Intel

EP4CE55F23C7 - Cyclone IV E FPGA, 55K LE, FBGA-484 | Intel / Altera

MPN: EP4CE55F23C7 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss FBGA-484 (23 x 23 mm, 1.0 mm pitch) Package 472.5 MHz Speed 2,396,160 bits Memory
From $142 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $215 $215.00
10 $195 $1,950.00
100 $175 $17,500.00
500 $158 $79,000.00
1,000 $142 $142,000.00
ℹ️ All prices are in USD

EP4CE55F23C7 Overview

The Intel / Altera EP4CE55F23C7 is a Cyclone IV E family FPGA delivering 55,856 logic elements, 3,491 logic array blocks (LABs), and 2,396,160 bits of embedded memory in a 484-ball FineLine BGA (FBGA-484) package. Built on a 60nm low-power process, it operates from a 1.2V core supply with LVCMOS/LVDS/LVPECL I/O support and 324 user I/O pins.

A field-programmable gate array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program to implement arbitrary digital circuits. FPGAs sit between fixed-function ASICs (high NRE, low unit cost at volume) and microcontrollers (fixed ISA, sequential execution), offering hardware-level parallelism and nanosecond-level latency for DSP, glue logic, and high-speed interface bridging. Cyclone IV E is Altera's (now Intel FPGA) low-cost, low-power family targeting volume production in industrial, automotive, communications, and consumer designs.

Key features of the EP4CE55F23C7 include up to 472.5 MHz internal operation, 4 transceivers (none on this E variant), 156 embedded 18x18 multipliers, and 4 PLLs for clock management. The 60nm process achieves low static and dynamic power versus prior Cyclone generations, while the FBGA-484 package provides 1.0 mm ball pitch for moderate-density PCB assembly. Configuration options include JTAG, passive serial, active serial, and fast passive parallel modes.

The Cyclone IV E architecture integrates embedded memory blocks (M9K) and DSP blocks alongside general-purpose logic, enabling single-chip implementation of video pipelines, motor control, industrial protocols, and custom bus bridges. Hard intellectual property such as PCI Express soft cores and DDR/DDR2 SDRAM controllers is available via Altera / Intel Quartus IP libraries, simplifying system integration versus older glue-logic designs.

Typical applications include industrial motor drives and PLCs, video surveillance image processing, factory automation controllers, software-defined radio baseband, medical imaging front-ends, and LED video walls. The wide logic capacity supports multi-protocol bridging (EtherCAT, PROFINET, CAN, RS-485) combined with on-chip DSP for sensor fusion.

When designing with this FPGA, plan power sequencing for the 1.2V core, 2.5V/3.3V I/O banks, and PLL analog supplies separately, and verify signal-integrity on DDR/DDR2 interfaces with matched-length routing. Quartus Prime software (Lite/Standard/Pro editions) is required for synthesis, place-and-route, and bitstream generation.

This page synthesizes distributor pricing, drop-in and same-footprint Cyclone IV E alternatives, and practical design notes not collected on a single manufacturer datasheet page.

Drop-in alternatives for EP4CE55F23C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE55F23C7 (same form factor and footprint) — differing in Package, Speed Grade, Embedded 18x18 Multipliers, Configuration Modes, Process Technology.

Intel
Package: 484-ball FBGA (F23)
Process Technology: 60 nm low-power
Compare with EP4CE55F23C7 →
Intel
Package: 484-ball FineLine BGA (FBGA)
Embedded 18x18 Multipliers: 116
Process Technology: 60 nm low-power CMOS
Compare with EP4CE55F23C7 →
Intel
Package: 484-ball FBGA (F23, 23x23 mm)
Speed Grade: -7
Configuration Modes: JTAG, AS, AP, PS
Compare with EP4CE55F23C7 →
Intel
Package: 484-FBGA (F23)
Speed Grade: 6 (commercial)
Embedded 18x18 Multipliers: 343
Compare with EP4CE55F23C7 →
Intel
Package: 484-FBGA (F23, 23 mm)
Speed Grade: 6
Configuration Modes: JTAG, AS, PS, FPP
Compare with EP4CE55F23C7 →
Intel
Package: 484-FBGA (F23) 23 x 23 mm, 1.0 mm pitch
Embedded 18x18 Multipliers: 66
Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS)
Compare with EP4CE55F23C7 →
Altera
Package: 484-ball FineLine BGA (FBGA)
Speed Grade: C8
Embedded 18x18 Multipliers: 154
Compare with EP4CE55F23C7 →
Intel
Package: 484-FBGA
Speed Grade: C8
Compare with EP4CE55F23C7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CE55F23C6N

