EP2SGX90FF40C3NES - Stratix II GX FPGA 90K LE FC-FBGA | Intel
MPN: EP2SGX90FF40C3NES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1595 | $159,500.00 |
| 250 | $1495 | $373,750.00 |
| 500 | $1395 | $697,500.00 |
EP2SGX90FF40C3NES Overview
What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, with embedded hard IP such as block RAM, DSP blocks, PLLs, and (in the Stratix II GX family) multi-gigabit transceivers. FPGAs occupy a tier between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they deliver ASIC-class parallelism and data-path throughput while remaining reconfigurable in the field, making them the workhorse of high-speed serial I/O, digital signal processing, and prototyping for ASIC emulation.
Key features of the EP2SGX90FF40C3NES include a 1.2 V core supply, 816.9 MHz maximum internal operating frequency, 90 nm process technology, integrated PCI Express hard IP, and up to 12 transceivers supporting data rates up to 6.375 Gbps. The device also provides dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic and embedded TriMatrix memory blocks for low-latency on-chip storage.
Architecturally, the Stratix II GX combines a logic fabric based on adaptive logic modules (ALMs) with embedded transceivers hardened for serializer-deserializer (SerDes) protocols. The hard PCI Express and 10-Gbps Ethernet intellectual property eliminates the need to consume FPGA fabric for these interfaces, freeing logic for the user application and reducing timing closure risk in high-speed designs.
Typical applications include high-speed serial interface bridging, telecommunications backhaul line cards, military radar signal processing, ASIC prototyping, broadcast video processing, and test and measurement equipment. The integrated transceivers make the part especially suitable for designs requiring multi-gigabit serial links such as Serial RapidIO, XAUI, SATA, and PCI Express.
When designing with this device, ensure the FC-FBGA-1508 PCB land pattern matches the Intel reference footprint exactly, and that the power distribution network uses the recommended decoupling scheme to limit core supply ripple under high SerDes switching activity. Thermal management must account for the device's commercial extended temperature grade (0 °C to 85 °C).
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet alone, drawing on Stratix II GX family collateral and XAIPART internal cross-reference data.
Drop-in alternatives for EP2SGX90FF40C3NES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF40C3NES (same form factor and footprint) — differing in Package, Mounting Type, Speed Grade, Configuration Method, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90FF40C3N
✅ Drop-In✓ In Stock
$1580 / Unit
View Datasheet →EP2SGX90FF1508C3
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX90FF1508C3ES
✅ Drop-In✓ In Stock
$1340 / Unit
View Datasheet →EP2SGX90FF1508C3N
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →EP2SGX90FF1508I3
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →EP2SGX90FF1508I3N
✅ Drop-In✓ In Stock
$1460 / Unit
View Datasheet →EP2SGX90FF40C3NES Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | EP2SGX90 |
| Logic Elements | 90,960 |
| Logic Array Blocks (LABs) / CLBs | 4,828 |
| Maximum Internal Frequency | 816.9 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Transceivers | Up to 12 (SerDes, up to 6.375 Gbps) |
| Hard IP | PCI Express, 10G Ethernet, TriMatrix memory, DSP blocks |
| Package | 1508-pin FC-FBGA (FF1508) |
| Package Code | BGA |
| Package Shape | Square |
| Number of Terminals | 1508 (ball) |
| Operating Temperature (Commercial Extended) | 0 C to 85 C |
| Mounting Type | Surface Mount |
EP2SGX90FF40C3NES square Pin Configuration Guide
Pin configuration for EP2SGX90FF40C3NES (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF40C3NES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF40C3NES is suitable for 7 applications: 10G Ethernet Network Interface Card, PCI Express Endpoint Card, ASIC Prototyping Platform, Telecom Baseband Processing, Military Radar Signal Processing, Broadcast Video Processing, Test and Measurement Equipment.
