Intel

EP4CE40F23C6N - Cyclone IV E FPGA 39.6K LE 484-FBGA | Intel

MPN: EP4CE40F23C6N βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 484-ball FBGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch) Package 6 Speed 1,161,216 (1134 Kbit) Memory
From $76.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $120.78 $120.78
10 $110.5 $1,105.00
100 $98.2 $9,820.00
500 $86.4 $43,200.00
1,000 $76.8 $76,800.00
ℹ️ All prices are in USD

EP4CE40F23C6N Overview

The Intel (Altera) EP4CE40F23C6N is a low-power, high-volume Cyclone IV E Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA-484) package. It integrates 39,600 logic elements, 2,475 logic array blocks (LABs/CLBs), 1,161,216 bits of embedded SRAM (1134 Kbit), 116 embedded multipliers (18x18), and 328 maximum user I/O pins, fabricated on a 60 nm low-power process and powered from a 1.2 V core supply with multi-voltage I/O support.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and dedicated hardware such as block RAM, DSP/multiplier blocks, and PLL clock managers. FPGAs sit in the broader digital logic hierarchy between ASICs and CPLDs, offering higher logic density than CPLDs while preserving in-system reprogrammability. Cyclone IV E specifically targets cost- and power-sensitive high-volume applications, with the E variant optimized for general-purpose logic rather than transceivers.

Key features include 4 PLLs, 20 global clock networks, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and a configurable JTAG-based configuration interface that supports Active Serial (AS), Passive Serial (PS), and JTAG modes. The device provides user flash up to 8 Mbit depending on family variant and supports industrial temperature grades.

The Cyclone IV E architecture uses a Lab-based logic fabric with 16 logic elements per LAB, dedicated carry chains for fast arithmetic, and block RAM columns interspersed across the fabric to minimize routing delay. Multipliers are arranged in columns adjacent to block RAM, enabling efficient DSP pipelines. The 60 nm process keeps static and dynamic power low enough for fanless industrial designs.

Typical applications include industrial motor control and drives, video processing and image filtering, automotive infotainment prototyping, communication protocol bridging, factory automation controllers, and portable test & measurement instruments. Designers choose Cyclone IV E when they need a mid-density FPGA with low power, broad Quartus Prime tool support, and a mature supply chain.

When designing, observe the multi-rail decoupling scheme (1.2 V VCCINT, 2.5/3.3 V VCCA, VCCIO banks), use the dedicated PLL reference clock inputs for jitter-critical paths, and budget for FBGA-484 PCB fabrication with microvia or 1.0 mm pitch fan-out. Always validate pin assignments against the Quartus Prime pin planner before committing to layout.

This page consolidates distributor pricing, validated drop-in alternatives, and practical PCB design guidance beyond what the manufacturer datasheet alone provides.

Drop-in alternatives for EP4CE40F23C6N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE40F23C6N (same form factor and footprint) β€” differing in Package, Speed Grade, Configuration Modes, Process Technology, RoHS Status.

Altera
Package: 324-ball FineLine BGA (F19) 19x19 mm
Configuration Modes: AS, PS, JTAG, FPP
RoHS Status: Compliant (per distributor listings)
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch
Speed Grade: A7
Configuration Modes: AS, PS, FPP, JTAG
Compare with EP4CE40F23C6N β†’
Intel
Package: FBGA-484 (23 x 23 mm, 1.0 mm pitch)
Speed Grade: C6 (commercial, mid-tier)
Process Technology: 60 nm low-power
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-ball FBGA (F23)
Process Technology: 60 nm low-power
RoHS Status: Compliant (lead-free FBGA)
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-ball FineLine BGA (FBGA)
Speed Grade: C7
Process Technology: 60 nm low-power CMOS
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-ball FBGA (F23)
Configuration Modes: AS, PS, FPP, JTAG
RoHS Status: Compliant
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-pin FBGA (F23), 1.0 mm ball pitch, 23x23 mm
Speed Grade: 8 (industrial low-power process, 8-stage logic)
Process Technology: 60 nm (TSMC low-power)
Compare with EP4CE40F23C6N β†’
Intel
Configuration Modes: AS, PS, JTAG
Process Technology: 60 nm low-power CMOS
RoHS Status: Compliant
Compare with EP4CE40F23C6N β†’
Altera
Package: 484-ball FBGA (F23)
Speed Grade: C8 (commercial)
Configuration Modes: JTAG, Active Serial, Passive Serial
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-ball FBGA (F23), 23x23 mm, 1.0 mm pitch
Speed Grade: C9 (commercial, slowest grade)
Process Technology: 60 nm low-power CMOS
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-pin FBGA (F23, 23x23 mm, 1.0 mm pitch)
Speed Grade: I7
Configuration Modes: Active Serial (AS), Passive Serial (PS), JTAG
Compare with EP4CE40F23C6N β†’
Intel
Package: 484-FBGA (F23, 23 mm)
Configuration Modes: JTAG, AS, PS, FPP
Compare with EP4CE40F23C6N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE40F23C8N

