EP4CE75F23C6N - Cyclone IV E FPGA, 75K LEs, 484-FBGA | Intel
MPN: EP4CE75F23C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $304.2 | $304.20 |
| 10 | $285.4 | $2,854.00 |
| 100 | $248.75 | $24,875.00 |
| 500 | $215.3 | $107,650.00 |
| 1,000 | $189.5 | $189,500.00 |
EP4CE75F23C6N Overview
What is an FPGA? A Field-Programmable Gate Array is a programmable semiconductor device whose logic fabric, routing, and I/O behavior are configured by the end user after manufacture, in contrast to an ASIC whose function is fixed at tape-out. FPGAs sit within the programmable logic device (PLD) hierarchy and are widely used as hardware accelerators, glue logic, and rapid-prototyping platforms in industrial, communications, automotive, and consumer systems. The Cyclone IV E family specifically targets low-cost, low-power designs where power budgets and unit cost matter more than maximum logic density.
Key features include up to 200 MHz internal operation, embedded 18x18 multipliers for DSP operations, dedicated DDR/DDR2 SDRAM memory interfaces, and a wide range of IP cores from Intel's Quartus II tool ecosystem. Configuration is supported via JTAG, Active Serial (AS), or Passive Parallel (PPS) modes. The device supports single-supply core operation at 1.0 V or 1.2 V with dedicated PLL blocks for clock management.
Typical applications include industrial motor control, video processing pipelines, automotive infotainment subsystems, low-cost ASIC prototyping, and embedded vision. The 484-FBGA package enables high I/O density for memory-bus-heavy designs while maintaining a small board footprint.
When designing with this FPGA, ensure that the PCB layout provides adequate power decoupling with low-ESR capacitors placed close to each supply pin. For high-speed memory interfaces (DDR/DDR2), follow the Intel Pin Connection Guidelines and use the Quartus II board-level tools to validate signal integrity. Static I/O voltages must match the bank reference voltage configured in the pin planner.
Drop-in alternatives for EP4CE75F23C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23C6N (same form factor and footprint) — differing in Package, Embedded 18x18 Multipliers, Speed Grade, Process Technology, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE55F23C6N
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View Datasheet →EP4CE40F23C6N
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View Datasheet →EP4CE75F23C8N
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View Datasheet →EP4CE115F23C8N
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View Datasheet →EP4CE75F23C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP4CE75F23C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | Cyclone IV E |
| Device Logic Elements | 75,408 |
| Total Memory Bits | 2,810,880 |
| User I/O Count | 292 |
| Number of Logic Blocks | 47 |
| Number of LABs/CLBs | 4,713 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.0 V / 1.2 V |
| Package Type | 484-FBGA |
| Pin Count | 484 |
| Operating Temperature | 0C to +85C (Commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4CE75F23C6N 484-fbga Pin Configuration Guide
Pin configuration for EP4CE75F23C6N (484-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F23C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F23C6N is suitable for 6 applications: Industrial Motor Control, Video Processing Pipeline, Automotive Infotainment Subsystem, ASIC Prototyping Platform, Embedded Vision and Machine Vision, Communications Protocol Bridging.
Industrial Motor Control
The EP4CE75F23C6N fits industrial motor control applications through its 75,408 logic elements, which provide sufficient capacity to implement field-oriented control (FOC) algorithms, PWM generation, and encoder interface logic in a single chip. The device's dedicated PLL blocks enable precise PWM frequency synthesis up to 200 MHz, critical for sinusoidal commutation timing at high motor speeds. With 292 user I/Os, the FPGA can interface directly to multi-axis resolver-to-digital converters, gate drivers, and current-sense ADCs without external logic. The 60 nm process and 1.0/1.2 V core supply keep dynamic power low, allowing fan-less operation in sealed industrial enclosures. Engineers typically pair this FPGA with EPCS configuration memory and external SRAM for data logging.
Recommended
Video Processing Pipeline
The EP4CE75F23C6N suits video processing applications where mid-density logic is needed for scaling, deinterlacing, color space conversion, or overlay blending. Its 2.8 Mbits of embedded memory provide line buffering for HD video (1280x720 at 60 fps requires roughly 1 Mbit per line buffer), enabling real-time pipelined processing without external SRAM. The 292 I/Os support parallel RGB, BT.656, and LVDS display interfaces through configurable I/O standards. Embedded 18x18 multipliers enable efficient chroma upsampling and sharpening filter implementations. The C6 speed grade ensures timing closure at 148.5 MHz pixel clocks typical of 720p60 and 1080i video formats, while Quartus II IP cores accelerate development.
Recommended
Automotive Infotainment Subsystem
The EP4CE75F23C6N can be deployed in cost-sensitive automotive infotainment subsystems where its 75,408 LEs handle display controllers, audio DSP glue logic, CAN/LIN gateway functions, and touch-screen interface processing. While the EP4CE75F23C6N is commercial-temperature grade (0C to +85C), the same silicon is available in industrial-grade (I-suffix) OPNs that meet the -40C to +100C automotive cabin requirement. The 484-FBGA package withstands automotive vibration profiles when properly board-mounted. The Cyclone IV E family's long lifecycle support and mature Quartus II toolchain make it suitable for production automotive programs with multi-year deployment horizons.
