - same | 1152-ball FBGA - same | 1152-ball FBGA - same | 1152-ball FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same |
| Family | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Industrial | Commercial |
| Speed Grade | -5 | -5 | -5 | -4 | -3 |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Transceiver Data Rate (max) | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Lead-Free (N suffix) | No (legacy) | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade with -5 speed bin (vs EP2SGX90EF1152C5N)
- Lead-free (RoHS) compliance (vs EP2SGX90EF1152I5 (this part, non-N))
- Highest speed bin in the Stratix II GX family (vs EP2SGX90EF1152I4)
Design Notes
Estimated: with all 20 transceivers active at 6.375 Gbps and 50% logic utilization, the EP2SGX90EF1152I5 typically dissipates 10-15 W. The FBGA-1152 package exposes a thermal pad on the underside that must be soldered to a PCB thermal plane with a full array of thermal vias (0.3 mm diameter, 1.0-1.2 mm pitch). For high-utilization designs in enclosed industrial cabinets, add an aluminum heatsink with thermal interface material (1-3 W/m-K) or active airflow. Without thermal management, junction temperature can exceed 125C and trigger thermal-sensor-based design throttling.
The FBGA-1152 with 1.0 mm ball pitch requires a multilayer PCB (8-12 layers minimum). Transceiver channels must be routed as 100-ohm differential pairs with intra-pair skew under 1 ps and continuous reference planes on adjacent layers. Matched-length routing for DDR2 and QDRII interfaces should follow the byte-lane rules in the Stratix II GX external memory interface handbook. Use the Quartus II pin planner to assign pins and verify I/O standards, then export the assignments to your PCB CAD tool.
Configuration mode (MSEL pin settings) must match the chosen configuration scheme (AS, AP, PS, FPP, or JTAG) or the device will not configure correctly. The EPC16 or EPC64 enhanced configuration device is recommended for production programming because it supports page-mode decompression and remote update. For boards already using legacy 3.3 V peripherals, verify that the I/O bank supply rails match the I/O standard; mixing LVTTL 3.3 V and LVDS on the same bank requires careful VCCIO planning. The I5 industrial speed grade is mandatory for industrial temperature operation - the C5 commercial variant will fail outside 0-85C.
Compliance Information
RoHS compliance verified from manufacturer product page. AEC-Q100 not applicable (FPGA, not automotive-qualified IC). Lead-free BGA termination standard. REACH SVHC and halogen-free status should be confirmed with the Intel product compliance portal for the latest declaration.
