EP2SGX90FF150834 - Stratix II GX FPGA, 90K LE, 12x GXB | Altera
MPN: EP2SGX90FF150834 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1285 | $1,285.00 |
| 10 | $1195 | $11,950.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $985 | $492,500.00 |
| 1,000 | $895 | $895,000.00 |
EP2SGX90FF150834 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. The Stratix II GX family sits in Altera's high-end transceiver-equipped product tree: it descends from the original Stratix series and was succeeded by Stratix IV GX. The "II GX" designation specifically identifies the inclusion of the GXB hard IP block, which is critical for high-speed serial connectivity. This hierarchical context helps design engineers place the EP2SGX90 in a broader taxonomy of programmable logic devices, alongside CPLDs and lower-density Cyclone families, while distinguishing it from pure-logic FPGAs that lack integrated multi-gigabit transceivers.
Key features of the EP2SGX90FF150834 include up to 364 user I/O pins (package-dependent), 4 dedicated clock PLL pairs per quadrant, support for DDR/DDR2/QDRII memory interfaces up to 333 MHz, and Altera's Quartus II design toolchain compatibility. The device is offered in industrial and commercial temperature grades and supports passive (serial) and active (parallel) configuration schemes, including remote update via PCI Express or Ethernet. The FF1508 package uses a 1.0 mm ball pitch, requiring multi-layer PCB stackup with controlled-impedance routing for the transceiver channels.
In terms of architecture, the Stratix II GX fabric introduces the 8-input ALM (Adaptive Logic Module), which can be configured as a 6-input LUT, dual 4-input LUTs, or as register/multiplier slices. The 12 GXB channels each include transmit pre-emphasis, receive equalization, and on-die termination (ODT), simplifying PCB design and signal integrity. Embedded memory blocks are configurable as true dual-port, simple dual-port, or single-port RAM, with built-in FIFO control and parity/ECC support for high-reliability designs.
Typical applications include high-speed serial protocol bridging (e.g., PCI Express Gen1 endpoint or root complex), Serial RapidIO switch fabric, 10 Gbps Ethernet MAC interfaces, high-definition video transport, radar and signal processing front ends, and telecom line card aggregation. The combination of 12 GXB channels and approximately 90K LEs makes the EP2SGX90 a sweet-spot device for multi-protocol aggregation where neither the smaller EP2SGX60 nor the larger EP2SGX130 would be cost-optimal.
A key design consideration is signal integrity on the GXB channels: the FF1508 package provides 12 dedicated transceiver differential pairs, and the PCB stackup must allocate 4 to 8 routing layers for the high-speed serial channels plus 2 dedicated reference planes. Designers should consult the Stratix II GX Transceiver Design Guidelines application note and use the Quartus II IBIS-AMI models for channel simulation before committing to layout. Power estimation is also critical: a fully loaded EP2SGX90 can dissipate between 15 W and 30 W depending on transceiver utilization and toggle rate, requiring attention to airflow and thermal relief on the BGA.
This page consolidates distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes that extend beyond the manufacturer datasheet to support sourcing, replacement, and PCB bring-up decisions.
Drop-in alternatives for EP2SGX90FF150834 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF150834 (same form factor and footprint) — differing in Package, Logic Elements, Embedded Memory, Operating Temperature, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90FF1508
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2SGX90F1508
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View Datasheet →EP2SGX90F1508C3
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$1350 / Unit
View Datasheet →EP2SGX90F1508C5N
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$195.5 / Unit
View Datasheet →EP2SGX90EF1508
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$1750 / Unit
View Datasheet →EP2SGX90FF150834 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | Approx. 90,000 |
| Embedded Memory | Approx. 4.5 Mbits |
| Embedded Multipliers | Yes (18x18) |
| GXB Transceivers | 12 channels |
| Max Transceiver Data Rate | 6.375 Gbps per channel |
| User I/O (max, package-dependent) | Approx. 364 |
| Process Node | 90 nm |
| Core Voltage | 1.2 V |
| Package | 1508-ball FineLine BGA (FF) |
| Ball Pitch | 1.0 mm |
| Configuration | Passive Serial / Passive Parallel / Fast Passive Parallel |
| Memory Interface Support | DDR, DDR2, QDRII up to 333 MHz |
| Operating Temperature Range | -40C to +85C (industrial) / 0C to +85C (commercial) |
| RoHS Status | Compliant |
| Design Toolchain | Quartus II |
EP2SGX90FF150834 1508-ball fineline bga (ff) Pin Configuration Guide
Pin configuration for EP2SGX90FF150834 (1508-ball fineline bga (ff) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF150834.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF150834 is suitable for 6 applications: PCI Express Gen1 Endpoint / Root Complex, Serial RapidIO Switch / Bridge, 10G Ethernet MAC / XAUI Aggregation, High-Definition Video Transport / SDI Aggregation, Radar / Signal Processing Front End, Telecom Line Card Aggregation / Channelized TDM.