✅ Drop-In
Intel
📦 FBGA-484
Cyclone IV E · FPGA (Field Programmable Gate Array) · 55,856 · 2,396,160 bits · 156 (18x18) · 4 · 324

✓ In Stock

$54.92 / Unit

View Datasheet →

EP4CE55F23A7N

✅ Drop-In
Intel
📦 FBGA-484
Cyclone IV E · EP4CE55 · 55,856 · 2,436 · 2,396,160 · 234 (M9K) · 154 · 4

✓ In Stock

$134.4 / Unit

View Datasheet →

EP4CE55F23I7

✅ Drop-In
Intel
📦 FBGA-484
Field Programmable Gate Array (FPGA) · Cyclone IV E · 55,856 cells · 3,491 CLBs · 324 I/O · 2,396,160 bits · 472.5 MHz · 60 nm

✓ In Stock

Contact for price

View Datasheet →

EP4CE55F23C6

✅ Drop-In
Intel
📦 FBGA-484
Cyclone IV E · 55,856 · 3,491 · 2,396,160 bits · 324 · 343 · 4 · 8

✓ In Stock

$36.75 / Unit

View Datasheet →

EP4CE40F23C7N

✅ Drop-In
Intel
📦 FBGA-484
Cyclone IV E · 39,600 · 1,161,216 bits · 116 · 328 · 4 · 66.5 · 60 nm low-power CMOS

✓ In Stock

$21.8 / Unit

View Datasheet →

EP4CE40F23C7

✅ Drop-In
Intel
📦 FBGA-484
Cyclone IV E · EP4CE40 · 39,600 · 2,475 · 1,161,216 bits · 66 · 4 · 20

✓ In Stock

$102 / Unit

View Datasheet →

EP4CE55F23C7 Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LE) 55,856
Logic Array Blocks (LABs) 3,491
Embedded Memory 2,396,160 bits
Embedded 18x18 Multipliers 156
PLLs 4
Maximum User I/O 324
Operating Frequency (max) 472.5 MHz
Process Technology 60 nm
Core Supply Voltage 1.2 V
Package FBGA-484 (23 x 23 mm, 1.0 mm pitch)
Mounting Type Surface Mount
Operating Temperature 0C to +85C (commercial)
Speed Grade C7
Configuration Modes JTAG, Passive Serial, Active Serial, Fast Passive Parallel
RoHS Status Compliant

EP4CE55F23C7 fbga-484 (23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide

Pin configuration for EP4CE55F23C7 (fbga-484 (23 x 23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

fbga-484 (23 x 23 mm, 1.0 mm pitch) package pinout diagram for EP4CE55F23C7

No detailed pinout data available for EP4CE55F23C7.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE55F23C7 is suitable for 6 applications: Industrial Motor Drive Control, Video Surveillance Image Processing, Factory Automation Controller, Software-Defined Radio Baseband, Medical Imaging Front-End, LED Video Wall Display Controller.

🏭

Industrial Motor Drive Control

The EP4CE55F23C7 fits industrial motor drive control because its 55,856 logic elements and 156 embedded 18x18 multipliers handle field-oriented control (FOC) math for 3-phase PMSM and induction drives at switching frequencies up to 50 kHz. The 324 user I/Os in the FBGA-484 package connect directly to multi-axis gate drivers, encoder interfaces (QEP, SSI, EnDat), and CAN/RS-485 industrial networks without external logic. On-chip PLLs generate precise switching clocks from a single crystal reference, while 2.4 Mbit embedded memory buffers ADC samples and PWM duty cycles for current/voltage loops. Designers can implement sensorless or sensored FOC, integrated braking, and STO safety functions in a single device, replacing legacy DSP + CPLD two-chip solutions.

🎥

Video Surveillance Image Processing

The EP4CE55F23C7 is well suited to multi-channel video surveillance because its 156 hardware multipliers implement real-time motion detection, H.264 preprocessing, and noise reduction at 1080p60 pixel rates. With 324 I/Os the device can ingest several parallel camera interfaces (BT.656, MIPI CSI-2 with soft PHY, or LVDS) and drive HDMI or Ethernet outputs simultaneously, removing the need for a companion image signal processor. The 2.4 Mbit embedded memory provides line and frame buffers, while on-chip PLLs derive DDR2 controller clocks for external SDRAM. Low 1.2 V core power and 60 nm process keep thermal dissipation low enough for fanless NVR enclosures.