10G Ethernet Network Interface Card
The EP2SGX90FF40C3NES is well suited for line-card and NIC designs that need multi-gigabit serial I/O. The 12 embedded transceivers supporting up to 6.375 Gbps enable four XAUI lanes (4 x 3.125 Gbps) or a single XFI link at 10.3125 Gbps using oversampling, while the hard 10G Ethernet MAC IP reduces soft-logic footprint. With 90,960 logic elements and 4,828 LABs the device can host the full 10G MAC, classification, and queue-management data path. Power-supply decoupling and FF1508 BGA escape routing are the principal implementation challenges.
Recommended
PCI Express Endpoint Card
The EP2SGX90FF40C3NES includes hard PCI Express IP that implements the PHY, MAC, and transaction layer for x4 or x8 Gen1 links without consuming soft logic. The 1.2 V core and 816.9 MHz fabric speed provide headroom for protocol engines, scatter-gather DMA controllers, and driver-side state machines. The FF1508 FC-FBGA supports the lane-count routing required for x8 edge connectors, and the 4,828 LABs comfortably fit a complete NVMe controller front end. Commercial-extended temperature (0-85 C) covers server-room inlet air.
Recommended
ASIC Prototyping Platform
With 90,960 logic elements, 4,828 LABs, abundant TriMatrix memory, and 12 multi-gigabit transceivers, the EP2SGX90FF40C3NES is a strong prototyping vehicle for mid-complexity ASICs in the 5-10 Mgate range. Designers partition the ASIC RTL across multiple Stratix II GX devices using TDM or pin-multiplexing schemes to validate logic and connectivity pre-silicon. Hard PCIe and SerDes blocks let the prototype mimic the final ASIC's real I/O rather than relying on soft equivalents, increasing pre-silicon confidence. Quartus II software provides design-partitioning and timing-closure guidance for multi-FPGA prototyping flows.
Recommended
Telecom Baseband Processing
The EP2SGX90FF40C3NES DSP blocks and 90,960 logic elements deliver the multi-hundred-MHz DSP throughput required for WCDMA, LTE, and WiMAX baseband signal processing. Hard transceivers back-haul digitized RF to baseband over CPRI or OBSAI at 3.072 Gbps per lane, eliminating external SerDes chips. The 1.2 V core and FF1508 BGA package support the dense PCB layouts used in telecom line cards where board area is at a premium. Thermal design must account for sustained high toggle rates across all 4,828 LABs.
Recommended
Military Radar Signal Processing
The commercial-extended 0-85 C temperature grade plus Intel's hardened SerDes make the EP2SGX90FF40C3NES attractive for radar front-end digitizer cards where LVDS ADC data must be serialized and forwarded to a co-processor. The 90K logic elements support pulse compression, MTI filtering, and CFAR detection in a single FPGA, while the 12 transceivers aggregate multiple ADC lanes into a single high-speed fabric link. Designers often pair it with EP2SGX130 or EP2S90 parts for phased-array antenna signal distribution.
Recommended
Broadcast Video Processing
Broadcast video routers and processing engines need many high-speed serial I/O for SDI (SMPTE 424M/425M) and 10G Ethernet. The EP2SGX90FF40C3NES provides 12 transceivers at 3 Gbps capable of hosting 4-6 SDI channels plus 10G Ethernet, while the 90K logic elements implement de-interlacers, color-space converters, and frame synchronizers. The 1.2 V core and 4,828 LABs offer comfortable logic capacity for 1080p60 processing pipelines, and Quartus II IP libraries include ready-to-use SDI and 10G Ethernet reference designs.
