EP4CE55F29C6N - 55K LE Cyclone IV E FPGA | Intel | 780-BGA
MPN: EP4CE55F29C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $63.85 | $6,385.00 |
| 500 | $56.4 | $28,200.00 |
| 1,000 | $49.95 | $49,950.00 |
EP4CE55F29C6N Overview
What is an FPGA? An FPGA (field-programmable gate array) is a reprogrammable digital IC that combines configurable logic, embedded memory blocks, and DSP slices on a single die. FPGAs sit alongside microcontrollers and ASICs in the digital IC hierarchy, and within the Intel/Altera portfolio the Cyclone IV E series targets cost-sensitive, high-volume, low-power applications with a 60 nm process and logic densities from about 6K to 114K logic elements. Cyclone IV E specifically excludes transceivers, distinguishing it from the Cyclone IV GX family.
Key features of the EP4CE55F29C6N include up to 472.5 MHz maximum operating frequency, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, up to 4 PLLs, and configuration via JTAG, passive serial, or Altera EPCS configuration devices. The device supports both 1.2 V core and 2.5 V/3.3 V I/O banks, with embedded 9 Kbit memory blocks (M9K) configurable as RAM, ROM, or FIFO.
Architecturally, the EP4CE55F29C6N is built on a TSMC 60 nm low-power process, with 4 input look-up tables (LUTs) per logic element, dedicated carry chains, and embedded multiplier blocks optimized for DSP workloads. The device includes 4 PLLs and 20 global clock networks, enabling complex clock-domain designs. The 780-BGA package provides ample I/O for high-pin-count applications while maintaining a moderate footprint for the logic density offered.
Typical applications include industrial motor control, video processing and image pipelines, communications infrastructure (bridges and protocol converters), test and measurement instrumentation, and embedded computing where parallel processing outperforms microcontrollers. The combination of DSP blocks and embedded RAM also suits software-defined radio (SDR) front-end processing.
When designing with the EP4CE55F29C6N, pay close attention to power sequencing - core voltage (1.2 V) must ramp before I/O voltages, and proper decoupling per Altera's Cyclone IV handbook is critical for signal integrity. JTAG chain ordering matters when multiple devices share a configuration bus.
Drop-in alternatives for EP4CE55F29C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F29C6N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE55F29C7N
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EP4CE55F29C8N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP4CE55F29I7N
✅ Drop-In✓ In Stock
$154.8 / Unit
View Datasheet →EP4CE55F29C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 55,856 |
| Logic Array Blocks (LABs) | 3491 |
| Total Memory Bits | 239,6160 |
| Embedded 18x18 Multipliers | 374 |
| Maximum Operating Frequency | 472.5 MHz |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V to 3.3 V |
| Process Technology | 60 nm low-power |
| Package | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Configuration Methods | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS |
| RoHS Status | Lead-free, RoHS compliant |
| Mounting Type | Surface Mount |
EP4CE55F29C6N 780-bga (fbga-780), 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE55F29C6N (780-bga (fbga-780), 29 x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F29C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F29C6N is suitable for 6 applications: Industrial Motor Control, Video Processing and Image Pipelines, Communications Protocol Bridging, Test and Measurement Instrumentation, Software-Defined Radio Front-End Processing, Embedded Computing Platforms.
Industrial Motor Control
The EP4CE55F29C6N's 374 embedded 18x18 multipliers and 4 PLLs make it well-suited for field-oriented control (FOC) of three-phase AC motors and servo drives. The 472.5 MHz fabric clock supports high-resolution PWM generation at switching frequencies above 100 kHz, while the 2,396,160 bits of embedded M9K memory buffer ADC sample streams from current and position sensors. Its commercial temperature grade and robust BGA package suit industrial cabinet environments. Companion parts include the EP4CE55F29C7N for higher Fmax headroom and EPCS16N for autonomous configuration storage.
Recommended
Video Processing and Image Pipelines
The EP4CE55F29C6N handles real-time video bridging, scaling, and color-space conversion in surveillance and broadcast equipment. Its 55K logic elements, 374 multipliers, and 20 global clock networks support multi-channel HDMI/SDI processing pipelines, while the LVDS I/O capability directly interfaces with Camera Link and MIPI bridges. The 780-BGA F29 package exposes enough user I/O for multi-stream 1080p60 capture and display. Engineers can pair it with the EP4CE115F29C8N for higher-channel-count designs or drop down to EP4CE40F29C6N for simpler single-stream applications.
Recommended
Communications Protocol Bridging
The EP4CE55F29C6N excels at protocol conversion between industrial and enterprise networks, such as EtherCAT-to-Ethernet, PROFINET-to-Modbus, and CAN-to-UART bridges. Its 4 PLLs enable independent clock domains for each protocol stack, and the abundant 9 Kbit M9K memory blocks serve as FIFOs between asynchronous data paths. The 780-BGA F29 footprint delivers ample LVDS/LVCMOS I/O for parallel bus interfaces and SERDES-style links. Pair with the EP4CE55F29I7N industrial temperature variant for outdoor cabinet deployments.