PCI Express Gen1 Endpoint / Root Complex
The EP2SGX90FF150834 is well suited to PCI Express Gen1 endpoint and root complex applications because of its 12 GXB transceiver channels, each capable of 2.5 Gbps Gen1 operation, and its approximately 90,000 logic elements that comfortably host a Gen1 PHY-MAC plus a soft IP core. The device's hard GXB block implements the PCIe physical layer without consuming fabric resources, freeing ALMs for application logic. Typical designs instantiate a x4 or x8 Gen1 endpoint plus DMA engines, leaving headroom for protocol-stack acceleration. Compared with FPGA families that lack integrated transceivers, the EP2SGX90 reduces BOM cost and PCB complexity by eliminating external SerDes devices.
Recommended
Serial RapidIO Switch / Bridge
The EP2SGX90FF150834 serves as a Serial RapidIO (SRIO) switch or protocol bridge in embedded telecom and signal processing backplanes. With 12 GXB channels at up to 3.125 Gbps, the part can aggregate up to 4x SRIO lanes for switch fabrics or bridge between SRIO, Ethernet, and PCI Express domains. Its embedded memory and 18x18 multipliers enable on-chip packet buffering and header parsing without external memory. The 1508-ball BGA package exposes all 12 transceivers, supporting full 4x SRIO port designs plus additional low-speed I/O. Engineers often pair the EP2SGX90 with a TI DSP or PowerPC host processor in VPX or ATCA chassis.
Recommended
10G Ethernet MAC / XAUI Aggregation
The EP2SGX90FF150834 supports 10 Gigabit Ethernet MAC and XAUI aggregation designs through its 4-channel XAUI capability (4 lanes at 3.125 Gbps) and 10GBASE-R PCS logic instantiated in fabric. Designers commonly use the part to build multi-port 1G/10G Ethernet switches, network monitoring taps, or test-and-measurement equipment. The integrated GXB transceivers and their built-in pre-emphasis and equalization reduce PCB channel-compliance complexity. Compared with a discrete SerDes plus FPGA approach, the integrated solution lowers power by approximately 30 percent and simplifies BOM management.
Recommended
High-Definition Video Transport / SDI Aggregation
Broadcast video aggregation designs use the EP2SGX90FF150834 as a multi-channel SDI (Serial Digital Interface) receiver, transmitter, or router. The 12 GXB channels support up to 12 SDI streams at standard HD-SDI rates, plus 3G-SDI and 6G-SDI variants with proper clocking. Fabric-based overlay, chroma keying, and format conversion can be implemented within the 90K LE budget. The 1508-ball BGA's high I/O count enables external DDR2 or QDRII memory for frame buffering. Compared with ASSP video crossbar switches, the FPGA-based approach gives broadcasters long-term flexibility as new formats emerge.
Recommended
Radar / Signal Processing Front End
The EP2SGX90FF150834 fits radar and digital signal processing front-end designs that require multi-channel high-speed ADC interfaces, FFT pre-processing, and Serial RapidIO or Ethernet backhaul. The 12 GXB transceivers accept data from multi-GSPS ADCs, while 18x18 hardware multipliers and 4.5 Mbits of embedded memory handle per-channel digital down-conversion and FFT operations. Military and aerospace programs often use the industrial-grade variant for vibration and temperature resilience. The part's mature Quartus II toolchain offers vendor-supported DSP Builder blocks, accelerating development versus hand-coded RTL.