🏭

Factory Automation Controller

The EP4CE55F23C7 anchors a factory automation controller by hosting multiple industrial Ethernet protocols (PROFINET, EtherCAT, EtherNet/IP) concurrently on its 55,856 logic elements and 4 PLLs. Its 324 I/Os map cleanly to digital I/O modules, isolated 24 V field-bus interfaces, and analog front-ends, while the 2.4 Mbit embedded memory acts as a fast process-image buffer between deterministic network cycles and the application CPU. The device's industrial-grade variant (EP4CE55F23I7) supports -40C to +100C operation required inside sealed control cabinets. Quartus Prime IP libraries enable certified PROFINET IRT and EtherCAT slave stacks with cycle times below 250 us.

🌐

Software-Defined Radio Baseband

The EP4CE55F23C7 supports software-defined radio baseband processing because its 156 18x18 multipliers implement digital down-conversion, FIR filtering, and channelization for narrowband waveforms up to ~50 MHz bandwidth. Its 472.5 MHz internal FMAX combined with 2.4 Mbit embedded memory enables buffering of IQ sample streams between ADC front-ends and host processors, while the 324 user I/Os connect to LVDS ADC data buses and synchronization ports. Low 1.2 V core voltage and 60 nm process keep power budgets compatible with battery-powered tactical and portable SDR platforms where Cyclone IV E is widely deployed.

💊

Medical Imaging Front-End

The EP4CE55F23C7 is a strong fit for medical imaging front-ends (ultrasound beamforming, patient monitoring pre-processing) because its 55,856 logic elements and dedicated multipliers execute real-time FIR filtering and envelope detection at ultrasound sampling rates. The 324 I/Os interface directly to multi-channel A/D converters (LVDS), probe connectors, and TFT-LCD display panels, while the 2.4 Mbit embedded memory holds beamformed line buffers between acquisitions. Industrial temperature grade EP4CE55F23I7N variant supports hospital and ambulatory equipment requirements, and the low-power 1.2 V core keeps thermal dissipation minimal for handheld probe electronics.

💡

LED Video Wall Display Controller

The EP4CE55F23C7 drives large LED video walls by handling multi-panel stitching, gamma correction, and refresh-rate adaptation across hundreds of parallel data channels. Its 324 I/Os in FBGA-484 are ample for distributing pixel data to multiple HUB75 chains, while 156 hardware 18x18 multipliers accelerate color-space conversion and brightness uniformity compensation. The 2.4 Mbit embedded memory acts as a line buffer between the upstream HDMI/DVI receiver and the LED scan driver, allowing smooth 60 Hz playback even with high-resolution content. Low 1.2 V core power enables slim, fanless controller enclosures in retail and staging installations.

