EP4CE55F23C6N - Cyclone IV E FPGA, 55K LEs, 484-FBGA | Intel
MPN: EP4CE55F23C6N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $91.5272 | $91.53 |
| 10 | $82.37 | $823.70 |
| 100 | $73.22 | $7,322.00 |
| 500 | $64.07 | $32,035.00 |
| 1,000 | $54.92 | $54,920.00 |
EP4CE55F23C6N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware designers to implement arbitrary digital circuits after manufacturing. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and PALs, and serve as a flexible alternative to ASICs for medium-volume designs. The Cyclone IV E family is specifically optimized for low-cost, low-power applications such as industrial control, video processing, and communications infrastructure.
Key features of the EP4CE55F23C6N include 55,856 logic elements (LEs), 2,396,160 RAM bits (approximately 274 kb x 9 or 300 kb x 8 of block RAM), 156 embedded multipliers for DSP operations, 4 PLLs for clock management, and 20 global clock networks. The 484-pin FBGA package supports up to 324 user I/O pins operating across multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The part ships in the commercial speed grade 6 and is lead-free / RoHS compliant.
Architecturally, the Cyclone IV E FPGA uses a 60 nm process with a 1.2 V core supply, delivering a favorable logic-per-dollar ratio versus competing families. Configuration data can be loaded through JTAG, Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) modes using a compatible EPCS or EPCQ configuration device. The internal SRAM-based configuration allows unlimited reconfigurability, while on-chip PLLs provide precise clock synthesis for memory interfaces, high-speed transceivers (when paired with external PHYs), and general logic timing.
Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment prototypes, software-defined radio baseband, communications line cards, and embedded DSP coprocessors. The 55K LE capacity also makes it a popular choice for ASIC prototyping and university digital logic curricula.
When designing with this FPGA, ensure your PCB layout follows Intel's 484-FBGA escape routing guidelines, use multiple GND/VCC pins for power delivery, and pair the device with an EPCS16 or EPCS64 configuration memory if standalone boot is required. Quartus Prime II (or the older Quartus II) software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone IV E family, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for EP4CE55F23C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F23C6N (same form factor and footprint) β differing in Package, Speed Grade, Embedded 18x18 Multipliers, Operating Temperature, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE55F23C6
β Drop-Inβ In Stock
$36.75 / Unit
View Datasheet βEP4CE55F23C7N
β Drop-Inβ In Stock
$56.4 / Unit
View Datasheet βEP4CE55F23I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$119.6 / Unit
View Datasheet βEP4CE55F23A7N
β Drop-Inβ In Stock
$134.4 / Unit
View Datasheet βEP4CE40F23C6N
β Drop-Inβ In Stock
$76.8 / Unit
View Datasheet βXC6SLX45-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
EP4CE55F23C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 55,856 |
| Total RAM Bits | 2,396,160 bits |
| Embedded Multipliers | 156 (18x18) |
| Number of PLLs | 4 |
| Maximum User I/O | 324 |
| Package | 484-FBGA (F23, 23 mm) |
| Mounting Type | Surface Mount |
| Core Voltage | 1.2 V |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | 6 |
| Lead-Free / RoHS | Yes (compliant) |
| Configuration Modes | JTAG, AS, PS, FPP |
| Process Technology | 60 nm |
EP4CE55F23C6N Pin Configuration
| Pin 1 | I/O BANK 8 β User I/O pin (BGA ball A1) |
| Pin 2 | I/O BANK 8 β User I/O pin (BGA ball A2) |
| Pin 3 | GND β Ground reference (multiple GND balls) |
| Pin 4 | VCCIO8 β I/O bank 8 supply voltage |
| Pin 5 | I/O BANK 8 β User I/O pin |
| Pin 6 | I/O BANK 7 β User I/O pin |
| Pin 7 | VCCIO7 β I/O bank 7 supply voltage |
| Pin 8 | I/O BANK 7 β User I/O pin |
| Pin 9 | GND β Ground reference |
| Pin 10 | VCCINT β Core 1.2 V supply |
Typical Applications
EP4CE55F23C6N is suitable for 7 applications: Industrial Motor Control, Video Surveillance / Image Processing, ASIC Prototyping, Communications Line Card / Baseband Processing, Automotive Infotainment Prototype, Embedded DSP Coprocessor, LED Display Wall Controller.
