Altera

EP4CE55F29C8 - Cyclone IV E FPGA, 55K LE, 780-BGA | Altera

MPN: EP4CE55F29C8 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 780-ball FineLine BGA (FBGA-780) Package 2,396,160 Memory
From $95.41 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $141.6749 $141.67
10 $134.59 $1,345.90
100 $121.3 $12,130.00
500 $108.72 $54,360.00
1,000 $95.41 $95,410.00
ℹ️ All prices are in USD

EP4CE55F29C8 Overview

The Intel (Altera) EP4CE55F29C8 is a Cyclone IV E family field-programmable gate array (FPGA) delivering 55,856 logic elements, 2,396,160 bits of embedded memory, and 374 maximum user I/Os in a 780-ball FineLine BGA package. Built on a low-power 60 nm process, the device targets cost-sensitive, high-volume applications that need mid-range logic density without sacrificing signal integrity or I/O bandwidth. Operating from a 1.2 V core supply with separate 2.5 V/3.0 V/3.3 V I/O banks, the EP4CE55F29C8 is rated for the commercial 0 C to +85 C temperature range and supports in-system programming via JTAG or Active Serial configuration.

A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement custom digital logic, memory blocks, and I/O protocols in silicon after fabrication. FPGAs sit alongside ASICs, microcontrollers, and CPLDs in the broader programmable logic taxonomy, with mid-range devices like the Cyclone IV E family balancing logic density, DSP capability, and unit cost for mainstream designs. Cyclone IV E extends the earlier Cyclone III architecture with higher logic element counts, more embedded multipliers (18x18), and a hardened memory controller, making it well-suited to bridging and control-plane tasks rather than high-end DSP.

Key features of the EP4CE55F29C8 include 156 embedded 18x18 multipliers for DSP pipelines, 4 PLLs per device for clock management, and 66 embedded memory blocks (M9K) for efficient on-chip buffering. The FineLine BGA-780 package provides high-density board integration while exposing 8 transceiver-free LVDS-capable I/O lanes. Configuration is supported through JTAG (IEEE 1149.1), Active Serial (AS), and Passive Serial (PS) modes, and Quartus II Web Edition handles synthesis, place-and-route, and bitstream generation at no additional licensing cost.

The Cyclone IV E architecture uses 4-input look-up tables (LUTs) feeding a high-performance interconnect, with each logic element combining an LUT, register, and carry chain for arithmetic paths. Logic-array blocks (LABs) cluster 16 logic elements plus local routing, enabling efficient pipelined designs. The 60 nm process and 1.2 V core reduce dynamic power roughly 25% versus Cyclone III, while clock-network gating further cuts quiescent consumption in standby states.

Typical applications for the EP4CE55F29C8 include industrial motor control and machine vision front-ends, video bridging (BT.656, BT.1120, DisplayPort), PCIe Gen1 endpoint controllers, and consumer electronics requiring mid-density glue logic. The 780-BGA footprint is a common reference design for industrial vision and factory-automation boards where board space is at a premium but raw I/O count matters. With its large embedded memory, the device is also used as a digital signal front-end in software-defined radio (SDR) and instrumentation.

When designing with the EP4CE55F29C8, pay close attention to decoupling strategy on the 1.2 V core (recommend 100 nF plus 10 uF bulk per bank) and to I/O bank voltage grouping to avoid level-shift penalties. The 780-BGA's thermal pad should be soldered to a continuous ground plane for low-impedance return paths and effective heat spreading at high toggle rates.

This page synthesizes distributor pricing, drop-in alternatives within the Cyclone IV E family, and practical design notes not found in the standalone manufacturer datasheet.

Drop-in alternatives for EP4CE55F29C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE55F29C8 (same form factor and footprint) — differing in Package, Process Technology, Configuration Modes, RoHS Status, Operating Temperature.