βœ… Drop-In
Intel
πŸ“¦ FBGA-484
Cyclone IV E Β· 39,600 Β· 2475 LAB Β· 1134 Kbit Β· 66 Β· 4 Β· 328 Β· 200 MHz

βœ“ In Stock

$52.95 / Unit

View Datasheet β†’

EP4CE40F23C7N

βœ… Drop-In
Intel
πŸ“¦ FBGA-484
Cyclone IV E Β· 39,600 Β· 1,161,216 bits Β· 116 Β· 328 Β· 4 Β· 66.5 Β· 60 nm low-power CMOS

βœ“ In Stock

$21.8 / Unit

View Datasheet β†’

EP4CE40F23I7N

βœ… Drop-In
Intel
πŸ“¦ FBGA-484
Cyclone IV E Β· 39,600 Β· 1,161,216 bits Β· 116 Β· 328 Β· 4 Β· 472 MHz Β· 484-pin FBGA (F23, 23x23 mm, 1.0 mm pitch)

βœ“ In Stock

$52.75 / Unit

View Datasheet β†’

EP4CE40F23A7N

βœ… Drop-In
Intel
πŸ“¦ FBGA-484
Cyclone IV E Β· 39,600 Β· 1,161,216 (1161 Kb) Β· M9K (9 Kbit) Β· 328 Β· 4 Β· 20

βœ“ In Stock

$118.4 / Unit

View Datasheet β†’

EP4CE30F23C6N

βœ… Drop-In
πŸ“¦ FBGA-484
same FBGA-484 pinout, lower density 30,816 LE vs 39,600 LE (-22% logic); otherwise pin-compatible

πŸ“‹ Reference alternative (not in catalog)

EP4CE40F19A7N

βœ… Drop-In
Altera
πŸ“¦ FBGA-484
Cyclone IV E Β· 39,600 Β· 113,560 (cyclone IV E equivalent for LE count) Β· 1,161,216 Β· 244 x M9K (32,256 bits each) + 1 x MLAB Β· 116 Β· 193 Β· 4

βœ“ In Stock

$298.75 / Unit

View Datasheet β†’

EP4CE40F23C6N Maximum Ratings & Electrical Characteristics

Series Cyclone IV E
Family Cyclone IV E (low-cost, low-power FPGA)
Logic Elements (LE) 39,600
Logic Array Blocks / CLBs 2,475
Embedded Memory (bits) 1,161,216 (1134 Kbit)
Embedded 18x18 Multipliers 116
PLLs 4
Maximum User I/O 328
Core Voltage (VCCINT) 1.2 V
Process Technology 60 nm
Package 484-ball FBGA (FBGA-484, 23 x 23 mm, 1.0 mm pitch)
Mounting Type Surface Mount (BGA)
Lead-Free / RoHS Lead free, RoHS compliant
Speed Grade 6

EP4CE40F23C6N 484-ball fbga (fbga-484, 23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide

Pin configuration for EP4CE40F23C6N (484-ball fbga (fbga-484, 23 x 23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fbga (fbga-484, 23 x 23 mm, 1.0 mm pitch) package pinout diagram for EP4CE40F23C6N

No detailed pinout data available for EP4CE40F23C6N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE40F23C6N is suitable for 6 applications: Industrial Motor Control, Video Processing & Image Filtering, Factory Automation Controllers, Automotive Infotainment Prototyping, Communications Protocol Bridging, Portable Test & Measurement Instruments.

