EP4CE55F23C8 - Cyclone IV E FPGA, 55K LE, 484-FBGA | Intel
MPN: EP4CE55F23C8 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $198 | $198,000.00 |
EP4CE55F23C8 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit above microcontrollers and fixed-function ASICs in the design hierarchy: unlike an MCU they execute logic in dedicated hardware rather than software, and unlike an ASIC they are re-programmable after manufacture. The Cyclone IV E family specifically targets low-power, low-cost, transceiver-free applications that still require substantial parallel processing and DSP throughput.
Key features include 55,856 logic elements, 2,340 Kbits of embedded memory arranged in M9K blocks, 154 dedicated 18x18 hardware multipliers for DSP, 4 phase-locked loops (PLLs) for clock management, and 324 maximum user I/O pins. The 1.2 V core voltage and 60 nm process enable low static power consumption, while the 484-ball FineLine BGA package exposes the full I/O count plus dedicated configuration, clock, and JTAG pins.
Architecturally, EP4CE55F23C8 uses SRAM-based configuration cells organized into Logic Array Blocks (LABs), with each LAB containing 16 logic elements. Embedded M9K memory blocks can be configured as RAM, ROM, shift registers, or FIFO buffers, while the 18x18 multipliers can be paired to form 36x36 signed multipliers. The four PLLs support clock multiplication, division, phase shifting, and zero-delay buffering, enabling complex multi-clock domain designs.
Typical applications include industrial motor control, video processing pipelines, automotive infotainment pre-production, prototyping for ASIC designs, test and measurement equipment, and embedded DSP subsystems. The combination of low unit cost, integrated memory, and hardware multipliers makes EP4CE55F23C8 well suited for parallel processing tasks that would otherwise require a DSP or microcontroller plus external logic.
When designing with this part, ensure the JTAG chain is properly terminated and that configuration is sourced from a supported mode (AS, PS, JTAG, or fast passive parallel). The 484-FBGA package requires careful PCB layout with controlled-impedance traces for high-speed differential pairs, and thermal management must account for the device's worst-case power dissipation under sustained switching activity.
This page synthesizes distributor pricing, drop-in equivalents within the Cyclone IV E family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP4CE55F23C8 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F23C8 (same form factor and footprint) β differing in Package, Speed Grade, Embedded 18x18 Multipliers, Configuration Modes, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE55F23C7
β Drop-Inβ In Stock
$142 / Unit
View Datasheet βEP4CE55F23C6
β Drop-Inβ In Stock
$36.75 / Unit
View Datasheet βEP4CE55F23C7N
β Drop-Inβ In Stock
$56.4 / Unit
View Datasheet βEP4CE55F23C6N
β Drop-Inβ In Stock
$54.92 / Unit
View Datasheet βEP4CE115F23C8N
β Drop-Inβ In Stock
$145 / Unit
View Datasheet βEP4CE40F23C8N
β Drop-Inβ In Stock
$52.95 / Unit
View Datasheet βEP4CE55F23C8 Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | Cyclone IV E (EP4CE55) |
| Logic Elements | 55,856 |
| Embedded Memory (M9K) | 2,340 Kbits |
| Embedded 18x18 Multipliers | 154 |
| PLLs | 4 |
| Maximum User I/O | 324 |
| Core Voltage | 1.2 V |
| Process Node | 60 nm |
| Package | 484-ball FineLine BGA (FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C8 |
| Configuration Method | SRAM-based (AS / PS / JTAG / FPP) |
EP4CE55F23C8 484-ball fineline bga (fbga) Pin Configuration Guide
Pin configuration for EP4CE55F23C8 (484-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F23C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F23C8 is suitable for 6 applications: Industrial Motor Control, Video Processing Pipeline, ASIC Prototyping Platform, Test & Measurement Equipment, Embedded DSP Subsystem, Automotive Infotainment Pre-Production.
Industrial Motor Control
The EP4CE55F23C8 fits industrial motor-control designs because its 55,856 logic elements and 154 embedded 18x18 multipliers can host multi-axis field-oriented control (FOC) loops, encoder interfaces, and PWM generators in parallel. Per the Cyclone IV Device Handbook, the 4 PLLs generate the high-resolution carrier clocks needed for space-vector modulation, while the 2,340 Kbits of M9K memory buffer ADC sample streams at the rates required for closed-loop torque control. Unlike a microcontroller-based implementation, the FPGA executes the control law in deterministic hardware and absorbs tight timing margins that a software ISR cannot meet under high PWM rates.
Recommended
Video Processing Pipeline
The EP4CE55F23C8 supports video bridging and processing pipelines with its 324 user I/Os (exposing multiple LVDS / DDR-compatible pairs) and large M9K memory to buffer scan-line data. Per Intel device documentation, the 154 18x18 multipliers provide the throughput needed for color-space conversion, scaling, and overlay blending at HD video rates. Compared with discrete ASSPs, the FPGA lets designers add custom on-screen-display graphics, deinterlacing, or protocol conversion without spinning a new ASIC.
Recommended
ASIC Prototyping Platform
The EP4CE55F23C8 is widely used as an ASIC prototype vehicle because its 55,856 logic elements map directly to RTL synthesized for ASIC flows, and its 484-FBGA footprint exposes the I/O count needed for real-world bring-up. Per Altera application note AN 481, designers can partition large ASIC designs across multiple Cyclone IV E devices while preserving timing closure. The advantage over simulation is real silicon behavior at MHz speeds, including accurate timing, real I/O pad models, and on-chip debug via SignalTap II embedded logic analyzer.