Intel
Package: 780-ball FBGA (29 mm x 29 mm)
Process Technology: 60 nm (low-power)
Configuration Modes: AS, AP, PS, JTAG
Compare with EP4CE55F29C8 →
Intel
Package: 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch
RoHS Status: Lead-free, RoHS compliant
Compare with EP4CE55F29C8 →
Altera
Package: 780-ball FBGA (29 x 29 mm, 1 mm pitch)
Process Technology: 60 nm
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CE55F29C8 →
Intel
Package: 780-ball FBGA (F29)
RoHS Status: Compliant (LEAD FREE)
Operating Temperature: 0C to +85C (commercial)
Compare with EP4CE55F29C8 →
Intel
Package: 780-ball FBGA (F29), 1.0 mm pitch
Process Technology: 60 nm (TSMC low-power)
Configuration Modes: Active Serial, JTAG, Passive Serial
Compare with EP4CE55F29C8 →
Intel
Configuration Modes: AS, PS, JTAG, FPP
Operating Temperature: 0C to +85C (commercial)
Compare with EP4CE55F29C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CE55F29C7N

✅ Drop-In
Intel
📦 780-ball FBGA
Cyclone IV E · 55,856 · 3,491 · 2,396,160 · 374 · 780-ball FBGA (F29)

✓ In Stock

$138 / Unit

View Datasheet →

EP4CE55F29C7

✅ Drop-In
Altera
📦 780-ball FBGA
Cyclone IV E · 55,856 · 3,491 · 2,396,160 · 156 · 4 · 374 · 472.5 MHz

✓ In Stock

$132.4 / Unit

View Datasheet →

EP4CE55F29C6N

✅ Drop-In
Intel
📦 780-ball FBGA
Cyclone IV E · 55,856 · 3491 · 239,6160 · 374 · 472.5 MHz · 4 · 20

✓ In Stock

$49.95 / Unit

View Datasheet →

EP4CE55F29C6

✅ Drop-In
Intel
📦 780-ball FBGA
Cyclone IV E · Cyclone IV E · 55,856 · 47 · 2,396,160 bits (234 Kb) · 156 · 156 · 374

✓ In Stock

$154.2 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP4CE55F29C8 Maximum Ratings & Electrical Characteristics

Series Cyclone IV E
Family Cyclone IV E
Logic Elements 55,856
Embedded Memory Bits 2,396,160
Embedded Memory Blocks 66 x M9K
Maximum User I/O 374
Logic Array Blocks (LABs) 3,491
Embedded 18x18 Multipliers 156
PLLs 4
Core Voltage 1.2 V
I/O Bank Voltage 2.5 V / 3.0 V / 3.3 V
Process Technology 60 nm low-power
Operating Temperature 0 C to +85 C (commercial)
Package 780-ball FineLine BGA (FBGA-780)
Mounting Type Surface Mount
Configuration Modes JTAG, Active Serial, Passive Serial
RoHS Status Compliant

EP4CE55F29C8 780-ball fineline bga (fbga-780) Pin Configuration Guide

Pin configuration for EP4CE55F29C8 (780-ball fineline bga (fbga-780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

780-ball fineline bga (fbga-780) package pinout diagram for EP4CE55F29C8

No detailed pinout data available for EP4CE55F29C8.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE55F29C8 is suitable for 6 applications: Industrial Motor Control, Video Bridging & Display Controllers, PCIe Gen1 Endpoint & Industrial I/O, Software-Defined Radio Front-End, Machine Vision Frame Grabbers, Portable Test & Measurement.

🏭

Industrial Motor Control

The EP4CE55F29C8 fits industrial motor control where 55,856 logic elements plus 156 embedded 18x18 multipliers deliver deterministic PWM generation and field-oriented control (FOC) at sub-microsecond loop times. The 4 PLLs synthesize independent clocks for the ADC, encoder, and PWM channels, eliminating external frequency dividers. With 374 user I/Os the device handles 3-phase gate drivers, resolver feedback, and CAN/RS-485 interfaces on a single chip. The 780-ball FBGA exposes enough LVDS pairs for high-speed position encoder decoding, while the 1.2 V core and 60 nm low-power process keep thermal rise modest under continuous switching.

📺

Video Bridging & Display Controllers

The EP4CE55F29C8 serves as a video bridge for BT.656, BT.1120, DisplayPort, and HDMI-to-LVDS conversion in mid-density designs. Its 2.4 Mbit embedded memory buffers full video lines, and 66 M9K blocks deliver the FIFO depth needed for pixel-rate rate matching. The 4 PLLs synthesize the multiple pixel clocks (typically 27 MHz to 148.5 MHz) required for multi-format source panels, while 374 user I/Os drive 24-bit RGB and LVDS simultaneously. Designers prefer Cyclone IV E here because of Quartus II's mature Video and Image Processing Suite IP, which shortens development cycles compared to scratch HDL.

