EP4CE55F23A7N - Cyclone IV E FPGA, 55K LE, 484-FBGA | Intel
MPN: EP4CE55F23A7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168 | $168.00 |
| 10 | $159.6 | $1,596.00 |
| 100 | $151.2 | $15,120.00 |
| 250 | $142.8 | $35,700.00 |
| 500 | $134.4 | $67,200.00 |
EP4CE55F23A7N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as block RAM, DSP blocks, and PLLs that can be reconfigured by the customer after manufacture. FPGAs occupy a unique tier in the digital logic hierarchy: above fixed-function ASICs/ASSPs in flexibility, below microprocessors in sequential performance, but uniquely capable of massive parallel datapath processing and custom high-speed I/O. Within Intel's portfolio, the Cyclone IV E family sits at the low-power, low-cost end - below Cyclone V / Cyclone 10 LP, and well below Stratix / Agilex families - targeting cost-sensitive volume applications where high transceiver counts are not required.
Key feature highlights of the EP4CE55F23A7N include 55,856 logic elements arranged in 2,436 logic array blocks (LABs), 154 18x18 multipliers for hardware-accelerated DSP, 4 general-purpose PLLs and 16 global clock networks, 2.4 Mbits of embedded SRAM organized as M9K blocks, and 324 maximum user I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes from external flash or a download cable.
Typical applications for the EP4CE55F23A7N span industrial motor control, video bridging and image processing, automotive driver-assistance and infotainment pre-processing (AEC-Q100 grade), low-cost ASIC prototyping, and communications line-card glue logic. Designers choose this part when they need mid-range logic capacity (around 50K LEs), generous DSP throughput, and a wide I/O count in a proven, mature, low-power node.
When designing with this device, pay attention to power-rail sequencing: VCCINT (1.2 V core) must ramp before or simultaneously with VCCA (2.5 V analog PLL supply), and VCCIO banks can be powered independently. Use the Quartus II / Quartus Prime design suite (Cyclone IV E device support) for synthesis, place-and-route, and timing closure - older Quartus II 13.0sp1 / 13.1 is the last officially supported version.
Drop-in alternatives for EP4CE55F23A7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F23A7N (same form factor and footprint) β differing in Package, Speed Grade, Configuration Modes, Operating Temperature, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE55F23C7N
β Drop-Inβ In Stock
$56.4 / Unit
View Datasheet βEP4CE55F23I7N
β Drop-Inβ In Stock
$119.6 / Unit
View Datasheet βEP4CE55F23A8N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE55F23C8N
β Drop-Inβ In Stock
$74 / Unit
View Datasheet βEP4CE55F23I8N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE55F29A7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE55F23A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Series | EP4CE55 |
| Logic Elements (LE) | 55,856 |
| Logic Array Blocks (LAB) | 2,436 |
| Embedded Memory Bits | 2,396,160 |
| Embedded Memory Blocks | 234 (M9K) |
| Embedded Multipliers (18x18) | 154 |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Maximum User I/O Pins | 324 |
| Core Voltage (VCCINT) | 1.2 V |
| Analog PLL Supply (VCCA) | 2.5 V |
| Process Technology | 60 nm low-power |
| Speed Grade | -7 |
| Package | 484-ball FBGA (F23, 23x23 mm) |
| Operating Temperature (Junction) | -40C to +125C |
| Configuration Modes | JTAG, AS, AP, PS |
| AEC-Q100 | Qualified (automotive grade) |
EP4CE55F23A7N 484-ball fbga (f23, 23x23 mm) Pin Configuration Guide
Pin configuration for EP4CE55F23A7N (484-ball fbga (f23, 23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F23A7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F23A7N is suitable for 6 applications: Industrial Motor Control, Automotive Driver-Assistance (ADAS) Pre-Processing, Video Bridging and Format Conversion, ASIC and SoC Prototyping, Communications Line-Card Glue Logic, Test & Measurement Instrumentation.