What is the logic capacity of EP4CE55F23C7?
The EP4CE55F23C7 contains 55,856 logic elements organized into 3,491 logic array blocks (LABs). According to the Intel Cyclone IV Device Handbook, each LAB comprises 16 logic elements and connects to a local interconnect matrix, enabling implementation of mid-complexity digital designs, including DSP pipelines and bus-bridge logic, on a single device.
How many user I/O pins does EP4CE55F23C7 provide?
The EP4CE55F23C7 in the FBGA-484 package exposes up to 324 user I/O pins across 8 I/O banks. According to the Cyclone IV Device Handbook, each bank supports independent VCCIO standards (1.2 V to 3.3 V), enabling mixed-voltage LVCMOS/LVDS/LVPECL interfaces on the same device without external level shifters.
What is the difference between EP4CE55F23C7 and EP4CE55F23C6?
The EP4CE55F23C7 is speed-grade C7, while the EP4CE55F23C6 is the slower speed-grade C6 of the same die. According to the Cyclone IV ordering information, both share the FBGA-484 package and identical logic/memory resources, but C7 supports a higher internal FMAX (~472.5 MHz vs lower), making C7 the preferred choice when timing closure is challenging.
What is the difference between EP4CE55F23C7 and EP4CE55F23I7?
The EP4CE55F23C7 is the commercial temperature grade (0C to +85C), while the EP4CE55F23I7 is the industrial grade (-40C to +100C). According to Intel / Altera datasheets, both share the same FBGA-484 footprint and silicon, so they are pin-compatible drop-in substitutes for designs that need to migrate between temperature ranges.
Where can I buy EP4CE55F23C7 online?
The EP4CE55F23C7 is currently listed by Mouser, DigiKey, Octopart-sourced distributors, Xecor, Sierra IC, and several authorized Intel FPGA distributors as of 2026-09-10. Pricing varies with quantity break; the XAIPART tier table above shows representative qty-1 to qty-1000 pricing for sourcing reference.
What is the price of EP4CE55F23C7 in 100-piece reels?
As of 2026-09-10, the EP4CE55F23C7 lists at approximately $215 USD at qty-1, dropping to about $175 USD at qty-100 and $142 USD at qty-1000 based on distributor data aggregated on Octopart. Volume pricing is highly negotiable through authorized distributors and depends on lead-time and packaging option (tray vs tape-and-reel).
What is the lead time for EP4CE55F23C7?
As of 2026-09-10, lead time for the EP4CE55F23C7 varies by distributor; in-stock parts at Mouser and DigiKey typically ship within 1-3 business days, while factory-direct orders can run 8-16 weeks depending on wafer allocation. Industrial-grade variants (EP4CE55F23I7) may have longer lead times than commercial-grade C7.
Is EP4CE55F23C7 still in production or obsolete?
The EP4CE55F23C7 is listed as active in the Intel / Altera FPGA product catalog as of 2026-09-10. Although Cyclone IV E is a mature family, it remains in volume production for industrial, communications, and consumer designs that have already qualified the silicon - it is not recommended for new designs where longer lifecycle support is required.
EP4CE55F23C7 vs EP4CE55F29C7N - which is better for industrial control?
The EP4CE55F23C7 uses the FBGA-484 package (324 user I/O), while the EP4CE55F29C7N uses the larger FBGA-780 package with more I/O and pin count. According to Cyclone IV datasheets, both share identical 55,856 LE logic capacity, so choose EP4CE55F23C7 when 324 I/O is sufficient and PCB area is constrained, and EP4CE55F29C7N when more I/O is required.
What is the best drop-in replacement for EP4CE55F23C7?
The best drop-in replacement for EP4CE55F23C7 (FBGA-484) is EP4CE55F23C6N or EP4CE55F23A7N, both of which share the FBGA-484 footprint, identical 55,856 LE logic, and Cyclone IV E silicon. The C6N variant is a slower speed grade (timing closure may fail); the A7N variant changes only the speed grade ranking for design flexibility.
Can EP4CE55F23I7N replace EP4CE55F23C7 directly?
Yes, the EP4CE55F23I7N is pin-compatible with the EP4CE55F23C7 because both use the same FBGA-484 package and identical silicon die. The only difference is the operating temperature grade - I7N supports industrial -40C to +100C, while C7 supports commercial 0C to +85C - so the I7N is a functional superset and a direct drop-in.
Hey Google, what is the difference between Cyclone IV E and Cyclone IV GX?
Cyclone IV E is the logic-only family without integrated transceivers, while Cyclone IV GX adds 3.125 Gbps transceivers and a PCIe hard IP block. The EP4CE55F23C7 belongs to the E family with zero transceivers, so it cannot directly implement multi-gigabit serial links - choose a GX variant such as EP4CGX22CF19C7N if you need transceivers.
What software is required to program EP4CE55F23C7?
The EP4CE55F23C7 is programmed using Intel Quartus Prime software, which is available in Lite (free, device-limited), Standard, and Pro editions. Quartus Prime performs synthesis, place-and-route, timing analysis, power estimation, and generates the bitstream that is loaded via JTAG, Active Serial, or Passive Serial configuration modes.
Where can I download the EP4CE55F23C7 datasheet PDF?
The official EP4CE55F23C7 datasheet is hosted in the Intel Cyclone IV Device Handbook, available at the Altera literature archive. According to Intel support pages, the handbook PDF (cyiv-51001) contains detailed electrical characteristics, package drawings, and configuration specifications for all Cyclone IV E device variants including EP4CE55F23C7.
Where to find EP4CE55F23C7 pinout and ball map?
The EP4CE55F23C7 pinout is documented in Chapter 7 of the Cyclone IV Device Handbook, which lists all 484 FBGA ball assignments, bank groupings, and dedicated configuration pins. According to Intel documentation, the pinout PDF is bundled with the device handbook download and is also accessible through the Pin Planner view in Quartus Prime.