🖥️

PCIe Gen1 Endpoint & Industrial I/O

The EP4CE55F29C8 implements a PCIe Gen1 (2.5 GT/s) endpoint controller using the Cyclone IV E hard IP block, freeing logic for endpoint DMA, MSI-X handling, and protocol layering. With 55,856 logic elements the part can host a full PCIe endpoint plus 8-12 user-side DMA channels concurrently. The 780-ball FBGA exposes the four PCIe lanes plus 2.5 V/3.3 V reference clocks, while 4 PLLs isolate the PCIe reference from the application clock domain. Engineers select this part for industrial vision frame grabbers, data-acquisition cards, and embedded PCs where the proven PCIe IP shrinks board area.

🌐

Software-Defined Radio Front-End

The EP4CE55F29C8 acts as a digital front-end for narrow-band SDR receivers in the VHF/UHF range. Its 156 embedded 18x18 multipliers deliver 39 GMACs of DSP throughput, enough for a 64-tap FIR plus NCO/DDC at sample rates up to 100 MSPS. The 2.4 Mbit embedded memory holds sample buffers between decimation stages, and 374 user I/Os interface ADCs, DACs, and high-speed LVDS links to baseband processors. Compared with a DSP + MCU split, a single Cyclone IV E reduces board space and BOM cost while offering reconfigurability across multiple waveforms.

🎥

Machine Vision Frame Grabbers

The EP4CE55F29C8 powers mid-resolution machine vision frame grabbers interfacing MIPI CSI-2, LVDS, and parallel Camera Link sensors. Its 374 user I/Os handle 24-bit pixel buses plus auxiliary GPIO, while 156 embedded 18x18 multipliers accelerate Bayer demosaicing and edge-detection preprocessing in real time. The 2.4 Mbit embedded memory absorbs sensor line bursts, freeing the host processor from tight real-time constraints. Quartus II's Video and Image Processing Suite IP provides pre-verified demosaic, gamma correction, and color-space conversion blocks, allowing faster prototype-to-production cycles.

🔧

Portable Test & Measurement

The EP4CE55F29C8 functions as the reconfigurable compute engine inside benchtop oscilloscopes, logic analyzers, and protocol analyzers. 55,856 logic elements accommodate state machines, protocol decoders (I2C, SPI, UART, CAN), and custom trigger logic in a single chip, while 156 multipliers accelerate FFT and digital filtering on captured waveforms. The 780-ball FBGA exposes enough I/O for 32-channel logic analysis or 4-channel 1 GSPS ADC interfacing. Designers choose Cyclone IV E for its low static power (sub-100 mW typical) versus competing 28 nm FPGAs in battery-powered instruments.

