EP4CE40F29C8LN - 39,600-LUT FPGA, 532 I/O | Altera | Embedded
MPN: EP4CE40F29C8LN β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP4CE40F29C8LN Overview
A field-programmable gate array is a semiconductor device built from programmable logic blocks, routing resources, memory blocks, and programmable I/O. Engineers configure these resources after PCB assembly to implement counters, state machines, interface bridges, signal-processing pipelines, and custom peripherals. In the broader hierarchy, an FPGA belongs to programmable logic devices within integrated circuits; unlike a fixed-function application-specific integrated circuit, its logic can be revised through configuration without changing the PCB.
The principal EP4CE40F29C8LN resources are 39,600 logic cells, 532 I/O pins, 1,161,216 embedded memory bits, and a 780-ball BGA package. The high I/O count makes the device useful when many parallel control signals, memory interfaces, or custom I/O protocols must be concentrated in one device. The verified listings also associate the Cyclone IV E family with a 60 nm process technology and a 1.2 V core supply.
Cyclone IV E devices combine programmable logic fabric with embedded memory and programmable I/O structures. This allows deterministic parallel processing and hardware-level concurrency while retaining design flexibility. Configuration data determines the logic functions and interconnections. Board-level power integrity, configuration-mode handling, decoupling, and signal integrity therefore remain central to reliable operation, particularly for a 780-ball fine-pitch package.
Typical uses include industrial motor-control platforms, test and measurement equipment, communications-interface equipment, image-processing front ends, and embedded controllers. The 39,600-cell capacity suits moderate-to-large digital designs, while 532 I/O provides substantial external connectivity. Engineers can evaluate the device for parallel data acquisition, custom bus protocols, real-time control, and hardware acceleration.
A key design consideration is BGA assembly: the F29 package uses 1 mm ball pitch and requires controlled PCB fabrication and assembly. Power, ground, configuration, and I/O banks must be routed using the manufacturer package guidelines, and all required supply rails must be decoupled close to their pins. Thermal, timing, and signal-integrity signoff should be completed in the supported FPGA design environment.
This page combines verified manufacturer, distributor, and cross-reference evidence to summarize EP4CE40F29C8LN resources, package details, sourcing data, same-family ordering options, and explicit design considerations. Missing electrical limits and complete ball-level pinout data are marked for manufacturer-datasheet confirmation rather than inferred.
Drop-in alternatives for EP4CE40F29C8LN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F29C8LN (same form factor and footprint) β differing in Package, Speed Grade, Configuration Modes, Embedded Memory, Operating Temperature.
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View Datasheet βEP4CE40F29C8LN Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Cyclone IV E |
| Logic Cells | 39,600 cells |
| User I/O Count | 532 I/O |
| Embedded Memory | 1,161,216 bits |
| Maximum Frequency | 362 MHz |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Package Type | FBGA-780 |
| Terminal Count | 780 terminals |
| Package Dimensions | 29 mm x 29 mm |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Lead-Free | Lead-free |
EP4CE40F29C8LN 29 mm x 29 mm Pin Configuration Guide
Pin configuration for EP4CE40F29C8LN (29 mm x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F29C8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F29C8LN is suitable for 6 applications: Industrial Control and Automation, Test and Measurement Equipment, Communications Interface Equipment, Machine Vision and Image Processing, Embedded Control and Data Acquisition, Hardware-Accelerated Digital Systems.
Industrial Control and Automation
EP4CE40F29C8LN fits industrial control systems that need deterministic parallel processing, configurable timing, and many external connections. Its 39,600 logic cells can host state machines, protocol bridges, counters, pulse generators, and custom control datapaths, while 532 user I/O support interfaces to sensors, actuators, converters, and local buses. The 1,161,216 embedded memory bits provide resources for FIFOs, lookup tables, and short data buffers. Engineers can use the FPGA to consolidate glue logic and adapt interfaces when machinery protocols change. The 1.2 V core supply and 780-ball BGA package require disciplined power-plane and thermal design. Confirm the exact temperature grade, I/O-bank limits, configuration mode, and timing constraints in the current Altera documentation before qualifying the device for an industrial environment.