🏭

Industrial Motor Control

The EP4CE40F23C6N fits industrial motor-control designs because its 116 embedded 18x18 multipliers and 4 PLLs handle field-oriented control (FOC) and space-vector PWM without external DSP parts. The 39,600 LE fabric absorbs the encoder-interface, current-loop, and protection logic while leaving headroom for EtherCAT or CANopen protocol stacks. With 328 user I/Os, multiple PWM channels for three-phase inverters, encoder feedback, and gate-driver control signals can be routed without muxing. The 1.2 V core keeps power dissipation low enough for fanless IP65 enclosures, while the FBGA-484 (23x23 mm) footprint suits compact driver boards mounted next to the inverter stage.

πŸ“Ί

Video Processing & Image Filtering

The EP4CE40F23C6N's 1134 Kbit block RAM and 116 multipliers enable real-time 1080p video pipelines including color-space conversion, edge detection, and noise filtering. Its parallel fabric outperforms microcontrollers at pixel-rate processing while staying under 1.5 W core power. Designers typically use DDR2 SDRAM for frame buffering, with the FPGA's external memory interface IP supporting DDR2-400 at 200 MHz. The 4 PLLs provide independent pixel-clock, memory-clock, and processing-clock domains so the design avoids metastability across clock crossings in camera or display pipelines.

🏭

Factory Automation Controllers

For PLC-style factory controllers, the EP4CE40F23C6N provides ample logic for IEC 61131-3 soft-PLC cores plus deterministic EtherCAT or PROFINET slave implementations. Its 39,600 LE fabric runs both the protocol stack and the application logic on a single chip, eliminating an external CPU for simpler installations. With 4 PLLs and 20 global clocks, multiple industrial Ethernet PHYs can be clocked independently, while the 328 user I/Os accommodate dozens of opto-isolated digital inputs and relay-driver outputs. The commercial-grade C6N variant is suitable for control-cabinet environments; industrial users should select the I7N variant.

πŸš—

Automotive Infotainment Prototyping

The EP4CE40F23C6N serves as a flexible platform for prototyping automotive infotainment, instrument cluster, and ADAS pre-processing designs before committing to ASIC or MCU production silicon. The 39,600 LE fabric supports LVDS-based display interfaces, MOST or Ethernet AVB bridging, and multi-camera input aggregation. Designers benefit from Quartus Prime's Qsys system-integration tool to compose Nios II soft-core processors with hardware accelerators. For harsh under-hood or cabin environments, the EP4CE40F23A7N automotive-grade variant drops into the same FBGA-484 footprint, providing an upgrade path from lab prototype to AEC-Q100 qualified production.

🌐

Communications Protocol Bridging

The EP4CE40F23C6N is widely used to bridge legacy industrial protocols (RS-485 Modbus, CAN, SPI peripherals) to modern Ethernet backbones without an external processor. Its 39,600 LE fabric and 116 multipliers can implement multiple UARTs, SPI, I2C, and CAN controllers in parallel, plus CRC-32 and HDLC engines for protocol integrity. With 4 PLLs it derives independent baud-rate clocks for each port, and the 328 user I/Os support 30+ serial channels in a single chip. The Cyclone IV E's low static power keeps idle bridges well under 1 W, important for always-on industrial gateways.

πŸ”§

Portable Test & Measurement Instruments

The EP4CE40F23C6N powers handheld oscilloscopes, logic analyzers, and protocol testers by combining DSP, display driving, and user-interface processing on one device. Its 116 multipliers implement FIR/IIR filters and FFT engines for signal analysis, while 1134 Kbit of block RAM buffers acquisition windows. The 1.2 V core and power-gated I/O banks let the design enter sub-100 mA sleep modes between captures, extending battery life in field-portable equipment. With 4 PLLs the design supports independent ADC sampling clocks and TFT/LCD pixel clocks, simplifying board layout for compact handhelds.