Recommended
Test & Measurement Equipment
The EP4CE55F23C8 supports test and measurement instruments because its high logic count and 154 hardware multipliers can implement multi-channel DSP chains (filters, FFTs, correlators) in real time. Per the Cyclone IV Device Handbook, the 2,340 Kbits of M9K memory hold capture buffers for ADC data, while 4 PLLs drive high-speed ADC sampling clocks and trigger logic. Unlike an MCU/DSP combination, the FPGA keeps deterministic latency across channels - critical for oscilloscope, signal-analyzer, and protocol-exerciser platforms.
Recommended
Embedded DSP Subsystem
The EP4CE55F23C8 fits embedded DSP subsystems where the 154 18x18 multipliers deliver tens of GMACs of DSP throughput without loading a host CPU. Per Intel documentation, M9K blocks can implement dual-port RAM and FIFO buffers required for sample-rate conversion, while the 4 PLLs drive multiple sample-clock domains simultaneously. The result is a self-contained DSP accelerator that offloads FIR, FFT, or modulation tasks from a host processor - common in software-defined radio, audio processing, and machine-vision front ends.
Recommended
Automotive Infotainment Pre-Production
The EP4CE55F23C8 supports pre-production automotive infotainment designs because its 324 user I/Os can interface LVDS displays, MOST, CAN, and Ethernet PHYs in parallel, while the LE count absorbs protocol stacks, audio mixing, and graphics overlay. Per the Cyclone IV E datasheet, the commercial temperature grade (0C to +85C) is sufficient for cabin electronics; for under-hood or AEC-Q100 work, designers migrate to the EP4CE55F23I7N industrial-grade variant. The FPGA advantage over an ASSP is rapid feature iteration without waiting for an ASIC mask revision.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F23C8 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23C7 | EP4CE55F23C6 | EP4CE55F23C7N | EP4CE55F23C6N | EP4CE115F23C8N | EP4CE40F23C8N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-ball FineLine BGA (F23) | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same | 484-ball FineLine BGA (F23) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | ~114,480 | ~39,600 |
| Embedded Memory (M9K) | 2,340 Kbits | 2,340 Kbits | 2,340 Kbits | 2,340 Kbits | 2,340 Kbits | 3,888 Kbits | 1,134 Kbits |
| 18x18 Multipliers | 154 | 154 | 154 | 154 | 154 | 266 | 116 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/O | 324 | 324 | 324 | 324 | 324 | 280 | 328 |
| Speed Grade | C8 | C7 (slower) | C6 (slower) | C7 (slower) | C6 (slower) | C8 | C8 |
| Lead-Free (N suffix) | No (commercial) | No | No | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest-density non-transceiver Cyclone IV E member (vs EP4CE40F23C8N)
- Largest LE count before stepping up to Cyclone IV GX transceivers (vs EP4CE115F23C8N)
- C8 speed grade for tighter timing closure (vs EP4CE55F23C7)
- Drop-in compatibility with all Cyclone IV E 484-FBGA speed grades (vs EP4CE55F23C6N)
Design Notes
Estimated: the EP4CE55F23C8 core runs at 1.2 V with multiple I/O bank voltages (1.2/1.5/1.8/2.5/3.3 V) on VCCIO pins. Designers should budget at least 1.5-2 A on the 1.2 V core rail for typical designs and 500 mA per I/O bank under high switching activity. Use a multi-rail PMIC and place decoupling capacitors within 5 mm of every VCC/VCCIO pin, following the power distribution network (PDN) guidance in the Cyclone IV Device Handbook.
The 484-ball FineLine BGA package requires a 4-6 layer PCB with controlled-impedance routing and microvia or via-in-pad construction for clean signal egress. Per Cyclone IV hardware guidelines, all decoupling capacitors should mount on the opposite side of the BGA directly beneath the ball field. Maintain 50 ohm single-ended and 100 ohm differential impedance for high-speed LVDS pairs, and isolate clock and JTAG traces from switching I/O to avoid coupling.
The EP4CE55F23C8 supports four SRAM-based configuration modes: Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG. For production, AS mode with a serial flash (EPCS) is most common; PS mode is typical during debug. According to Altera configuration handbook, the MSEL[3:0] pins must be strapped to the correct level for the chosen mode, and nCONFIG must be deasserted before configuration begins.
Estimated: with theta_JA around 15 C/W for the 484-FBGA package at still air, a fully utilized EP4CE55F23C8 can dissipate 3-5 W and reach junction temperatures above 100 C. For continuous operation above 50% utilization, provide forced-air cooling or a heatsink attached to the package top, and verify thermal margins with the Cyclone IV PowerPlay early-power estimator tool.
Common pitfalls: (1) leaving MSEL pins floating, which causes configuration failures; (2) forgetting the pull-up on nCE and the pull-down on nCEO when chaining multiple FPGAs; (3) using the wrong I/O standard - LVDS pairs must use dedicated true differential pairs, not regular SE pins; (4) ignoring the 1.2 V core sequence (ramp before VCCIO) which can cause I/O latch-up. Reference Altera AN 481 and the Cyclone IV device handbook for full bring-up checklists.
Compliance Information
EP4CE55F23C8 is the non-N commercial variant - lead-free version (EP4CE55F23C8N) exists for RoHS-compliant builds. RoHS, REACH, and halogen-free status were not surfaced in the verified distributor data; consult Intel product compliance documentation for definitive status.