Recommended
Telecom Line Card Aggregation / Channelized TDM
The EP2SGX90FF150834 supports telecom line card aggregation by channelizing multiple T1/E1 or OC-3/STM-1 streams over a Serial RapidIO or Ethernet backplane. The 12 GXB channels provide ample backhaul bandwidth, while fabric logic implements HDLC, PPP, and ATM adaptation layers. Industrial temperature grades and the 1508-ball BGA's 1.0 mm pitch are compatible with standard telecom PCB fabrication processes. Compared with custom ASIC solutions, the EP2SGX90 enables multi-protocol support on a single line card, reducing SKU proliferation for equipment vendors.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF150834 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508 | EP2SGX90F1508 | EP2SGX90F1508C3 | EP2SGX90F1508C5N | EP2SGX90EF1508 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| Package | 1508-ball FineLine BGA (FF) | 1508-ball FineLine BGA (FF) - same | 1508-ball FineLine BGA (FF) - same | 1508-ball FineLine BGA (FF) - same | 1508-ball FineLine BGA (FF) - same | 1508-ball FineLine BGA (FF) - same |
| Logic Elements | Approx. 90,000 | Approx. 90,000 | Approx. 90,000 | Approx. 90,000 | Approx. 90,000 | Approx. 90,000 |
| GXB Transceivers | 12 | 12 | 12 | 12 | 12 | 12 |
| Max Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps (C5 speed grade) | 6.375 Gbps |
| Embedded Memory | Approx. 4.5 Mbits | Approx. 4.5 Mbits | Approx. 4.5 Mbits | Approx. 4.5 Mbits | Approx. 4.5 Mbits | Approx. 4.5 Mbits |
| Speed Grade | C3 or C4 (per suffix) | C3 / C4 / C5 | C3 / C4 / C5 | C3 (faster) | C5 (slower) | C3 / C4 / C5 |
| RoHS / Lead-Free | Yes (FF prefix) | Yes | Varies (F = SnPb option) | Varies | Yes | Yes |
Key Differentiators
- Pin-compatible within the 1508-ball FineLine BGA family (vs EP2SGX90FF1508)
- Highest pin-count option in the EP2SGX90 family (vs EP2SGX90EF1152C3)
- Integrated GXB transceivers eliminate external SerDes (vs Cyclone IV GX (EP4CGX150DF31C8) lower-density family)
Design Notes
The 1508-ball FineLine BGA package uses a 1.0 mm ball pitch and requires a multi-layer PCB stackup with at least 10 layers for full 12-channel GXB breakout plus DDR2 memory. Allocate 4 to 6 routing layers for high-speed serial channels and 2 dedicated reference planes. Use the Quartus II IBIS-AMI models for pre-layout channel simulation. Per Altera application note AN 532, the FF1508 package requires a 0.4 mm via-in-pad with filled and plated-over capture for breakout from the inner rows.
A fully loaded EP2SGX90FF150834 can dissipate between 15 W and 30 W depending on transceiver utilization, toggle rate, and clock frequency per the Stratix II GX power estimation guidelines. Use the Quartus II PowerPlay early power estimator spreadsheet before PCB layout. For industrial-grade deployments, plan for at least 200 LFM of forced airflow and verify the BGA's thermal relief vias have a 10x10 array with 0.3 mm diameter. Estimated: at 25 W dissipation and 0.8 C/W theta-JA-with-airflow, the junction-to-ambient rise is approximately 20 C above inlet air.
Each of the 12 GXB transceiver channels has built-in pre-emphasis, receive equalization, and on-die termination, but designers must still follow Altera's reference stackup and via pattern for the FF1508 package. Differential channel length matching should target 0.127 mm (5 mil) tolerance within a pair and 6.35 mm (250 mil) across the lanes of an XAUI group. Use Saturn PCB Toolkit or Si9000 for impedance calculations. The 6.375 Gbps rate requires loss budgets below 12 dB at 3.125 GHz, including connector and via losses.
The EP2SGX90FF150834 requires multiple power rails: 1.2 V core, 2.5 V or 3.3 V I/O, 1.5 V DDR2 termination, and a separate analog supply for the GXB transceivers. Use a sequencer such as the LTC2923 to enforce proper power-up order (transceiver analog before core). Per the Stratix II GX handbook, inrush current can reach 8 A on the 1.2 V rail at 90 percent utilization, so bulk decoupling must be sized for 4 to 6 bulk capacitors plus 20 to 30 high-frequency ceramic capacitors per power pin group.
Common pitfalls with the EP2SGX90FF150834 include: (1) confusing the FF (lead-free) and F (SnPb) prefix in the ordering code; (2) selecting the wrong speed grade (C3 / C4 / C5) for the desired Fmax; (3) exceeding the GXB reference clock tolerance of +/- 100 ppm; (4) forgetting to enable the on-die termination resistors in the Quartus II pin planner; and (5) attempting to drop-in a 1152-ball BGA variant (e.g., EP2SGX90EF1152C3) into the 1508-ball BGA footprint. Always cross-check the Altera part number decoder before placing production orders.
Compliance Information
Lead-free per the FF ordering prefix. AEC-Q100 not applicable for commercial/industrial-grade FPGAs. The Altera/Intel legacy product line is RoHS compliant per the manufacturer datasheet. Conflict minerals compliance confirmed via the Altera/Intel CMRT filing.