What is the logic element count of the EP4CE40F23C6N?
The EP4CE40F23C6N contains 39,600 logic elements organized into 2,475 logic array blocks (LABs). This places it in the mid-density tier of the Cyclone IV E family, well suited for video processing, motor control, and protocol-bridging designs. According to the manufacturer datasheet, the EP4CE40 also provides 116 embedded 18x18 multipliers and 1134 Kbit of embedded SRAM.
What package does the EP4CE40F23C6N use?
The EP4CE40F23C6N ships in a 484-ball FineLine BGA package (FBGA-484) measuring 23 x 23 mm with a 1.0 mm ball pitch. The F23 suffix indicates the F23 pin/package family. This package supports up to 328 user I/O pins and is lead-free / RoHS compliant. Engineers planning layout must use microvia-compatible PCB stack-ups because of the 1.0 mm pitch BGA.
Where can I download the EP4CE40F23C6N datasheet PDF?
The official EP4CE40F23C6N datasheet is available on the Intel Altera product page at https://www.altera.com/products/fpga/cyclone/iv/e/ep4ce40-f23/EP4CE40F23C6N, which links to the Cyclone IV E Device Handbook covering the EP4CE40 family. Distributors such as DigiKey and Mouser also host datasheet PDFs on the EP4CE40F23C6N product pages. The Intel/Altera Quartus Prime software includes the same device documentation.
What is the price of EP4CE40F23C6N and where to buy it in stock?
As of 2026-09-10, the EP4CE40F23C6N is listed at approximately $120.78 at LCSC and comparable pricing across DigiKey, Mouser, and Octopart distributors. Volume pricing drops to roughly $76-86 per unit at 500-1000 piece quantities. Stock is generally available from authorized distributors including DigiKey (2288395) and Mouser; lead time for industrial-grade variants is typically 8-12 weeks when out of stock.
What is the difference between EP4CE40F23C6N and EP4CE40F23C7N?
The EP4CE40F23C6N has speed grade 6, while the EP4CE40F23C7N has the faster speed grade 7, meaning the C7N variant meets more aggressive timing closure targets across the same 39,600 LE fabric. Both share the FBGA-484 (F23) package, 1.2 V core, and identical pinout. Choose C7N when your design fails timing at C6 speed grade; otherwise C6N is the cost-optimized option.
What is the difference between EP4CE40F23C6N and EP4CE40F23I7N?
The EP4CE40F23C6N is the commercial-temperature variant (0C to +85C) at speed grade 6, while the EP4CE40F23I7N is the industrial-temperature variant (-40C to +100C) at speed grade 7. Both share the FBGA-484 package and 39,600 LE fabric. Choose the I7N variant for industrial or harsh-environment applications; choose the C6N for cost-sensitive commercial products.
Is EP4CE40F23C6N the same as EP4CE40F23C6?
Yes - the EP4CE40F23C6N and EP4CE40F23C6 are functionally identical Cyclone IV E FPGAs in the FBGA-484 package with 39,600 logic elements. The trailing N in EP4CE40F23C6N denotes lead-free / RoHS compliance per JEDEC J-STD-020 lead-free reflow standards. The base EP4CE40F23C6 may be supplied in non-RoHS form for legacy assemblies; RoHS-compliant new designs should specify the N suffix.
What is the best drop-in replacement for EP4CE40F23C6N?