Recommended
Test and Measurement Equipment
High-end oscilloscopes, logic analyzers, and protocol analyzers benefit from the EP2SGX90FF40C3NES's combination of 12 multi-gigabit transceivers and abundant logic for trigger sequencing, state decoding, and waveform DSP. The hard PCI Express block streams captured waveforms to the host PC at 2.5 GT/s without soft-logic overhead. The 90 nm CMOS process provides deterministic timing for protocol-compliance testing, and the FF1508 FC-FBGA supports the high pin density needed for parallel LVDS ADC interfaces alongside serial trigger links.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF40C3NES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF40C3N | EP2SGX90FF1508C3 | EP2SGX90FF1508C3ES | EP2SGX90FF1508C3N | EP2SGX90FF1508I3 | EP2SGX90FF1508I3N |
|---|---|---|---|---|---|---|---|
| Package | FF1508 FC-FBGA (1508-ball) | FF1508 FC-FBGA - same | FF1508 FC-FBGA - same | FF1508 FC-FBGA - same | FF1508 FC-FBGA - same | FF1508 FC-FBGA - same | FF1508 FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| LABs / CLBs | 4,828 | 4,828 | 4,828 | 4,828 | 4,828 | 4,828 | 4,828 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C3 | C3 | C3 | C3 | C3 | I3 (industrial temp) | I3 (industrial temp) |
| Temperature Grade | Commercial extended (0-85 C) | Commercial extended (0-85 C) | Commercial extended (0-85 C) | Commercial extended (0-85 C) | Commercial extended (0-85 C) | Industrial (-40 to 100 C) | Industrial (-40 to 100 C) |
| Transceivers | Up to 12 (up to 6.375 Gbps) | Up to 12 | Up to 12 | Up to 12 | Up to 12 | Up to 12 | Up to 12 |
| Lifecycle | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Standard production variant with identical silicon (vs EP2SGX90FF40C3N)
- Same density, broader qualification coverage across FF1508 family (vs EP2SGX90FF1508C3N)
- Industrial temperature grade option (vs EP2SGX90FF1508I3N)
Design Notes
The FF1508 FC-FBGA package requires a high-density PCB stack-up, typically 12+ layers with sub-1 mil laser-drilled microvias to escape the 1.0 mm pitch BGA. Use the Intel reference land pattern with NSMD (non-solder-mask-defined) pads for the most reliable assembly; SMD pads risk pad-to-pad bridging during reflow. Match the high-speed transceiver channel routing to the Stratix II GX guidelines for 6.375 Gbps operation: matched 100-ohm differential impedance, length matching within 150 mils across lanes, and continuous reference planes on adjacent layers to control crosstalk.
Decoupling the EP2SGX90FF40C3NES 1.2 V core is critical because the device draws transient currents in the tens of amps when transceivers toggle simultaneously. Place a 1:2:1 ratio of bulk, mid-frequency, and high-frequency ceramic capacitors within 100 mils of each BGA pin pair, sized per Intel's PDN (Power Distribution Network) design guidelines. Use Intel's Early Power Estimator (EPE) tool and PowerPlay Power Analyzer to model core and transceiver power consumption before finalizing the regulator sizing; budget headroom for the worst-case junction temperature.
Estimated: at full logic utilization (90% of 90,960 LE) and 4 active 6.375 Gbps transceivers, the EP2SGX90FF40C3NES can dissipate 15-20 W. With the FF1508 FC-FBGA's typical theta_JA of 12-15 C/W on a JEDEC 4-layer test board, junction temperature can exceed 125 C in still air. Add a heatsink with thermal interface material and forced airflow (>= 200 LFM) to keep Tj below 100 C for reliable long-term operation. The commercial-extended temperature grade (0-85 C) is for the ambient-air inlet; the junction must still be calculated from the actual on-board thermal environment.
Common pitfalls when designing with the EP2SGX90FF40C3NES include: (1) confusing the EP2S90 (Stratix II, no transceivers) with EP2SGX90 (Stratix II GX, with transceivers); (2) ignoring the C3/I3/I4/C4 speed-grade designation when porting designs across the same family; (3) relying on JTAG boundary-scan alone for production programming without providing a fast passive-parallel (FPP) configuration path for field upgrades; (4) leaving the MSEL configuration pins floating - they MUST be pulled to the correct state for the chosen configuration mode; and (5) underestimating configuration time for 90K LE designs, which can take 1-2 seconds from a standard EPCS64 flash.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status are [DATA_NEEDED] because the verified web data does not specify these certifications for the EP2SGX90FF40C3NES lot. AEC-Q100 is not applicable (FPGAs are not automotive-qualified at the silicon level; the customer system integrator handles AEC-Q100 qualification).
