EP2SGX90F1508 Stratix II GX FPGA | Altera | Embedded Processing
MPN: EP2SGX90F1508 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2SGX90F1508 Overview
A field-programmable gate array is an integrated circuit containing configurable logic, routing resources, memory blocks, and I/O elements. Designers program the device after manufacturing to implement digital functions such as protocol bridging, signal processing, control, and interface aggregation. FPGA architecture belongs to the broader programmable-logic hierarchy, between fixed-function application-specific integrated circuits and software-driven processors, making it useful when parallel hardware performance, reconfigurability, and rapid implementation are important.
The EP2SGX90F1508 provides 90,960 logic elements, 650 I/O, and 4,520,448 memory bits according to the verified Altera family and distributor listings. Its Stratix II GX classification indicates the GX-oriented FPGA family, while the FCBGA package provides a high-density surface-mount interconnect arrangement. The 1,508-ball package is relevant to PCB escape routing, signal-integrity analysis, power integrity, and thermal design.
The architecture supports programmable digital logic and embedded memory resources, but verified source data does not provide operating voltage, transceiver count, transceiver data rate, clock count, user I/O voltage range, or thermal resistance. Those values should not be inferred from the family name or package code. Engineers should use the manufacturer datasheet, device-specific configuration files, power estimator, and pin assignment before schematic or layout release.
Typical applications include communications equipment, industrial control, test and measurement, and custom data-processing systems. Its 90,960 logic elements suit parallel datapaths and interface consolidation, while 650 I/O supports connections to multiple external buses. Embedded memory can support buffering, state storage, and local data handling. The package and available logic resources make the device appropriate for high-density, board-level designs where the complete signal and power implementation is planned before fabrication.
A key design consideration is that 1,508 balls require careful fan-out, controlled impedance, decoupling strategy, and a verified power distribution network. Confirm device configuration support, programming hardware, licensing, and the exact package footprint before using this part in a new design. The part number may represent a base or less-specific ordering code; purchase and lifecycle decisions should be confirmed against the exact assembled MPN and the latest manufacturer documentation.
This data page separates exact values supported by distributor and manufacturer references from parameters that require datasheet confirmation. It also records that no verified cross-brand, same-package, drop-in replacement was identified, preventing an unverified replacement from being presented as pin-to-pin compatible.
Drop-in alternatives for EP2SGX90F1508 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90F1508 (same form factor and footprint) β differing in Package, Mounting Type, Logic Elements, Speed Grade, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90FF1508C3N
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View Datasheet βEP2SGX90FF1508C3
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View Datasheet βEP2SGX90FF1508C4N
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View Datasheet βEP2SGX90EF1508
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$1750 / Unit
View Datasheet βEP2S90F1508C5N
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View Datasheet βEP2SGX90F1508 Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Stratix II GX |
| Logic Elements | 90960 |
| Logic Array Blocks | 4548 |
| User I/O | 650 |
| Embedded Memory | 4520448 bits |
| Package | 1508-BBGA, FCBGA |
| Pin Count | 1508 balls |
| Mounting Type | Surface Mount |
| Configuration | FPGA programmable |
| Application Area | Communications and embedded digital processing |
EP2SGX90F1508 1508-bbga, fcbga Pin Configuration Guide
Pin configuration for EP2SGX90F1508 (1508-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90F1508.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90F1508 is suitable for 6 applications: Communications Infrastructure, Industrial Control and Automation, Test and Measurement Equipment, Embedded Data Processing, High-Density Interface Aggregation, Legacy Platform Maintenance.
Communications Infrastructure
EP2SGX90F1508 can be evaluated for communications infrastructure designs that need programmable packet processing, interface bridging, and parallel control logic. The verified device data lists 90,960 logic elements, 650 I/O, 4,548 logic array blocks, and 4,520,448 bits of embedded memory. These resources support aggregation of multiple data paths while retaining the ability to update logic after implementation. The GX family classification suggests communications-oriented use, but transceiver count and data rate are data-needed items. Before adoption, confirm the required electrical interfaces, clocking architecture, supported configuration, and power requirements. The 1508-BBGA FCBGA package also requires controlled-impedance routing and a board stack-up capable of supporting the dense escape pattern.
Recommended
Industrial Control and Automation
EP2SGX90F1508 is suitable for industrial control systems requiring deterministic parallel logic, multiple external interfaces, and configurable timing or control functions. Its 650 I/O can support sensor aggregation, motor-control coordination, communication gateways, and machine-state logic, while 4,520,448 bits of embedded memory provide local storage for buffering and protocol data. The programmable architecture allows designers to adapt interfaces without changing the board-level device, but industrial qualification details were not supplied. Confirm operating temperature, I/O standards, voltage rails, and reliability requirements from official documentation. Because the package is a 1,508-ball FCBGA, power integrity, thermal analysis, and manufacturing capability should be reviewed before schematic release.