Engineering reference data for EP4CE55F23C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CE55F23C7 when you need 55,856 logic elements with 324 user I/Os in the FBGA-484 package and your design operates in commercial 0C to +85C temperature range. Choose EP4CE55F23C6N or EP4CE55F23A7N as lower-cost drop-in alternatives when speed-grade C7 timing margin is unnecessary. Choose EP4CE55F23I7 (industrial) when -40C to +100C operation is required - it shares the identical silicon die and FBGA-484 footprint, allowing a single PCB layout to serve both commercial and industrial SKUs. Choose EP4CE40F23C7N only when logic utilization is firmly below 39,600 LE, since the smaller die lacks the headroom for design growth. None of the alternatives require PCB rework because all share the FBGA-484 ball map.

Comparison with Alternatives

Parameter This Product EP4CE55F23C6N EP4CE55F23A7N EP4CE55F23I7 EP4CE40F23C7N
Package FBGA-484 FBGA-484 - same FBGA-484 - same FBGA-484 - same FBGA-484 - same
Brand Intel (Altera) Intel Intel Intel Intel
Logic Elements 55,856 55,856 55,856 55,856 39,600 (-29%)
Embedded Memory (bits) 2,396,160 2,396,160 2,396,160 2,396,160 1,134,000 (-53%)
Embedded 18x18 Multipliers 156 156 156 156 116 (-26%)
User I/O 324 324 324 324 324
Speed Grade C7 C6 (slower) A7 C7 (industrial temp) C7 (smaller die)
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C -40C to +100C (industrial) 0C to +85C
Lifecycle Status Active Active Active Active Active

Key Differentiators

  • Highest density 55,856 LE in the Cyclone IV E F23 FBGA-484 package (vs EP4CE40F23C7N)
  • C7 speed grade provides higher FMAX than C6 or A7 alternatives (vs EP4CE55F23C6N)
  • Industrial temperature variant (EP4CE55F23I7) is a true drop-in (vs EP4CE55F23I7)

Design Notes

The EP4CE55F23C7 requires multiple supply rails - VCCINT 1.2 V for the core, VCCIO 1.2-3.3 V per I/O bank, VCCAUX 2.5 V for PLLs and configuration, and VCCPD 2.5-3.3 V for pre-drivers. Decouple each rail with 0.1 uF and 10 uF capacitors placed within 5 mm of the respective balls, and sequence VCCINT before VCCAUX/VCCIO to avoid I/O latch-up. Use a dedicated ferrite bead to isolate PLL analog supply VCCA_PLL from noisy digital VCCINT.

At full logic utilization with 100% toggle rate, the EP4CE55F23C7 dissipates approximately 1.5-2.5 W. The FBGA-484 package has a theta_JA around 15-20 C/W on a standard 4-layer JEDEC test board. For sealed industrial enclosures, attach a small copper heat spreader or thermal pad to the package top to keep junction temperature below 100C. Quartus Prime PowerPlay analyzer provides post-fit power estimates - always run it after place-and-route.

Route all FBGA-484 signals on inner layers with microvia or via-in-pad fan-out to escape the 1.0 mm pitch ball array. Match DDR/DDR2 traces within +/-25 mil and use 100-ohm differential for LVDS pairs. Provide at least 4 GND vias per square inch and stitch GND planes around the BGA perimeter to suppress SSN noise on high-speed I/O banks.

Do not leave configuration pins (nCONFIG, MSEL[3:0], nCE) floating - tie them through 10 kohm pull-ups or pull-downs per the configuration mode you select. Unused I/O banks must have their VCCIO powered (or set to tri-state with weak pull-ups) to avoid floating inputs that draw excess current. Verify JTAG chain integrity by reading the device ID before programming.

Place decoupling capacitors on the top layer directly above their respective BGA balls, using via-in-pad or short microvia fan-out. Assign clock I/O to the dedicated CLK pins near PLLs to minimize jitter and skew. Use Quartus Prime Fitter resource utilization reports to identify congestion early, and floorplan the design to keep critical paths short.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free compliance confirmed by Altera / Intel product page. Not AEC-Q100 qualified; for automotive designs select an AEC-Q100-qualified Cyclone IV or newer Cyclone V/10 device variant.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP4CE55F23C7 EP4CE55F23C6N EP4CE55F23A7N EP4CE55F23I7 EP4CE40F23C7N Cyclone IV E FPGA field programmable gate array logic element logic array block LAB M9K embedded memory DSP block 18x18 multiplier PLL LVDS LVPECL LVCMOS JTAG FBGA-484 RoHS REACH Quartus Prime industrial motor control video surveillance factory automation PROFINET EtherCAT software-defined radio medical imaging LED video wall
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