EP3CLS70F780C7N - 70K LE Cyclone III LS FPGA, 780-BGA | Intel
MPN: EP3CLS70F780C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $467.64 | $467.64 |
| 10 | $430.21 | $4,302.10 |
| 100 | $385.5 | $38,550.00 |
| 250 | $352.1 | $88,025.00 |
| 500 | $318.75 | $159,375.00 |
EP3CLS70F780C7N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, and block RAM that can be rewired in the field to implement arbitrary logic functions. Cyclone III LS parts sit inside the broader Intel FPGA portfolio (FPGA -> programmable logic -> logic IC -> semiconductor). Designers choose FPGAs over ASICs for low-volume designs, rapid prototyping, and designs requiring hardware reconfigurability after deployment.
Headline specs include 70,208 logic elements, 4 transceivers (none - this is a logic-only family), 200 18x18 multipliers, 3,068,928 bits of RAM, and 413 user I/O pins. The "LS" suffix denotes the low-static-power variant with enhanced security features (including bit-stream encryption and anti-tamper support) tuned for industrial, communications, and consumer applications. Maximum user I/O is 413; differential I/O and LVDS signaling are supported through dedicated hardware.
The Cyclone III LS architecture pairs a programmable logic fabric with on-chip RAM, DSP blocks, PLLs, and external memory interfaces. It supports DDR/DDR2/DDR3 SDRAM and QDRII+ SRAM via dedicated PHY blocks. The 60-nm process and 1.2 V core voltage give it a favorable power profile for fan-less embedded designs, while the 780-BGA package provides enough ball-out density to break out 413 user I/O plus configuration, clock, and power pins.
Typical applications include industrial motor control and factory automation, video processing and display controllers, software-defined radio front-ends, medical imaging signal chains, automotive infotainment prototypes, and consumer audio/video processing. The combination of low static power, large logic capacity, and abundant DSP blocks makes it a strong fit for DSP-heavy signal-processing tasks where deterministic real-time performance is required.
A key design consideration is that the 780-BGA package requires multilayer PCB design with via-in-pad or dog-bone fan-out, controlled-impedance routing for high-speed transceivers/PLL clocks, and 6-4 layer stack-ups with continuous reference planes. Designers should follow Altera's AN 484 (Signal Tap) and AN 465 (DDR layout) guidelines and verify thermal performance - although Cyclone III LS is low power, large logic utilization can still drive junction temperature close to the 125 C Tj max in enclosed enclosures.
This page synthesizes distributor pricing, 780-BGA pin-compatible alternatives from the same Cyclone III LS family, and practical board-design notes that go beyond the Cyclone III Device Handbook by adding curated cross-references and PCB-layout trade-offs.
Drop-in alternatives for EP3CLS70F780C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70F780C7N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS100F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$298.75 / Unit
View Datasheet →EP3CLS70F780C7
✅ Drop-In✓ In Stock
$350 / Unit
View Datasheet →EP3C80F780C7N
✅ Drop-In✓ In Stock
$260 / Unit
View Datasheet →EP3C55F780C7N
✅ Drop-In✓ In Stock
$138.31 / Unit
View Datasheet →EP3CLS200F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$199.5 / Unit
View Datasheet →EP3CLS150F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$88.4 / Unit
View Datasheet →EP3CLS70F780C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements | 70,208 |
| Logic Array Blocks | 47,452 |
| Total Memory Bits | 3,068,928 bits |
| Embedded Multipliers (18x18) | 200 |
| Maximum User I/O | 413 |
| User I/O (this package) | 413 |
| Package | 780-ball FBGA (F780) |
| Pins/Balls | 780 |
| Core Voltage | 1.2 V |
| Supply Voltage | 1.2 V |
| Process Node | 60 nm |
| Operating Temperature | 0C to +85C (commercial) |
| Transceivers | 0 (no high-speed transceivers) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP3CLS70F780C7N 780-ball fbga (f780) Pin Configuration Guide
Pin configuration for EP3CLS70F780C7N (780-ball fbga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70F780C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70F780C7N is suitable for 6 applications: Industrial Motor Control & Factory Automation, Video Processing & Display Controllers, Software-Defined Radio Front-End (Digital Baseband), Medical Imaging Signal Chain, Automotive Infotainment Prototyping, Consumer Audio/Video Processing.