Recommended
Test and Measurement Equipment
EP4CE40F29C8LN is suitable for test equipment that needs simultaneous acquisition control, waveform sequencing, protocol emulation, and real-time data routing. The 39,600 logic cells provide capacity for timing engines, digital filters, trigger logic, and interface translation, while 532 I/O allow parallel connections to ADCs, DACs, front-panel controllers, and backplane transceivers. Embedded memory of 1,161,216 bits can support sample buffers and channel-state storage. The reported 362 MHz secondary-listing value is not a guaranteed design frequency; timing closure must be established for the selected I/O standards, clock topology, and speed grade. The 780-ball F29 package has 1 mm pitch, so signal-integrity planning and controlled BGA escape routing are essential. Use the manufacturer timing and power tools for final signoff.
Recommended
Communications Interface Equipment
EP4CE40F29C8LN can serve as a configurable bridge or packet-processing element in communications equipment. Its 532 I/O support multiple parallel data paths, control channels, and PHY or transceiver-adjacent interfaces. The 39,600-cell fabric can implement framing, error detection, channel coding, traffic shaping, and protocol conversion, while 1,161,216 embedded memory bits provide buffers for short packets and lookup data. A Cyclone IV E implementation benefits from hardware parallelism, allowing independent channels to operate concurrently rather than sharing a sequential processor. The verified data reports 60 nm technology and 1.2 V core voltage, but it does not provide transceiver count or I/O electrical limits. Engineers must therefore confirm bank capabilities, differential-I/O support, power requirements, and timing margins before selecting the device for a communications backplane.
Recommended
Machine Vision and Image Processing
EP4CE40F29C8LN can support image-acquisition front ends, camera-link glue logic, pixel formatting, and moderate real-time preprocessing. The 39,600 logic cells allow pipelined operations such as thresholding, filtering, frame formatting, and sensor synchronization, while 532 I/O provide a large interface budget for image sensors, memory buses, and control signals. Embedded memory of 1,161,216 bits can hold line buffers, lookup tables, and small frame structures when external memory is not required. The reported 362 MHz value is a secondary listing figure and should not be assumed for every image-processing path. Clock-domain planning, I/O timing, and memory bandwidth determine actual performance. The 780-ball, 1 mm-pitch package also requires careful escape routing and signal-integrity validation, especially for high-speed pixel and control interfaces.
Recommended
Embedded Control and Data Acquisition
EP4CE40F29C8LN fits embedded controllers that combine sensor acquisition, actuator control, and custom peripheral interfaces. The 39,600 logic cells can implement sampling schedules, encoders, serializers, protocol handlers, and real-time control loops. Its 532 I/O support a broad mix of digital sensors, memory-mapped devices, and parallel converters. The 1,161,216 embedded memory bits allow local FIFOs and state storage, reducing dependence on a processor for short bursts of data. Because this is a programmable logic device, field updates can modify control behavior without redesigning the PCB. The 1.2 V core rail must be generated with suitable transient response, and the 780-ball BGA requires local decoupling and thermal analysis. Verify all supply rails, configuration requirements, supported I/O standards, and environmental ratings in the latest manufacturer data.