Industrial Motor Control
The EP4CE55F23A7N is well-suited for industrial motor-control applications including field-oriented control (FOC) loops, encoder feedback processing, and power-stage PWM generation. Its 154 18x18 multipliers provide the parallel DSP throughput needed to compute Park/Clarke transforms and PID loops in real time at PWM frequencies up to 50 kHz, while 2.4 Mbits of embedded memory buffers current/torque trajectories and lookup tables for sensorless algorithms. The 324 user I/Os connect to multiple gate drivers, Hall/encoder inputs, and isolated communication ports, and the AEC-Q100 grade (A7) suits harsh factory-floor thermal environments. Designers use the dedicated PLL outputs to synthesize jitter-free PWM clocks and the LVDS I/O pairs to receive high-speed encoder feedback with sub-microsecond latency.
Recommended
Automotive Driver-Assistance (ADAS) Pre-Processing
In automotive ADAS pre-processing blocks (camera pre-process, radar FFT pre-stage, sensor fusion glue logic), the EP4CE55F23A7N's AEC-Q100 grade, wide operating junction range (-40C to +125C), and 1.2 V low-power core make it a reliable choice. The 55,856 logic elements and 154 DSP blocks handle medium-resolution image pipelines (720p/30 fps) and small-window FFTs, while 324 I/Os aggregate inputs from multiple image sensors and CAN/LIN transceivers. The device's deterministic latency on LVDS inputs is critical for time-correlated sensor fusion, and its mature Quartus II 13.1 tool chain has been validated by Tier-1 automotive suppliers. Use the device as a pre-processor feeding a higher-performance host SoC, or as a standalone ECU for camera-monitor systems.
Recommended
Video Bridging and Format Conversion
The EP4CE55F23A7N's abundant LVDS pairs, embedded memory, and 154 DSP blocks make it ideal for video-format conversion (RGB to LVDS, MIPI-CSI to BT.656, HDMI bridging) and color-space conversion. Designers use M9K memory blocks as line buffers for scaling engines, and the 18x18 multipliers execute FIR filters for chroma resampling at 1080p60 throughput. The 484-FBGA package provides enough I/O to drive dual-channel LVDS displays alongside parallel camera inputs, and the 4 PLLs generate independent pixel clocks for input and output sides. This application commonly appears in industrial HMIs, medical imaging displays, and aftermarket infotainment head units where mature silicon and long-term supply are required.
Recommended
ASIC and SoC Prototyping
Engineers prototyping ASICs and SoCs frequently choose the EP4CE55F23A7N because it offers enough logic capacity (55,856 LEs) to map a moderately complex ASIC subsystem - a peripheral controller, a DSP engine, or a network interface block - while remaining in a low-power, cost-effective footprint. The Quartus II 13.1 toolchain supports the legacy ASIC prototyping flow with synthesis-friendly libraries and Verilog/VHDL templates. With 2.4 Mbits of block RAM, designers can emulate embedded SRAM and FIFO structures, and the 154 hardware multipliers accelerate DSP-heavy blocks. Migration to production ASIC or to Cyclone V/10 LP is straightforward because the same HDL source synthesizes across nodes.