Industrial Motor Control & Factory Automation
The EP3CLS70F780C7N is well-suited for industrial motor-control and factory-automation designs because its 200 18x18 multipliers handle field-oriented control (FOC) math at 32 kHz PWM rates, and its 3 Mb embedded RAM buffers encoder feedback without external memory. The 413 user I/O support multiple encoder interfaces (QEI, SSI), resolver-to-digital inputs, and high-current gate-driver PWM channels on a single device. The Cyclone III LS low-static-power fabric and 1.2 V core enable fan-less operation in sealed enclosures, while the bit-stream encryption protects proprietary FOC algorithms. Compared to microcontrollers, the FPGA achieves deterministic sub-microsecond loop times critical for sinusoidal commutation of PMSM motors. The 780-BGA package supports multilayer PCBs with sufficient pin density to break out all 413 I/O plus isolated communication interfaces.
Recommended
Video Processing & Display Controllers
The EP3CLS70F780C7N handles real-time 1080p video processing with 200 dedicated 18x18 multipliers performing pixel-rate operations such as deinterlacing, scaling, color-space conversion, and edge enhancement. The 3 Mb embedded memory (M9K blocks) is ideal for line buffers and frame-delay FIFOs, eliminating external SRAM for many designs. Its 413 user I/O accommodate parallel RGB/YCbCr video buses, HDMI/DVI bridges, and LCD panel LVDS interfaces. The low-static-power 60-nm fabric keeps junction temperature low enough for fan-less flat-panel TV or set-top box enclosures. Compared to ASSPs, the FPGA enables differentiation via custom video algorithms while still meeting aggressive BOM cost targets.
Recommended
Software-Defined Radio Front-End (Digital Baseband)
The EP3CLS70F780C7N is widely used as a digital baseband processor in narrow-band SDR prototypes operating below 100 MHz. Its 200 18x18 multipliers implement matched filters, FFT/iFFT butterfly operations, and digital down-converters at sample rates up to 150 MSPS. The 3 Mb embedded memory holds twiddle-factor tables and signal-history buffers. While Cyclone III LS lacks high-speed transceivers, designers can pair it with external ADCs/DACs over LVDS parallel interfaces using the 413 user I/O. The low-static-power fabric enables portable, battery-powered SDR test equipment. Compare to ASIC DSPs, the FPGA gives reconfigurable protocol stacks (LTE, WiMAX, proprietary) for prototype development.
Recommended
Medical Imaging Signal Chain
In medical imaging systems such as ultrasound beamformers and endoscopy video processors, the EP3CLS70F780C7N provides deterministic low-latency DSP through its 200 hardware multipliers and dedicated RAM blocks. Ultrasound beamforming requires summing delayed channel samples at MHz rates - well within the FPGA's capabilities. The 413 user I/O support multiple analog-front-end ADC buses, while the LS security feature protects patient-data confidentiality through encrypted bit-streams. The low-static-power 1.2 V core allows fan-less sealed enclosures required for OR and bedside equipment. Compared to GPU or DSP alternatives, the FPGA achieves lower latency and lower BOM cost for portable point-of-care devices.
Recommended
Automotive Infotainment Prototyping
Automotive infotainment R&D teams use the EP3CLS70F780C7N to prototype head-unit DSP pipelines (audio post-processing, voice enhancement, noise cancellation) and pre-production display controllers. Its 200 18x18 multipliers run multi-band EQ, Dolby/DTS decode engines, and active noise-cancellation filter banks. The 3 Mb RAM buffers audio streams for time-alignment, while 413 I/O break out LVDS display buses, MOST/ CAN buses, and analog audio I/O. The LS variant's bit-stream encryption is valuable for protecting proprietary codec implementations. Production designs typically migrate to Cyclone V or Automotive-Q100-qualified parts, but Cyclone III LS remains ideal for low-cost concept vehicles and aftermarket head-units.