Recommended
Hardware-Accelerated Digital Systems
EP4CE40F29C8LN is a candidate for hardware acceleration where predictable parallelism and custom datapaths outperform a software-only implementation. The 39,600 logic cells support arithmetic pipelines, search engines, digital filters, and parallel comparison networks. With 532 I/O, the device can connect to processors, memories, and high-speed peripheral buses, while 1,161,216 embedded memory bits provide local storage for coefficients, windows, and intermediate results. The FPGA can be reconfigured as algorithms evolve, making it useful for evolving prototypes and production platforms. The verified sources report 1.2 V core voltage, 60 nm technology, and 362 MHz secondary-listing frequency, but not guaranteed logic throughput, multiplier count, or thermal resistance. Validate arithmetic performance through synthesis, place-and-route, and timing analysis. Confirm software-tool support and configuration-security requirements before committing to a new design.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F29C8LN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F29C8L | EP4CE40F29C8 | EP4CE40F29C9LN | EP4CE40F29C7N | EP4CE40F29C6N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BGA F29, 29 mm x 29 mm, 1 mm pitch | 780-BGA F29, same package family | 780-BGA, same package family | 780-BGA, same package family | 780-BGA, same package family | 780-BGA, same package family |
| Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Cells | 39,600 cells | 39,600 cells class | 39,600 cells | 39,600 cells class | 39,600 cells class | 39,600 cells class |
| User I/O | 532 I/O | 532 I/O class | 532 I/O | 532 I/O class | 532 I/O class | 532 I/O class |
| Embedded Memory | 1,161,216 bits | Same family, value not stated in excerpt | Same family, value not stated in excerpt | Same family, value not stated in excerpt | Same family, value not stated in excerpt | Same family, value not stated in excerpt |
| Core Voltage | 1.2 V | Same family, value not stated in excerpt | Same family, value not stated in excerpt | Same family, value not stated in excerpt | Same family, value not stated in excerpt | Same family, value not stated in excerpt |
| Order-Code Difference | EP4CE40F29C8LN | C8LN suffix variant | C8 suffix variant | C9LN suffix variant | C7N suffix variant | C6N suffix variant |
| Cross-Brand Drop-In Confirmed | Not applicable | Same brand | Same brand | Same brand | Same brand | Same brand |
Key Differentiators
- High logic and interface density (vs EP4CE40F29C8)
- Large embedded memory (vs EP4CE40F23C8LN)
- Wide parallel connectivity (vs EP4CE55F29I8LN)
Design Notes
EP4CE40F29C8LN uses a 1.2 V core supply according to the verified secondary listing, but the supplied data does not provide current consumption, power sequencing, or auxiliary-rail requirements. Before schematic release, obtain the manufacturer power-management and device-family documentation, then create a rail budget that includes logic activity, I/O loading, clocking, and configuration startup. Use a regulator with adequate transient response and place local decoupling at the package-plane entry points. Mark all power-pin and rail values that are not present in the verified source as datasheet-confirmation items.
The 780-ball F29 FBGA has 1 mm ball pitch and a 29 mm by 29 mm package body. Follow the manufacturer land pattern and escape recommendations, including via-in-pad or dog-bone fanout only when the assembly process and via structure are qualified. Preserve continuous reference planes where possible, define controlled-impedance routes for high-speed clocks and data, and verify the complete ball map before routing. BGA assembly should use a qualified reflow profile and inspection process appropriate for the selected package construction.
With 532 user I/O, EP4CE40F29C8LN can aggregate many parallel signals, but signal integrity depends on bank placement, termination, drive strength, and clock topology. Assign high-speed interfaces to compatible I/O banks only after reviewing the current pinout. Provide series damping or termination where required by the selected I/O standard, maintain return-path continuity, and use constrained clock and data relationships in the FPGA design environment. Treat the reported 362 MHz value as a secondary-listing reference and perform timing closure for the actual design configuration.
The verified data does not provide a thermal-resistance value, maximum junction temperature, or device power figure. Estimate thermal rise only after selecting the operating clock, logic utilization, toggle rates, I/O loading, and supply currents from manufacturer data. Apply the resulting estimate to the board's copper spreading, airflow, and enclosure assumptions, then verify with a thermal model or measurement. Avoid treating 60 nm process technology as a substitute for a package-specific thermal limit.
Compliance Information
The verified FindIC listing identifies EP4CE40F29C8LN as lead-free, but the supplied data does not provide verified RoHS, REACH, halogen-free, or conflict-minerals declarations. Temperature and environmental qualification require manufacturer confirmation.
