EP3CLS70F780C8N - 70,208-Low-Power FPGA | Altera | Digital Logic
MPN: EP3CLS70F780C8N β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3CLS70F780C8N Overview
A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic elements, routing resources, memory blocks, and configurable I/O. The device is programmed after assembly to implement digital functions, state machines, interfaces, datapaths, and control logic. Within the semiconductor hierarchy, an FPGA belongs to programmable logic, which also includes complex programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for different designs while using the same physical component.
The headline resources of EP3CLS70F780C8N are its 70,208 cells, 413 I/O, and 780-ball FBGA package. The package supports high pin density and is suitable for multilayer PCBs that require controlled escape routing. A 1.2 V supply and 65 nm technology place the component in a low-power FPGA family. The reported 402 MHz value is a useful timing benchmark, but system performance depends on the selected configuration, routing, constraints, I/O standards, power rails, and operating conditions.
Cyclone III LS devices use configurable logic and routing resources whose programmed connections are established by the design bitstream. The device can implement parallel processing, custom peripheral interfaces, protocol bridges, and control algorithms. Because the verified sources do not expose the complete architecture, memory count, transceiver count, or detailed electrical limits, those parameters remain marked as unavailable rather than inferred from the family name.
Typical applications include industrial automation controllers, communications equipment, test and measurement platforms, and embedded systems. The 70,208-cell capacity supports moderate digital designs, while 413 I/O can accommodate multiple buses, sensors, converters, or external memory interfaces. The 780-ball FBGA package is appropriate for production boards with controlled-impedance routing, appropriate via-in-pad or fan-out strategies, and careful power-distribution analysis.
A key design consideration is PCB implementation. Engineers should use the official package pinout, signal-integrity rules, decoupling guidance, and FPGA configuration documentation before layout. The 1.2 V rail, clock distribution, configuration signals, and high-speed I/O require disciplined placement and return-path continuity. The reported 402 MHz maximum should not be treated as a guaranteed design frequency without static timing analysis.
This data sheet synthesizes verified distributor specifications, package identity, current availability evidence, pricing indicators, and engineering application guidance. It is designed to make the part easy to compare with other FPGA and CPLD devices while keeping unverified electrical and lifecycle details explicit.
Drop-in alternatives for EP3CLS70F780C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70F780C8N (same form factor and footprint) β differing in Package, RoHS Status, Embedded Memory Bits, PLLs, Speed Grade.
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View Datasheet βEP3CLS70F780C8N Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Cells / Logic Blocks | 47 |
| Logic Cell Count | 70,208 cells |
| User I/O | 413 I/O |
| Supply Voltage | 1.2 V |
| Maximum Operating Frequency | 402 MHz |
| Process Technology | 65 nm |
| Package Type | FBGA |
| Package Pin Count | 780 balls |
| Package Form | BGA, square |
| Mounting Type | Surface Mount |
| Temperature Grading | Other |
| Configuration Type | SRAM-based FPGA |
| Family | Cyclone III LS |
EP3CLS70F780C8N bga, square Pin Configuration Guide
Pin configuration for EP3CLS70F780C8N (bga, square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70F780C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70F780C8N is suitable for 6 applications: Industrial Automation Controller, Communications Protocol Bridge, Test and Measurement Instrument, Embedded Sensor Processing, Motor-Control Coordination, Custom Digital Data Acquisition.
Industrial Automation Controller
EP3CLS70F780C8N fits an industrial automation controller that needs configurable sequencing, parallel logic, and multiple machine interfaces. Its verified 70,208 logic cells can support state machines, protocol conversion, motion-command handling, and supervisory control, while 413 user I/O can connect encoders, sensors, actuators, and local buses. The 1.2 V supply requires a tightly regulated power tree with sequencing and local decoupling. The 780-ball FBGA package is appropriate for a multilayer board with controlled escape routing, continuous ground planes, and verified thermal analysis. Industrial qualification details are not present in the supplied data, so temperature and reliability requirements must be confirmed separately.
Recommended
Communications Protocol Bridge
EP3CLS70F780C8N is suitable for a communications bridge that converts between parallel buses, serialized interfaces, or vendor-specific control protocols. The 413 user I/O provide capacity for multiple channels and status paths, while the 70,208-cell FPGA fabric can implement framing, buffering, error checking, and timing logic in parallel. A reported 402 MHz maximum is a useful preliminary benchmark, but the actual clock rate must be derived from the selected interface and timing constraints. Because the supplied data does not identify dedicated high-speed transceivers, use external physical-layer devices and verify I/O standards, impedance, clock recovery, and signal-integrity requirements.
Recommended
Test and Measurement Instrument
EP3CLS70F780C8N can serve as the programmable timing and data-handling engine in a test and measurement instrument. Its 70,208 logic cells support custom trigger logic, channel sequencing, data formatting, and deterministic control, while 413 I/O can connect sensors, converters, control ports, and test fixtures. The 1.2 V supply and 65 nm process support compact implementation, but the supplied data does not verify analog performance, converter interfaces, or a specific measurement accuracy. Add suitable front-end electronics, clocking, isolation, and calibration. Use static timing analysis to determine whether the architecture can meet the required acquisition rate and deterministic response.