Recommended
Consumer Audio/Video Processing
Consumer AV products such as AV receivers, soundbars, and smart speakers use the EP3CLS70F780C7N to run multi-channel audio DSP (up to 7.1 surround decoding) and HDMI signal switching. The 200 multipliers implement custom EQ, room-correction, and psychoacoustic bass-enhancement algorithms in real time. The 3 Mb embedded memory serves as delay-line and convolution buffers for room-correction FIRs. Its 413 user I/O support multiple HDMI ports (parallel RGB/YCbCr), S/PDIF, and analog audio. The low-static-power 1.2 V core enables fan-less slim AV receivers and soundbars. Compared to dedicated DSPs, the FPGA enables brand-differentiating custom audio IP per product line.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70F780C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100F780C7N | EP3C80F780C7N | EP3C55F780C7N | EP3CLS70F780C7 |
|---|---|---|---|---|---|
| Package | 780-FBGA (F780) | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same |
| Brand | Intel (formerly Altera) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Family | Cyclone III LS (low-static-power, security) | Cyclone III LS (same) | Cyclone III (no LS security) | Cyclone III (no LS security) | Cyclone III LS (same) |
| Logic Elements | 70,208 | 100,448 (+43%) | 81,264 (+16%) | 55,856 (-20%) | 70,208 (same) |
| Embedded Memory (bits) | 3,068,928 | 3,888,384 (+27%) | 2,743,040 (-11%) | 2,396,160 (-22%) | 3,068,928 (same) |
| 18x18 Multipliers | 200 | 240 (+20%) | 244 (+22%) | 156 (-22%) | 200 (same) |
| Maximum User I/O | 413 | 413 (same) | 295 (-29%) | 377 (-9%) | 413 (same) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
| Process Node | 60 nm | 60 nm (same) | 60 nm (same) | 60 nm (same) | 60 nm (same) |
Key Differentiators
- Low-static-power security variant with bit-stream encryption (vs EP3C80F780C7N)
- Higher density option in same package (vs EP3CLS70F780C7N itself vs EP3CLS100F780C7N)
- Balanced LE/RAM/multiplier ratio for DSP workloads (vs EP3C55F780C7N)
Design Notes
The 780-ball FBGA package requires a multilayer PCB (typically 6-10 layers) with 0.8 mm ball pitch, microvia or via-in-pad technology, and a continuous reference plane under the BGA. Per Cyclone III LS Hardware Design Guidelines, fan-out traces must maintain 50 ohm single-ended impedance (or 100 ohm differential). Use 1 oz copper on outer layers and 0.5 oz on inner layers for thermal spreading. BGA escape routing should follow dog-bone fan-out for vias, or microvia-in-pad for finer escape. Place decoupling capacitors on the bottom side directly under BGA balls, using 0402 or 0201 footprints, with one 100 nF per power pin and bulk 10 uF per voltage rail. Allocate at least 2-3 PCB layers for GND to manage return-current paths for high-speed LVDS pairs.
Estimated: at 100 percent LE utilization (70,208 LEs @ 1.2 V, 60 nm) and full memory-block activation, the device can dissipate up to 2.5 W typical, with thermal resistance theta_JA around 22 C / W (still-air, JEDEC 4-layer test board). At 25 C ambient, junction temperature rises to roughly 80 C, well below the 125 C commercial maximum. However, in sealed fan-less enclosures with 60 C ambient, junction temperature can exceed 100 C and require thermal relief (copper heatsink pads, thermal vias, chassis conduction). Designers should always run a thermal simulation using actual LE utilization data from Quartus PowerPlay early in the layout phase.
LVDS pairs on the 780-FBGA package require matched-length routing within 50 mil tolerance (less than 25 mil for DDR interfaces). Differential impedance must be controlled to 100 ohms +/-10 percent. Place series-termination resistors within 200 mil of the driver, and avoid routing LVDS over plane splits. For DDR/DDR2/DDR3 external memory interfaces, follow Altera's External Memory Interface Handbook and use the Altera DDR pin planner to validate read/write leveling and IO delay chain settings. Always simulate critical interfaces (DDR, LVDS, PLL clocks) using HyperLynx or SiSoft QCD with the IBIS model for the specific speed grade (C7 = 437 MHz internal clock, commercial).
Common pitfalls when designing with the EP3CLS70F780C7N include: (1) ignoring JTAG configuration pin termination - TMS/TCK/TDO/TDI must all be properly terminated per AN 471; (2) omitting the CRC error-detection pin pull-up, which can cause intermittent configuration failures; (3) driving LVDS pairs without AC-coupling caps if the receiver requires them; (4) violating the 1.2 V core supply tolerance of plus/minus 50 mV - ripple from switching regulators must be filtered; (5) using wrong IO standard (the Cyclone III LS IO banks are NOT all identical - LVDS support is bank-dependent); and (6) forgetting to assign MSEL pins for the correct configuration mode (AS, PS, JTAG).
Compliance Information
Cyclone III LS devices are RoHS-compliant per Altera/Intel product page. Commercial temperature grade (C7 suffix). Not AEC-Q100 qualified - for automotive infotainment R&D prototyping only; production automotive designs must use Q100-qualified Cyclone IV/V/10 automotive parts.