Recommended
Test and Measurement Instrumentation
The EP4CE55F29C6N delivers parallel sample processing for oscilloscopes, logic analyzers, and protocol testers. Its 374 18x18 multipliers enable real-time FIR filtering and FFT pre-processing on ADC sample streams, while the 4 PLLs generate the precise clock trees required for high-speed ADC interfacing. The 780-BGA F29 package exposes sufficient LVDS pairs for subnanosecond skew-matched acquisition channels. Designers can use the EP4CE115F29C8N for higher channel counts or scale down with EP4CE40F29C6N for portable instruments.
Recommended
Software-Defined Radio Front-End Processing
The EP4CE55F29C6N's combination of 374 DSP multipliers and high-density M9K memory blocks enables IF sampling, digital down-conversion (DDC), and channelization in software-defined radio platforms. Its 472.5 MHz fabric clock supports real-time baseband processing at sample rates up to 200 MSPS, while 20 global clocks handle multiple ADC/DAC synchronization paths. The LVDS I/O interfaces cleanly with high-speed ADCs like the AD9649. For higher sample rates, the EP4CE115F29C8N provides more DSP resources in the same package family.
Recommended
Embedded Computing Platforms
The EP4CE55F29C6N serves as the central logic hub in embedded computing platforms, offloading real-time tasks from the host processor through PCIe, parallel bus, or SERDES links. Its abundant logic and DSP resources accelerate cryptography, packet processing, and sensor fusion in industrial PCs and edge gateways. The 4 PLLs and 20 global clocks support multiple peripheral clock domains, while the 780-BGA F29 package provides the I/O count for parallel NAND, DDR2, and LVDS display interfaces. Use EP4CE55F29I7N for industrial temperature compliance.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F29C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F29C7N | EP4CE55F29C8N | EP4CE55F29I7N |
|---|---|---|---|---|
| Package | 780-BGA (FBGA-780), 29x29 mm, 1.0 mm pitch | 780-BGA (FBGA-780) - same | 780-BGA (FBGA-780) - same | 780-BGA (FBGA-780) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 |
| Speed Grade | -6 (C6) | -7 (C7) - faster | -8 (C8) - fastest | -7 (I7) - faster |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Embedded Multipliers (18x18) | 374 | 374 | 374 | 374 |
| Total Memory Bits | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| PLLs | 4 | 4 | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Cost-optimized 55K LE FPGA with mature toolchain (vs EP4CE40F29C6N (40K LE))
- Commercial temperature grade at lowest unit cost (vs EP4CE55F29I7N (industrial -40C to +100C))
- Cyclone IV E vs Cyclone IV GX: transceiver-free for cost saving (vs Cyclone IV GX (e.g. EP4CGX50))
- 60 nm low-power process vs newer 28 nm Cyclone V (vs Cyclone V (e.g. 5CEBA4F23C7N))
Design Notes
The EP4CE55F29C6N requires a 1.2 V core supply with tight tolerance (typically +/-3 percent). Power sequencing is critical: VCCINT (core) must ramp before or simultaneously with VCCIO (I/O) banks. Use a dedicated LDO for VCCINT and follow Altera's Cyclone IV handbook decoupling guidelines - typically 0402 0.1 uF capacitors at every VCCINT pin and bulk 22 uF tantalums on each supply rail. PLL analog supplies (VCCA_PLL) require additional filtering with a ferrite bead and 10 uF + 0.1 uF decoupling.
The 780-BGA F29 package has a typical theta_JA of around 12-15 C/W with a standard 4-layer JEDEC PCB, but this can drop to 8 C/W with extensive inner copper pours. For designs utilizing >50 percent of logic resources at high toggle rates, thermal analysis is recommended - junction temperature must stay below 125 C for commercial grade. Consider thermal vias under the BGA and a moderate airflow path for fanless industrial enclosures.
The 780-ball FBGA package with 1.0 mm pitch demands 6-layer or 8-layer PCB stackup for signal integrity. Use laser-drilled or 0.4 mm mechanically drilled microvias, with via-in-pad recommended for the inner rows. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs. Match length within 150 mil for DDR2/DDR3 interfaces and within 50 mil for source-synchronous LVDS. Ground reference planes must be unbroken beneath all high-speed signal layers.
All LVDS and DDR interfaces require matched-impedance routing and length matching. For DDR2/3 controller implementations, enable Altera's PHY-friendly IO delay chains and use the UniPHY IP for turnkey timing closure. Series-termination resistors on SSTL/HSTL outputs are typically required when trace lengths exceed 2 inches. Consult AN 544 for DDR2 controller guidelines.
Common pitfalls when designing with the EP4CE55F29C6N include: (1) forgetting to tie nCONFIG high via 4.7 kohm resistor and providing a clean nSTATUS signal; (2) omitting the 25 ohm series resistor on TMS/TCK JTAG lines; (3) using wrong configuration mode strap resistors on MSEL pins; (4) leaving unused PLL power pins floating instead of connecting them through a ferrite bead; and (5) forgetting to specify the correct speed grade in Quartus II before compilation.
Compliance Information
Lead-free FBGA-780 package per Intel product page. Not AEC-Q100 qualified; for automotive use, evaluate EP4CE55F29I7N with additional system-level qualification.