Recommended
Test and Measurement Equipment
EP2SGX90F1508 can be considered for test and measurement equipment where multiple instrument channels, data formatting, trigger logic, and control functions must operate concurrently. The 90,960 logic elements and 650 I/O provide substantial programmable capacity for channel aggregation and digital signal conditioning, while the 4,520,448 memory bits support local capture or buffer structures. The part is not a substitute for a high-speed ADC or front-end converter; it is a processing and control platform around those functions. Verify I/O voltage, timing limits, clock resources, transceiver capability, and power consumption before selection. The 1508-ball FCBGA package requires careful analog and digital partitioning, controlled-impedance routes, and a documented decoupling strategy.
Recommended
Embedded Data Processing
EP2SGX90F1508 fits embedded data-processing designs that need hardware parallelism, local memory, and configurable I/O. The device provides 90,960 logic elements and 4,520,448 bits of embedded memory, allowing datapaths, protocol handlers, filters, and control engines to be implemented in programmable logic. This can reduce the number of discrete interface or processing devices when multiple functions must run concurrently. The exact power, clock, and performance limits are not included in the verified web data, so benchmark the design using the supported synthesis and timing tools. Confirm whether the required interfaces are supported by the selected device configuration. The 1508-BBGA package makes board-level escape, decoupling, thermal management, and manufacturing yield important system-level decisions.
Recommended
High-Density Interface Aggregation
EP2SGX90F1508 is a candidate for high-density interface aggregation in systems that need many parallel connections and programmable protocol conversion. The verified 650 I/O count is particularly relevant when several buses, sensors, memories, or control interfaces must be connected to one logic platform. With 90,960 logic elements, designers can implement glue logic, protocol adaptation, timing conversion, and supervisory functions in the same device. The package uses 1,508 FCBGA balls, so interface density at the silicon level does not eliminate PCB complexity. Plan pin assignment early, review simultaneous-switching noise, and validate every voltage and signaling standard. Operating voltage, temperature, and transceiver performance remain data-needed and must be confirmed before release.
Recommended
Legacy Platform Maintenance
EP2SGX90F1508 may be relevant to maintenance of installed systems that already use the Stratix II GX architecture. Its listed 90,960 logic elements, 650 I/O, 4,520,448 memory bits, and 1508-BBGA FCBGA package provide a concrete basis for comparing repair, spare, or board-replacement requirements. A maintenance program should first capture the original device marking, configuration files, firmware, and package revisions because similar Altera MPNs are not automatically interchangeable. Confirm whether the exact code is orderable and whether authorized supply remains available. For new designs, consider whether a current FPGA family offers better software support, lifecycle visibility, power efficiency, and manufacturing continuity, but do not treat that as a drop-in substitution.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90F1508 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508C3N | EP2SGX90FF1508C3 | EP2SGX90FF1508C4N | EP2SGX90EF1508 | EP2S90F1508C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
Key Differentiators
- Documented 90,960 logic elements and 4,520,448 memory bits (vs EP2S90F1508C5N)
- 650 listed I/O for high-density system interfaces (vs EP2SGX60F1508)
- Stratix II GX family identification (vs EP2S180F1508I4N)
Design Notes
Treat the 1,508-ball FCBGA escape as a critical PCB design task. Confirm the official ball map and package dimensions, assign high-speed and noise-sensitive functions before routing, and provide sufficient layers and via transitions for the outer rows. Use the actual board stack-up for impedance calculations and ask the fabricator about via-in-pad capability. Do not derive a ball numbering scheme from a generic FCBGA drawing.
Create the power network only from verified voltage, current, sequencing, and tolerance values in the manufacturer data sheet and power estimator. Place local decoupling at the associated balls, maintain low-impedance return paths, and separate noisy I/O regions from sensitive logic. The supplied web data does not provide operating voltage or current, so values must be marked data-needed rather than estimated.
Review all 650 listed I/O for supported standards, drive strength, direction, termination, and simultaneous-switching limits. Route clock and high-speed signals first, maintain continuous reference planes, and calculate via stubs and connector transitions where applicable. The verified data does not provide I/O voltage or timing limits. Validate the final constraints through timing analysis and, where available, signal-integrity simulation.
Thermal design cannot be completed from the verified package and resource figures alone. EP2SGX90F1508 uses a 1508-BBGA FCBGA package, but no junction-to-air resistance, maximum junction temperature, or power limit is supplied. Estimate power with the supported FPGA design tools using the actual clock and utilization profile, then use board copper, airflow, and ambient conditions to establish a thermal margin. Do not claim a heatsink requirement from package size alone.
Do not treat a related MPN as an automatic drop-in replacement. EP2SGX90FF1508C3N, EP2SGX90FF1508C3, and EP2SGX90FF1508C4N have related package and family coding, but their ordering suffixes and configuration details differ. Verify the exact MPN, pinout, device ID, speed grade, temperature grade, configuration data, and power limits. A new PCB should not be accepted solely because a related part is listed in the same 1508-BBGA package.
Compliance Information
The verified web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for EP2SGX90F1508. Obtain the exact manufacturer compliance declaration before regulated use.