The closest drop-in replacement for EP4CE40F23C6N within the same Cyclone IV E family is the EP4CE40F23C8N (speed grade 8, otherwise identical FBGA-484 pinout). For higher performance, the EP4CE40F23C7N provides faster speed grade 7. For industrial temperature, the EP4CE40F23I7N is the closest drop-in variant. All share the same FBGA-484 footprint and pinout so they require no PCB rework.
Which Intel FPGA is equivalent to EP4CE40F23C6N at lower cost?
Within the same Cyclone IV E family the EP4CE30F23C6N (30,816 LE) and EP4CE22F23C6N (22,320 LE) are direct step-downs sharing the FBGA-484 F23 pinout, enabling ~20-30% cost savings when logic density permits. For a true drop-in alternative in the same density tier, the EP4CE40F23C8N is the only same-package option at the exact 39,600 LE count. Lattice ECP5 and Xilinx Spartan-6 cross-brand alternatives also exist but require PCB redesign.
How many transceivers does EP4CE40F23C6N have?
The EP4CE40F23C6N Cyclone IV E FPGA has zero high-speed serial transceivers. The Cyclone IV E family targets cost-sensitive applications with parallel I/O and external memory interfaces such as DDR/DDR2/QDRII SDRAM. For transceiver-equipped Cyclone variants, designers should evaluate Cyclone IV GX instead, which adds 2.5 Gbps transceivers but at higher cost and power.
What is the operating temperature of EP4CE40F23C6N?
The C suffix in EP4CE40F23C6N designates the commercial temperature grade, typically 0C to +85C junction. For industrial applications (-40C to +100C or -40C to +125C), designers should specify the EP4CE40F23I7N variant instead. The C6N variant is intended for office, lab, and benign-environment equipment where thermal stress is limited.
How do I program EP4CE40F23C6N?
The EP4CE40F23C6N supports four configuration modes per Cyclone IV E datasheet: Active Serial (AS) using EPCS configuration devices, Passive Serial (PS) with an external host, Fast Passive Parallel (FPP), and JTAG. Quartus Prime software generates the .pof or .sof bitstream and supports USB-Blaster, ByteBlaster II, and EthernetBlaster download cables. For production, AS mode with EPCS16 or EPCS64 is most common.
What is the core voltage and I/O bank voltage of EP4CE40F23C6N?
According to the Cyclone IV E datasheet, the EP4CE40F23C6N requires 1.2 V on VCCINT for the core logic and 2.5 V on VCCA for PLL analog supply. VCCIO is programmable per bank to 1.2/1.5/1.8/2.5/3.3 V for mixed-voltage I/O interfacing. Power-on sequencing requires VCCINT to ramp before VCCA, and all rails should be stable within 100 ms of configuration start.
Can Lattice ECP5 replace EP4CE40F23C6N drop-in?
No - the Lattice ECP5 (LFE5U-45F or similar) is not a drop-in replacement for the EP4CE40F23C6N because the FBGA-484 pinout, ball map, and bank voltages differ. It is a functional alternative with similar 45K LUT density, but it requires PCB redesign and migration of the Quartus Prime bitstream to Lattice Diamond or Lattice Radiant. Treat it as a redesign-level substitute, not a drop-in.
What is the embedded memory bandwidth of EP4CE40F23C6N?
The EP4CE40F23C6N integrates 1,161,216 bits (1134 Kbit) of embedded SRAM organized as M9K blocks of 9 Kbit each per the Cyclone IV E datasheet. This delivers approximately 250 MHz block RAM throughput and supports true dual-port, simple dual-port, and single-port RAM modes, plus FIFO and shift register inference. For higher-bandwidth designs, an external DDR/DDR2/QDRII memory interface can be added via the soft memory controller IP.

