EP3C55F780I7 - Cyclone III FPGA, 55K LEs, 780-FBGA | Altera
MPN: EP3C55F780I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $307.17 | $307.17 |
| 10 | $285 | $2,850.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
EP3C55F780I7 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to configure arbitrary digital circuits after manufacturing. Architecturally, an FPGA sits between an ASIC (fully custom, high NRE cost) and a standard microcontroller, occupying the same hierarchy as a CPLD and other programmable logic devices. The Cyclone III family in particular targets low-cost, high-volume markets by combining LE fabric, M9K memory blocks, embedded multipliers, and PLL-based clock management in a single device.
Key features include 55,856 logic elements, 156 embedded 18x18 multipliers, 234 Kbits of distributed RAM (MLABs), 2,396,160 bits of block RAM, four PLLs for clock synthesis, and 377 single-ended user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The industrial temperature grade (-40C to +100C) and 780-FBGA package with 1 mm ball pitch make the device suitable for moderate-density, board-constrained designs.
Typical applications include digital signal processing pipelines, video bridging and conversion, motor control, industrial communication bridges, and low-cost ASIC prototyping. Designers rely on the Cyclone III family for power-efficient glue logic and parallel signal processing.
When designing with this device, plan power distribution carefully: the 1.2 V core rail typically draws hundreds of milliamps and must be decoupled with 0402/0603 ceramics placed close to each power ball. JTAG configuration via the dedicated MSEL pins should be reserved for production programming.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP3C55F780I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55F780I7 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55F780I7N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP3C55F780C7N
✅ Drop-In✓ In Stock
$138.31 / Unit
View Datasheet →EP3C55F780C8N
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →EP3C55F780C8
✅ Drop-In✓ In Stock
$126.01 / Unit
View Datasheet →EP3C55F780C7
✅ Drop-In✓ In Stock
$76.75 / Unit
View Datasheet →EP3C55F780C6N
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP3C55F780I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Logic Elements / Cells | 55,856 |
| Total RAM Bits | 2,396,160 |
| User I/O Count | 377 |
| Number of Logic Blocks / LABs | 55856 |
| Package | 780-FBGA (FBGA-780), 29 x 29 mm, 1 mm pitch |
| Package Height | 2.60 mm |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Internal Frequency (max) | 472 MHz |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Lead Free / RoHS | Lead Free / RoHS compliant |
| Configuration Memory | SRAM-based (volatile, requires external configuration) |
| Embedded Multipliers (18x18) | 156 |
| PLLs | 4 |
EP3C55F780I7 2.60 mm Pin Configuration Guide
Pin configuration for EP3C55F780I7 (2.60 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55F780I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55F780I7 is suitable for 6 applications: Industrial Motor Control, Video Bridging and Conversion, ASIC Prototyping, Industrial Communication Bridges, DSP Pipeline Implementation, Low-Cost ASIC Replacement.
Industrial Motor Control
The EP3C55F780I7 is well suited for industrial motor control loops because it provides 156 embedded 18x18 multipliers and 2,396,160 bits of block RAM, which directly accelerate Park/Clarke transforms and PI controller calculations on three-phase PMSM or induction motor drives. The 472 MHz internal PLL output, multiplied from a low-cost 50 MHz crystal, drives 10 kHz to 50 kHz PWM switching with sub-microsecond sample periods and negligible dead-time distortion. The 377 user I/Os accommodate multi-axis quadrature encoder inputs, resolver feedback, and gate-driver interfaces without external bus expanders, and the industrial -40C to +100C temperature grade supports cabinet and machine-mount installations.
Recommended
Video Bridging and Conversion
The EP3C55F780I7 fits video bridging applications where HDMI, DVI, DisplayPort, or parallel RGB inputs must be upscaled, downscaled, or format-converted in real time. Its 55,856 logic elements can implement a multi-tap polyphase scaler, and the 2.4 Mbit block RAM holds at least three full horizontal lines of 1080p frame buffers, eliminating the need for external SDRAM in single-screen designs. The 377 I/Os comfortably route 24-bit parallel video plus I2C, CEC, and HPD signalling. At 1.2 V core plus industrial temperature, the device consumes under 1.5 W during typical 1080p60 conversion, enabling fanless set-top and digital signage chassis.
Recommended
ASIC Prototyping
The EP3C55F780I7 is widely used as a low-cost ASIC prototyping platform because its 55K logic elements, 156 hardware multipliers, and 2.4 Mbit block RAM can map RTL blocks of moderate complexity at near-clock speeds. Engineers partition multi-million-gate ASIC designs across multiple FPGAs using TDM or pin-multiplexed channels; this particular density tier holds an entire subsystem (CPU core + peripherals) per device. The 780-FBGA package exposes enough I/O for chip-to-chip interconnect, and Quartus synthesis with Synplify or Precision RTL flows gives fast iteration cycles. Industrial temperature grade allows bench-to-vehicle prototype campaigns without redesign.