Industrial Motor Control
The EP4CE55F23C6N's 55,856 logic elements and 156 18x18 embedded multipliers are well suited to field-oriented control (FOC) and sinusoidal commutation algorithms for industrial motor drives. The 324 maximum user I/Os allow direct interface to multi-axis PWM controllers, encoder feedback (QEP), and resolver-to-digital converters without external logic. The 4 PLLs synthesize the precision clocks required by ADC sampling and PWM generation, while 2.4 Mbit block RAM holds lookup tables for sine/cosine curves and PID gains. Compared with a microcontroller + DSP split architecture, the FPGA delivers deterministic latency at high PWM frequencies (above 100 kHz) and handles surge computational loads such as sensorless startup transients. Power consumption is moderate thanks to the 1.2 V core on a 60 nm process.
Recommended
Video Surveillance / Image Processing
For multi-channel video surveillance pipelines, the EP4CE55F23C6N provides the DSP and bandwidth to perform real-time edge detection, motion estimation, and H.264 encoding at CIF to D1 resolutions. The 156 hardware multipliers accelerate convolution kernels and DCT blocks, while the 2,396,160 bits of block RAM buffer line-scan and frame data without external memory access stalls. The 324 I/Os accommodate parallel CMOS sensor interfaces (DVP), BT.656 video ports, and high-speed LVDS links to external DDR memory controllers. The 484-FBGA package keeps board area compact for PoE-powered camera designs. Designers can leverage Altera/Intel's VIP (Video and Image Processing) mega-function IP cores in Quartus II to shorten time-to-market.
Recommended
ASIC Prototyping
The EP4CE55F23C6N is widely used as an ASIC prototyping vehicle for mid-complexity ASICs. With 55,856 logic elements, 156 hardware multipliers, and 2.4 Mbit of block RAM, the device maps typical SoC blocks such as AMBA bridges, custom DMA controllers, and small CPU subsystems. Designers can partition a multi-million-gate ASIC across multiple FPGAs using TDM (time-division multiplexing) interfaces. The 484-FBGA package exposes enough I/Os to break out wide internal buses to inter-FPGA cables. Quartus II's incremental compile flow and LogicLock regions enable fast RTL iteration cycles. Industrial temperature and commercial variants support both lab and field prototype deployment.
Recommended
Communications Line Card / Baseband Processing
In communications infrastructure line cards, the EP4CE55F23C6N handles baseband processing, framing, and protocol bridging functions. Its 4 PLLs provide independent clock domains for Ethernet PHYs, framer ICs, and SERDES-grade I/Os operating up to several hundred MHz. The 156 hardware multipliers accelerate Viterbi decoding, Reed-Solomon forward error correction, and QAM modulation. With 324 user I/Os, designers can fan out to multiple SGMII/SFI side interfaces, MDIO management buses, and SPI/I2C control paths. The 60 nm process keeps power dissipation manageable for dense line-card designs. Industrial temperature variants (EP4CE55F23I7N) qualify the part for outdoor cabinet deployment.
Recommended
Automotive Infotainment Prototype
For automotive infotainment prototypes requiring the LVDS and video interfaces found in modern IVI systems, the EP4CE55F23C6N supports multiple camera inputs, display link aggregation, and CAN/LIN bus bridging. The 55,856 LEs handle graphics compositing, surround-view stitching, and audio post-processing. The device's 484-FBGA package footprint accommodates integration with automotive MCU co-processors. Designers targeting production can migrate proven logic to lower-cost automotive Cyclone IV E variants or use this part for pre-silicon validation. Speed grade C6 is sufficient for 720p video processing at 60 fps with adequate timing margin.
Recommended
Embedded DSP Coprocessor
As an embedded DSP coprocessor paired with a microcontroller or ARM host, the EP4CE55F23C6N accelerates computationally intensive kernels such as FFT, FIR filtering, encryption, and machine-learning inference. The 156 18x18 multipliers deliver up to several GMACs of throughput for fixed-point DSP work, while the 2.4 Mbit block RAM provides local coefficient and sample storage, minimizing host-FPGA round trips. The device interfaces to the host via SPI, parallel bus, or PCI Express soft-IP cores, depending on bandwidth requirements. Quartus II DSP Builder provides Simulink-style design entry for engineers transitioning from pure-software DSP development. The Cyclone IV E low static power enables fan-less enclosure designs.