What is the EP4CE55F29C8?
The EP4CE55F29C8 is a Cyclone IV E field-programmable gate array from Intel (formerly Altera) with 55,856 logic elements, 2,396,160 bits of embedded memory, 156 embedded 18x18 multipliers, and 374 maximum user I/Os, packaged in a 780-ball FineLine BGA. According to the Cyclone IV Device Handbook, the device uses a 60 nm low-power process and operates from a 1.2 V core supply. It targets cost-sensitive, mid-density designs in industrial, video, and consumer applications.
How many logic elements does the EP4CE55F29C8 have?
The EP4CE55F29C8 contains 55,856 logic elements organized into 3,491 logic array blocks (LABs). Each logic element pairs a 4-input lookup table with a register and dedicated carry chain, while each LAB bundles 16 logic elements with local interconnect. This density places the part at the upper end of the Cyclone IV E family, above the EP4CE40 and below the EP4CE75 and EP4CE115 variants.
What package does the EP4CE55F29C8 use?
The EP4CE55F29C8 ships in a 780-ball FineLine BGA (FBGA-780) with a 1.0 mm ball pitch. This large package exposes all 374 user I/Os plus JTAG, configuration, and clock pins, making it the highest-I/O option in the Cyclone IV E family. The fine-pitch BGA requires 4-6 layer PCB construction with microvia or via-in-pad technology for reliable assembly.
How much embedded memory does the EP4CE55F29C8 have?
The EP4CE55F29C8 includes 2,396,160 bits of embedded SRAM distributed across 66 M9K memory blocks, each 9 Kbit and configurable as RAM, ROM, or FIFO. Total embedded RAM is 2.4 Mbit, large enough to buffer video lines or hold multiple deep packet queues without external memory. Designers can also infer shift registers and ROM from unused M9K blocks to recover otherwise idle silicon.
How many multipliers and PLLs does the EP4CE55F29C8 have?
The EP4CE55F29C8 integrates 156 embedded 18x18 hardware multipliers for DSP pipelines and 4 phase-locked loops for clock synthesis and management. The multipliers support signed and unsigned multiplication with optional accumulation, enabling single-cycle FIR and MAC operations. The four PLLs support up to eight output clock domains each, allowing independent frequency synthesis for video, memory, and serial interfaces.
Where can I buy the EP4CE55F29C8 online?
The EP4CE55F29C8 is in stock at DigiKey, Mouser, and authorized distributors as of 2026-09-10. Heisener lists 6,256 pieces at $141.67 unit price with an estimated delivery of Jan 26 to Jan 31 if ordered today. For production volumes, request a quote directly from Intel-authorized partners to lock pricing and lead time before placing a blanket order.
What is the price of the EP4CE55F29C8?
The EP4CE55F29C8 lists at $141.67 per unit at qty-1 on Heisener, with tiered pricing falling to roughly $95 per unit at 1000 pieces as of 2026-09-10. Octopart aggregates 15 distributors for real-time comparison. Volume pricing varies with lead time and packaging option, so obtain a fresh quote before committing to a production BOM.
What is the lead time for the EP4CE55F29C8?
The EP4CE55F29C8 lead time from Heisener is listed as 'to be confirmed' with an estimated delivery window of Jan 26 to Jan 31, 2026, when ordered as of 2026-09-10. Stock at authorized distributors fluctuates; check DigiKey and Mouser for immediate ship availability. For long production runs, request an allocation from Intel directly to secure multi-quarter supply.
Is the EP4CE55F29C8 in stock right now?
Yes, the EP4CE55F29C8 is currently in stock at multiple authorized distributors. Heisener reports 6,256 pieces available as of 2026-09-10, and DigiKey lists active stock with same-day shipping on many orders. Octopart aggregates 15 distributors for real-time inventory comparison; prioritize Intel-authorized partners to avoid counterfeit risk.
EP4CE55F29C8 vs EP4CE55F29C6N - which is better for industrial design?
Both parts share the same Cyclone IV E family, 55,856 logic elements, and 780-ball FineLine BGA package, but the EP4CE55F29C8 operates at speed grade 8 (faster Fmax) while the EP4CE55F29C6N is speed grade 6 (slower). The trailing 'N' in C6N denotes lead-free / RoHS compliance. For industrial designs needing higher clock rates, choose the C8; for cost-sensitive or lead-free-only builds, the C6N is the better pick.
What is the difference between EP4CE55F29C8 and EP4CE40F29C8?
The EP4CE55F29C8 has 55,856 logic elements versus 39,600 logic elements on the EP4CE40F29C8, both in the same 780-ball FBGA package. Both share 4 PLLs and 66 M9K memory blocks but the EP4CE55 has more multipliers (156 vs 116). The EP4CE40 is a 30% cheaper pin-compatible alternative when a design does not require the full LE count.
When should I choose EP4CE55F29C8 over Lattice ECP5?
Choose the EP4CE55F29C8 over a Lattice ECP5 (LFE5U-85F-8BG381I) when you need mature Quartus II tool support, an established IP library, or higher embedded memory density (2.4 Mbit vs 3.7 Mbit but distributed in larger blocks). Pick ECP5 for lower static power, hardened SERDES, and lower unit cost in 256-ball packages. Neither part is a drop-in replacement due to differing package and ballmap.
What is the best drop-in replacement for EP4CE55F29C8?
The closest drop-in replacement is the EP4CE55F29C7N, which shares the 780-ball FBGA-780 footprint and identical 55,856-LE die but operates at speed grade 7 (slightly slower Fmax). For volume designs, EP4CE55F29C6N is another pin-compatible option with speed grade 6. Both are listed in the alternatives array as same-brand drop-ins.
Can EP4CE55F29C7N replace EP4CE55F29C8 on my board?
Yes, the EP4CE55F29C7N is pin-to-pin compatible with the EP4CE55F29C8 on the 780-ball FBGA footprint. Both parts share identical logic, memory, multiplier, and PLL resources; the only difference is speed grade (7 vs 8), which yields a small Fmax reduction. Bitstreams are not interchangeable, so you must recompile the design with the new device selected in Quartus.
Where to download the EP4CE55F29C8 datasheet PDF?
The official Cyclone IV Device Handbook (cyiv-51001.pdf) covers the EP4CE55F29C8 and is available on the Intel website at the datasheet URL listed on this page. The handbook includes device overview, architecture details, configuration, DC and switching characteristics, and package pin-out diagrams for the 780-ball FBGA. Always reference the latest revision before finalizing PCB layout.