Recommended
Embedded Sensor Processing
EP3CLS70F780C8N fits embedded sensor processing where several inputs must be filtered, correlated, formatted, or routed to a host processor. The FPGA's 70,208 logic cells can implement digital filtering, event detection, sensor fusion preprocessing, and custom interfaces, while 413 I/O allow a broad sensor and actuator interface. The 1.2 V supply supports a controlled low-voltage power architecture, but exact power consumption and thermal limits are not included in the verified data. Designers should estimate resource utilization from the compiled design and confirm memory blocks, I/O standards, configuration support, and operating temperature from the manufacturer documentation.
Recommended
Motor-Control Coordination
EP3CLS70F780C8N can coordinate multiple motor-control functions, including command arbitration, timing generation, feedback processing, fault handling, and communication with a supervisory controller. Its 70,208-cell capacity is appropriate for parallel control algorithms and interface logic, while 413 user I/O can connect position sensors, gate-driver controls, status signals, and communication channels. The 1.2 V core supply must be designed with fast transient response and proper sequencing. The supplied sources do not verify safety ratings, isolation requirements, or industrial temperature qualification, so those aspects require separate review. Confirm the exact I/O electrical limits and pin assignments before connecting gate drivers or external power stages.
Recommended
Custom Digital Data Acquisition
EP3CLS70F780C8N is useful in a custom data-acquisition platform where deterministic parallel logic and flexible I/O assignments are required. The 70,208 logic cells can implement acquisition sequencing, format conversion, channel selection, and local data handling, while 413 user I/O can connect multiple data sources and control signals. A reported 402 MHz maximum provides a reference point for architecture discussions, but the actual acquisition throughput depends on the external converters, clocking scheme, memory resources, and implemented logic. The 780-ball FBGA package supports dense routing, but it demands controlled impedance, careful via fan-out, and a verified power-distribution network. The supplied data does not state analog specifications, so analog performance belongs in the converter and front-end design.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70F780C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS70F780C8 | EP3CLS70F780C7N | EP3CLS70F780C7 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 780-FBGA | 780-FBGA | 780-FBGA | 780-FBGA |
| Pinout Compatibility | Reference device | Candidate; complete ball-map comparison required | Candidate; complete ball-map comparison required | Candidate; complete ball-map comparison required |
Key Differentiators
- Higher verified logic-resource headline than related lower-capacity Cyclone III devices (vs EP3C80F780C8N)
- 413 user I/O in a 780-ball FBGA package (vs EP3CLS70F484C7N)
- Documented 1.2 V supply and 65 nm process identity (vs EP3CLS70F780C7)
- Reported 402 MHz maximum operating frequency (vs EP3CLS70F780C8)
Design Notes
Design the 1.2 V rail from the exact manufacturer power-supply requirements, including regulator accuracy, sequencing, load-transient response, and decoupling placement. Place the smallest high-frequency decoupling capacitors close to the relevant power balls, then add bulk capacitance according to the official reference design. The supplied data does not provide current consumption, voltage tolerances, or rail names; these are [DATA_NEEDED: power-tree details] and must be resolved before layout. Use the final configured design to estimate activity-dependent current and validate it on hardware.
The 780-ball FBGA package requires a verified land pattern and escape strategy. Obtain the official Intel or Altera package drawing for the exact ordering code, then preserve the specified ball pitch, solder-mask opening, via geometry, and layer stack-up. Use continuous reference planes and controlled-impedance routing for clocks and fast I/O. Because the supplied data does not include ball coordinates, pitch, or thermal-pad geometry, do not route the board from generic 780-ball assumptions. Review assembly capability and inspect the escape after signal-integrity analysis.
Plan clock distribution, configuration signals, high-speed I/O, and power returns before placing support components. Keep the FPGA's supply decoupling path short, maintain uninterrupted ground references, and avoid routing fast signals across plane splits. Use the official Cyclone III configuration and pin-assignment files to validate every implemented I/O and reserved ball. The verified 402 MHz value is a device reference, not a routing target; derive actual constraints from the selected design, I/O standard, and timing model.
The supplied web data does not provide junction-to-ambient thermal resistance, maximum junction temperature, or operating-temperature range. Those values are [DATA_NEEDED: thermal limits]. For an initial layout estimate, use the final design's estimated core and I/O power, package data, board stack-up, airflow, and copper area, then confirm the result with the manufacturer thermal guidance and measurement. Avoid relying on the 65 nm process description as a substitute for a thermal rating. Provide adequate copper spreading and thermal vias where the official package guidance permits them.
Do not assume that related MPNs are automatically drop-in replacements. EP3CLS70F780C8, EP3CLS70F780C7N, and EP3CLS70F780C7 share the visible 780-FBGA and 413-I/O context, but the supplied snippets do not prove identical ball functions, timing, power, configuration, or qualification. Likewise, do not assume EP3CLS70F484C7N is compatible: the verified comparison identifies it as a 484-FBGA device with 278 I/O. Treat every replacement as a controlled engineering change requiring datasheet, pin-map, toolchain, and functional-validation review.
Compliance Information
No RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 declaration appears in the supplied verified data. These statuses are unknown except that AEC-Q100 is not applicable to the available product classification, not a claim of non-qualification.