Recommended
Industrial Communication Bridges
The EP3C55F780I7 suits industrial communication bridge designs that translate between EtherCAT, PROFINET, EtherNet/IP, Modbus TCP, RS-485, RS-232, and CAN because it can implement multiple industrial MAC stacks concurrently while running user application logic. Its 4 PLLs generate independent clocks for each industrial PHY (typically 25 MHz, 50 MHz, and 125 MHz), and the 377 I/Os provide dedicated banks for galvanically-isolated fieldbus transceivers. Embedded multipliers accelerate CRC, AES, and signal processing for time-sensitive networking. The -40C to +100C industrial grade supports cabinet installations in factories, substations, and outdoor enclosures.
Recommended
DSP Pipeline Implementation
The EP3C55F780I7 enables mid-density digital signal processing pipelines for audio, vibration analysis, or software-defined radio front-ends. Its 156 18x18 hardware multipliers sustain up to ~73 GMACs at 472 MHz when used as 18x18 MAC blocks, supporting FIR, IIR, FFT, and CORDIC implementations at multi-Msample rates. The 2.4 Mbit block RAM acts as a twiddle-factor or coefficient store, while 234 Kbits of distributed RAM (MLABs) implement shift registers and delay lines. Designers target the industrial temperature range for outdoor vibration monitoring and predictive-maintenance sensor pods.
Recommended
Low-Cost ASIC Replacement
The EP3C55F780I7 is frequently chosen as a low-cost ASIC replacement for low-volume products where mask costs exceed the unit-price premium of an FPGA. The device supports 10K to 100K unit annual volumes with per-unit cost approximately USD 195 at 1000-piece qty, well below the NRE of a 65 nm ASIC at this logic density. Designers benefit from late-stage spec changes via Quartus recompile rather than mask re-spin, and the 780-FBGA package is compatible with EP3C40F780I7 and EP3C120F780I7 for density migration without PCB rework, future-proofing the design.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55F780I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55F780I7N | EP3C55F780C7N | EP3C55F780C8N | EP3C55F780C8 | EP3C55F780C7 | EP3C55F780C6N |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Embedded Multipliers (18x18) | 156 | 156 | 156 | 156 | 156 | 156 | 156 |
| Block RAM (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| User I/O | 377 | 377 | 377 | 377 | 377 | 377 | 377 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I7 (industrial, speed 7) | I7 (industrial, speed 7) | C7 (commercial, speed 7) | C8 (commercial, speed 8 - faster) | C8 (commercial, speed 8 - faster) | C7 (commercial, speed 7) | C6 (commercial, speed 6 - slower) |
Key Differentiators
- Industrial -40C to +100C temperature grade (vs EP3C55F780C7N)
- Higher logic element density than EP3C40 in same package (vs EP3C40F780I7N)
- Lower cost than EP3C120 in same package (vs EP3C120F780I7N)
Design Notes
The EP3C55F780I7 requires three supply rails: a 1.2 V core (VCCINT), a 2.5 V analog supply (VCCA), and 3.0-3.3 V I/O banks (VCCIO). Estimated: at 100% resource utilisation and 472 MHz PLL output, total device current can approach 1 A on VCCINT; place a minimum of 8x 100 nF 0402 X5R ceramic bypass capacitors distributed around the package perimeter within 5 mm of the power balls, plus 4x 10 uF bulk ceramics on each rail. Use wide 0.5 mm power pours on inner layers.
The 780-FBGA package uses 1.0 mm ball pitch on a 29 x 29 mm body; microvia HDI PCB construction is strongly recommended for escape routing, with at least 4-6 routing layers to fan out 377 I/Os. Estimated: signal escape from the inner rows may require via-in-pad with filled and plated-over vias to meet breakout density. Matched-length differential pairs (LVDS) should be tuned to within 150 mil for >1 Gbps signalling; consult the Cyclone III device handbook PCB layout chapter for via pattern guidelines.
Estimated: at full resource utilisation the EP3C55F780I7 can dissipate 1.5-2.5 W, well within the 780-FBGA theta_JA of approximately 15 C/W with a 4-layer JEDEC test board, giving junction-to-ambient rise of 25-40 C. Industrial grade requires junction temperature to remain below 100 C, leaving adequate margin in typical cabinet environments. For sealed enclosures or stacked PCB assemblies, conduct thermal characterisation with thermocouples on the top-of-package or use the on-die ALT_SMON temperature sensor via the Quartus tool.
Critical: SRAM-based Cyclone III FPGAs are volatile and require configuration at every power-up; do not skip the external configuration memory (EPCS) or JTAG programming path. Always assert nCONFIG low on power-up glitches longer than 100 us to prevent partial configuration. Tie unused I/O banks to a defined VCCIO rather than leaving them floating; unconfigured I/Os default to tri-state but can draw leakage current. For JTAG boundary-scan testing, leave TCK, TMS, TDI, TDO accessible in the schematic.
Compliance Information
Lead-free per DigiKey listing and alldatasheet.com product metadata. RoHS compliance confirmed by DigiKey 1823477 listing. Halogen-free status not explicitly stated in verified data. AEC-Q100 not applicable - this is an FPGA, not a discrete automotive IC.