Engineering reference data for EP4CE40F23C6N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE40F23C6N when your Cyclone IV E design fits within 39,600 logic elements, runs in commercial temperature environments, and meets timing at speed grade 6. Pick the EP4CE40F23C7N if the timing analyzer fails to close at C6 and you need ~10% more timing margin without changing the PCB. Choose the EP4CE40F23C8N only when the design is well under-utilized and you want the lowest-cost option; this is rarely optimal because C8 is significantly slower. Move to the EP4CE40F23I7N for industrial temperature grade. Select the EP4CE40F23A7N for automotive-grade designs requiring AEC-Q100. Finally, the EP4CE30F23C6N is the right pin-compatible step-down if 30,816 LE suffice - yielding ~20% cost savings at the cost of less logic headroom.

Comparison with Alternatives

Parameter This Product EP4CE40F23C8N EP4CE40F23C7N EP4CE40F23I7N EP4CE40F23A7N EP4CE30F23C6N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package FBGA-484 (F23, 23x23 mm) FBGA-484 (F23, 23x23 mm) - same FBGA-484 (F23, 23x23 mm) - same FBGA-484 (F23, 23x23 mm) - same FBGA-484 (F23, 23x23 mm) - same FBGA-484 (F23, 23x23 mm) - same
Logic Elements 39,600 39,600 39,600 39,600 39,600 30,816
Speed Grade 6 8 (slower) 7 (faster) 7 7 6
Temperature Grade Commercial (0C to +85C) Commercial Commercial Industrial (-40C to +100C) Automotive Commercial
Embedded Memory (Kbit) 1134 1134 1134 1134 1134 594
Embedded 18x18 Multipliers 116 116 116 116 116 66
Maximum User I/O 328 328 328 328 328 328
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V

Key Differentiators

  • 39,600 LE mid-density with 116 multipliers - high DSP density per LE (vs EP4CE30F23C6N)
  • Speed grade 6 offers the best cost/timing balance in Cyclone IV E (vs EP4CE40F23C7N)
  • Commercial temperature grade optimized for cost-sensitive high-volume products (vs EP4CE40F23I7N)

Design Notes

The EP4CE40F23C6N's FBGA-484 (F23) package uses a 1.0 mm ball pitch, which requires microvia (laser-drilled or stacked-via) PCB technology for the inner signal layers. Per the Cyclone IV E Device Handbook, escape routing must use dog-bone fan-out or via-in-pad for full BGA breakout; standard 8 mil/12 mil through-via designs will fail to break out all 484 balls. Stack-up should target 4-6 inner layers with 1 oz copper and ENIG finish for reliable BGA reflow.

Decouple the EP4CE40F23C6N with one 100 uF bulk + ten 10 uF ceramic + ten 0.1 uF ceramic + ten 1 nF ceramic per VCCINT, VCCA, and VCCIO bank, placed within 5 mm of the corresponding balls. Power-on sequencing per the manufacturer datasheet requires VCCINT (1.2 V) to ramp first, followed by VCCA (2.5 V), then VCCIO banks. Failing to observe this sequence can latch up the POR circuit and prevent configuration. Use a supervisor such as the MAX811 or equivalent to enforce the sequence.

Do not confuse the EP4CE40F23C6N with the EP4CE40F29C6N - the F29 suffix indicates a different pinout/package set (likely 780-ball FBGA). Also avoid assuming 'Cyclone IV' implies transceivers; the E variant has none, and designs needing >1 Gbps serial must move to Cyclone IV GX or Cyclone V GX. Finally, validate that the configuration scheme (AS/PS/FPP/JTAG) matches the chosen EPCS device size - EPCS16 is sufficient for most C6N bitstreams but EPCS64 is needed if user logic exceeds 25K LE.

Assign differential pairs (LVDS) to dedicated LVDS-capable I/O banks and route them with 100 ohm differential impedance and matched length within 50 mil. Per the Cyclone IV E datasheet, the PLL reference clock inputs (CLK[0..3]) should be routed with controlled impedance and isolated from switching signals; surround them with a GND guard ring to minimize jitter. Keep PLL analog supply VCCA quiet by filtering with a ferrite bead and 10 uF + 100 nF decoupling network.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

Lead-free and RoHS compliant per JEDEC J-STD-020 (N suffix). Not AEC-Q100 qualified; choose EP4CE40F23A7N for automotive. REACH compliance inferred from RoHS-compliant lead-free finish.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP4CE40F23C6N EP4CE40F23C7N EP4CE40F23C8N EP4CE40F23I7N EP4CE40F23A7N EP4CE30F23C6N Cyclone IV E FPGA Field-Programmable Gate Array FBGA-484 BGA package FineLine BGA logic element logic array block LAB M9K block RAM embedded SRAM 18x18 multiplier DSP block PLL phase-locked loop Quartus Prime EPCS configuration device JTAG Active Serial configuration DDR2 SDRAM controller LVDS RoHS JEDEC J-STD-020 AEC-Q100 industrial temperature grade commercial temperature grade 60 nm process node 1.2 V core voltage VCCINT VCCA VCCIO Cyclone IV GX
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