Recommended
LED Display Wall Controller
Large LED video walls for stadiums, control rooms, and digital signage require high-bandwidth pixel repackaging and gamma correction across hundreds of channels. The EP4CE55F23C6N's 324 user I/Os and embedded multipliers enable low-latency fan-out from a single HDMI/DVI input to dozens of LED panel chains, while the 2.4 Mbit block RAM stores frame buffers and color lookup tables. The 4 PLLs synthesize pixel clocks for multiple timing domains required by different panel scan rates. The 1.2 V core supply keeps the FPGA's contribution to overall power consumption manageable even in dense rack-mount controllers. Designers can leverage reference designs for cascaded HUB75 chain protocols.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F23C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23C6 | EP4CE55F23C7N | EP4CE55F23I7N | EP4CE40F23C6N | XC6SLX45-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | FBG-484 - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Xilinx - cross-brand |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 | 43,661 |
| Embedded Multipliers | 156 | 156 | 156 | 156 | 116 | 58 |
| Total RAM Bits | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,161,216 | 2,088,576 |
| Maximum User I/O | 324 | 324 | 324 | 324 | 324 | 316 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | -40C to +100C (industrial) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Mid-density Cyclone IV E with 55K LEs at lowest unit cost (vs EP4CE40F23C6N)
- Industrial temperature upgrade available in same package (vs EP4CE55F23I7N)
- Higher DSP multiplier count than Spartan-6 in same 484-FBGA (vs XC6SLX45-2FGG484I)
- Speed grade flexibility within same die (vs EP4CE55F23C7N)
Design Notes
The EP4CE55F23C6N requires multiple regulated rails: VCCINT at 1.2 V core, VCCAUX at 2.5 V auxiliary, and VCCIOx at 1.2-3.3 V per I/O bank (8 banks total). Estimated worst-case core current is approximately 1.5 A under typical utilization; use a buck converter with at least 20% headroom. Place decoupling capacitors (100 nF plus 10 uF bulk) within 5 mm of every VCC pin. Enable pin power sequencing is not strictly required, but VCCINT should ramp before or simultaneously with VCCAUX to avoid POR latch-up. Estimated: based on Quartus II PowerPlay estimate for 70% utilization at 25C.
The 484-FBGA package uses 1.0 mm ball pitch on a 23 mm body, requiring either 6-layer or 8-layer PCB stack-up with at least two internal planes dedicated to GND and one to VCCINT. Escape routing requires via-in-pad (VIP) or staggered micro-vias for power balls. Use Intel's Cyclone IV E F23 package symbol for ball map; mismatches in BGA ball letters are a common source of routing errors. Provide at least 8 thermal vias under the package thermal pad (if exposed) to dissipate up to 1.5 W. Surface finish on BGA pads should be ENIG or OSP per JEDEC J-STD-020 MSL-3 handling.
Do not confuse the EP4CE55F23C6N with the speed grade C7 variant; the C6 designation is required in part number to ensure ordered parts match your Quartus compilation. Avoid leaving JTAG TCK floating; tie to GND via 10 kohm if unused to prevent false clocking. Configuration mode (MSEL pins) must be hard-strapped to VCCINT or GND before power-up - floating MSEL pins cause boot failure. The Cyclone IV E does not include hard DRAM controllers; external PHY ICs are required for DDR2/DDR3 interfaces. Estimated: power and thermal figures derived from typical Cyclone IV E datasheet PowerPlay estimates.
For LVDS signaling above 500 Mbps on the EP4CE55F23C6N, perform controlled-impedance routing with 100 ohm differential traces and length matching within 150 mil. Use the dedicated clock input pins (CLK[0..3]) for high-speed clocks feeding PLLs; general-purpose I/O cannot drive PLL inputs directly. Place termination resistors (RT) within 200 mil of the FPGA pin. For SDR/DDR memory interfaces, follow Intel's External Memory Interface (EMIF) Toolkit recommendations and verify timing with the TimeQuest analyzer before sign-off.
Compliance Information
RoHS and lead-free per Intel datasheet. MSL-3 moisture sensitivity per JEDEC J-STD-020. AEC-Q100 not applicable for commercial temp grade - choose EP4CE55F23A7N for automotive AEC-Q100-qualified prototypes.