Engineering reference data for EP4CE55F29C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE55F29C8 when you need the maximum commercial-temperature Fmax in a 780-ball FBGA, plus 55,856 logic elements, 4 PLLs, 156 multipliers, and 2.4 Mbit embedded memory. Pick the EP4CE55F29C7N or EP4CE55F29C7 if your design closes timing at speed grade 7 and you want lower unit cost or a SnPb finish for legacy assembly. Select the EP4CE55F29C6N or EP4CE55F29C6 for lower-power or cost-driven builds where speed grade 6 is sufficient. All five parts share the same 780-ball FBGA pinout, so PCB layout is reusable across the family - only the bitstream and Quartus device selection change.

Comparison with Alternatives

Parameter This Product EP4CE55F29C7N EP4CE55F29C7 EP4CE55F29C6N EP4CE55F29C6
Package 780-ball FBGA 780-ball FBGA - same 780-ball FBGA - same 780-ball FBGA - same 780-ball FBGA - same
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Speed Grade 8 (fastest) 7 7 6 6
Logic Elements 55,856 55,856 55,856 55,856 55,856
Embedded Memory (bits) 2,396,160 2,396,160 2,396,160 2,396,160 2,396,160
Embedded Multipliers (18x18) 156 156 156 156 156
PLLs 4 4 4 4 4
Max User I/O 374 374 374 374 374
Lead Finish Lead-free / RoHS Lead-free / RoHS SnPb Lead-free / RoHS SnPb

Key Differentiators

  • Highest speed grade (8) in the Cyclone IV E family for this package (vs EP4CE55F29C7N)
  • 55,856 logic elements for ~40% more capacity than the EP4CE40 family (vs EP4CE40F29C8)
  • Lead-free / RoHS-compliant factory finish (vs EP4CE55F29C7)

Design Notes

The Cyclone IV E core draws from a 1.2 V supply; design bulk decoupling as 4-8 pieces of 10 uF X5R ceramic plus 100 nF X7R per VCC/GND pair near each corner of the FBGA. Estimated: at typical toggle activity the EP4CE55F29C8 draws 0.8-1.2 A on VCCINT, so the regulator must deliver at least 2 A peak with headroom for inrush during configuration. The I/O banks (VCCIO) at 2.5/3.0/3.3 V should each be decoupled separately; mixing voltages on a single bank violates the absolute-maximum ratings.

The 780-ball FBGA exposes a thermal pad that must be soldered to a continuous ground plane with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) for heat spreading. Estimated: at 100% toggle activity the device dissipates 2-3 W, and without the thermal pad the junction temperature will exceed the commercial +85 C rating at ambient temperatures above +60 C. For sealed enclosures, derate ambient by 10 C or add forced airflow to keep junction-to-ambient thermal resistance within 15 C/W.

Route the 780-ball FBGA on a 6-layer stack-up with 1-oz copper outer layers and 0.5-oz inner power planes. Use microvia or via-in-pad (VIPPO) technology to escape the 1.0 mm pitch BGA; standard 0.3 mm vias on 0.5 mm pitch with 4 signal layers are workable but consume more breakout space. Keep all high-speed LVDS and DDR traces on the top side with reference to a continuous ground plane; avoid routing signal traces across split power planes to prevent return-path discontinuities.

Do not power up the device without a valid configuration file; the I/O pins are tri-stated but can be driven by external peripherals during configuration and cause latch-up. Always release the nCONFIG pin only after all supply rails have stabilized. Estimated: in-system programming via JTAG requires the TCK line to be pulled up to VCCIO of the bank containing the JTAG pins; floating TCK causes intermittent programming failures that mimic counterfeit-device symptoms.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free per the C8 suffix. Commercial temperature grade only; for industrial -40 C to +100 C choose EP4CE55F29I7N or EP4CE55F29I8LN. AEC-Q100 not applicable for FPGAs in this family.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel Cyclone IV E EP4CE55F29C8 EP4CE55F29C7N EP4CE55F29C6N FPGA Field Programmable Gate Array logic element logic array block embedded memory M9K block embedded multiplier PLL FineLine BGA FBGA-780 RoHS Quartus II JTAG PCIe Gen1 DSP industrial motor control video bridge machine vision
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