Recommended
ASIC Prototyping Platform
The EP4CE75F23C6N serves as a cost-effective ASIC prototyping vehicle for designs targeting 100K-200K ASIC gate equivalents, allowing RTL verification at near-real-time before committing to mask costs. With 75,408 LEs and embedded memory blocks organized as M9K (9 Kbit) and MLAB (640 bit) blocks, designers can map most ASIC RAM/ROM and register files into FPGA memory. The 60 nm process provides predictable timing closure paths, and Quartus II's TimeQuest timing analyzer offers SDC-based constraints familiar to ASIC engineers. Multi-FPGA partitioning is possible when designs exceed single-device capacity, with the 484-FBGA package supporting high-density board-level interconnect.
Recommended
Embedded Vision and Machine Vision
The EP4CE75F23C6N enables embedded machine vision applications including barcode scanning, quality inspection, and simple object detection by leveraging its 18x18 embedded multipliers for convolution operations and M9K memory blocks for image line buffering. A 640x480 grayscale image at 30 fps requires only 9.2 Mbit/s, well within the FPGA's bandwidth envelope. The 292 user I/Os allow direct MIPI-CSI-2 bridge implementation (with appropriate PHY) or parallel camera interface connectivity. The device's low power consumption (under 1.5 W typical) enables vision deployment in battery-powered or thermally constrained embedded systems.
Recommended
Communications Protocol Bridging
The EP4CE75F23C6N supports communications protocol bridging applications including legacy-to-Ethernet conversion, custom serial protocol implementation, and telecom framer/phyter integration. Its 75,408 LEs can implement multiple UART, SPI, I2C, and custom protocol bridges simultaneously, with embedded memory buffers for packet reassembly. The dedicated PLL blocks and global clock network support the timing precision required for protocols like I2S, TDM, and basic Ethernet MAC layers (10/100 Mbps). The Cyclone IV E family's transceiverless architecture makes it suitable for short-reach backplane bridging applications.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23C6N | EP4CE40F23C6N | EP4CE75F23C8N | EP4CE115F23C8N | EP4CE75F23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA |
| Logic Elements | 75,408 | 55,856 | 39,600 | 75,408 | 114,480 | 75,408 |
| Embedded Memory (bits) | 2,810,880 | 2,343,398 | 1,134,000 | 2,810,880 | 3,981,312 | 2,810,880 |
| User I/O Count | 292 | 324 | 223 | 292 | 280 | 292 |
| Speed Grade | C6 (fastest) | C6 | C6 | C8 | C8 | C7 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Higher logic density than EP4CE40F23C6N at same footprint (vs EP4CE40F23C6N)
- Faster speed grade than EP4CE75F23C8N at same price tier (vs EP4CE75F23C8N)
- More cost-effective than EP4CE115F23C8N for moderate-density designs (vs EP4CE115F23C8N)
- Mature Cyclone IV E toolchain support (vs Cyclone V E family)
Design Notes
Estimated: The EP4CE75F23C6N core draws approximately 0.5-1.5 W depending on utilization and clock frequency. Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package ball, plus bulk 10-47 uF tantalum or polymer capacitors on each supply rail. Use a ferrite bead between the bulk and local capacitors for the PLL analog supply (VCC_PLL) to minimize jitter. For DDR2 memory interface designs, isolate VCCIO of the memory bank with its own regulator to maintain 1.8 V tolerance under load transients.
The 484-FBGA package uses a 1.0 mm ball pitch with FineLine BGA configuration, which allows trace escape on a standard 4-layer PCB but requires microvia or via-in-pad technology for optimal routing. Route all differential pairs (LVDS, DDR DQS) with 100 ohm differential impedance and matched trace lengths within 50 mil. Use Intel's Cyclone IV E board design guidelines for layer stackup recommendations - typically an 8-layer stackup with dedicated ground and power planes is recommended for high-speed DDR interfaces. Place configuration memory (EPCS device) within 1 inch of the FPGA's AS configuration pins.
Estimated: The 484-FBGA package has a theta_JA of approximately 18-22 C/W with proper PCB thermal vias under the package center ground balls. For sustained 100% utilization at 200 MHz internal clock, expect junction temperature rise of 20-30 C above ambient without airflow. In enclosed industrial enclosures, provide at least 200 LFM airflow or attach a small heatsink via thermal interface material to the package top. For -40C to +100C industrial temperature grade (I-suffix OPNs), derate maximum clock frequency by 15-20% to maintain timing closure across the full temperature range.
Critical pitfalls to avoid: (1) Do not leave unused I/O pins floating - configure them as inputs with weak pull-up or as outputs driving ground per Cyclone IV E handbook recommendations. (2) The CONFIG_DONE pin must be pulled high with a 10 kohm resistor; if left floating, the device will not signal successful configuration. (3) MSEL pins must be hardwired to the correct values for the desired configuration mode (AS, PS, JTAG) - incorrect MSEL values cause configuration failures. (4) When migrating designs between Cyclone IV E OPNs of different densities, verify pin assignments carefully; while F23-package devices share ballouts, I/O bank compositions may differ.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified; commercial temperature grade (0C to +85C). For automotive applications requiring -40C to +100C or -40C to +125C operation, select I-suffix (industrial) or A-suffix (automotive) OPN variants in the same F23 package.