Recommended
Communications Line-Card Glue Logic
In telecom line cards, the EP4CE55F23A7N is frequently deployed as glue logic between network processors, PHY devices, and backplane SERDES - performing protocol bridging, traffic shaping, and time-stamping. The Cyclone IV E device supports SSTL/HSTL I/O standards required by DDR2/DDR3 memories used for packet buffering, and the 4 PLLs generate multiple synchronized clocks for Ethernet MAC interfaces. With 324 user I/Os, designers can fan out to multiple front-panel ports and backplane connectors without external bus-expanders. The device's deterministic timing closure at -7 speed grade meets the latency budgets of 1G/10G line-card glue applications.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments - logic analyzers, protocol exercisers, data-acquisition front-ends - frequently use the EP4CE55F23A7N as a high-speed capture and pattern-generation engine. The 18x18 multipliers implement real-time DSP filters (FIR/IIR) on incoming sample streams, while M9K blocks serve as deep sample FIFOs and trigger-history buffers. The 324 user I/Os expose multiple LVDS capture channels and pattern-generator outputs, and the 4 PLLs provide low-jitter clock generation for ADC/DAC sampling. Industrial/automotive temperature grade (A7) allows the same board design to be deployed in laboratory, factory-floor, and in-vehicle test applications, with the AEC-Q100 pedigree reassuring customers in regulated industries.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F23A7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23C7N | EP4CE55F23I7N | EP4CE55F23A8N | EP4CE55F23C8N | EP4CE55F23I8N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23, 23x23 mm) | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same | 484-FBGA (F23, 23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits |
| DSP Multipliers (18x18) | 154 | 154 | 154 | 154 | 154 | 154 |
| Max User I/O | 324 | 324 | 324 | 324 | 324 | 324 |
| Speed Grade | -7 | -7 | -7 | -8 (slower) | -8 (slower) | -8 (slower) |
| Temperature Grade | Automotive A7 (-40C to +125C) | Commercial C7 (0C to +85C) | Industrial I7 (-40C to +100C) | Automotive A7 (-40C to +125C) | Commercial C8 (0C to +85C) | Industrial I8 (-40C to +100C) |
| AEC-Q100 | Qualified | Not qualified | Not qualified | Qualified | Not qualified | Not qualified |
Key Differentiators
- AEC-Q100 qualified at the 55K-LE density tier (vs EP4CE55F23C7N)
- Faster -7 speed grade for timing-critical pipelines (vs EP4CE55F23A8N)
- Wide industrial/automotive temperature range vs commercial-only grade (vs EP4CE55F23C8N)
Design Notes
Power-on sequencing for the EP4CE55F23A7N requires VCCINT (1.2 V core) and VCCPD (3.3 V) to ramp before or simultaneously with VCCA (2.5 V PLL supply) and VCCIO (bank I/O). A monotonic ramp with rise time between 200 microseconds and 100 ms is required for proper POR. Use a supervisor IC (e.g., TPS3808-style reset) to hold nCONFIG low until all rails are stable, otherwise the device may latch up or enter an undefined configuration state. Estimate: based on -7 speed grade and 55,856 LEs at typical 30-40% utilization, VCCINT current peaks at 1-1.5 A during configuration and 0.6-0.9 A in steady state.
The 484-FBGA (F23) package has a typical theta_JA of around 12-15 C/W on a JEDEC 4-layer test board with adequate thermal vias. For continuous high-utilization workloads, ensure at least 4 thermal vias under the central die area and an unbroken inner ground plane to spread heat. In enclosed industrial enclosures, derate the ambient temperature by 10-15 C from the worst-case specification to maintain the junction below 125 C. Estimate: at 1.5 W total dissipation on a 15 C/W board, the junction rises 22.5 C above ambient - well within the A7 grade envelope.
Route all differential pairs (LVDS, DDR) with 100 ohm differential impedance and length matching within 20 mil. The F23 484-FBGA uses a 1.0 mm ball pitch; use 0.6 mm drill micro-vias on the BGA breakout and stack at least 4 layers for signal/power integrity. Decoupling: place one 0.1 uF X7R 0402 capacitor per VCCINT/VCCIO/VCCPD pin within 100 mil, plus bulk 47 uF tantalum or 22 uF ceramic on each rail within 0.5 inch of the package. Follow Intel's Cyclone IV E hardware design guide for fan-out and stack-up recommendations.
Do not assume that a 'Cyclone IV E' design will compile unchanged on a newer Quartus Prime release - Intel ended Cyclone IV E support at Quartus II 13.1. Lock the tool version (Quartus II 13.0sp1 or 13.1) in CI to avoid surprise regressions. Verify the nCE, nCONFIG, and MSEL pin strapping matches the intended configuration mode (AS, AP, PS, or JTAG) - incorrect MSEL values cause silent configuration failures. Avoid the -I8 temperature grade in automotive designs; the A7 grade is the AEC-Q100 qualified option.
Compliance Information
AEC-Q100 qualified per the verified product listing on Arrow. RoHS compliant per the manufacturer datasheet family-level certification. Halogen-free status is not explicitly stated in the verified data and is marked unknown.
