EP4CGX110CF23I7 - Cyclone IV GX FPGA 109K LE, 484-FBGA | Intel
MPN: EP4CGX110CF23I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $413.18 | $413.18 |
| 10 | $396.45 | $3,964.50 |
| 100 | $372.1 | $37,210.00 |
| 250 | $354.8 | $88,700.00 |
| 500 | $338.55 | $169,275.00 |
EP4CGX110CF23I7 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy below ASICs in NRE cost and above discrete logic in integration density, enabling parallel hardware implementation of DSP, packet processing, video pipelines, and custom glue logic on a single chip.
Key features of the EP4CGX110CF23I7 include eight integrated 3.125 Gbps transceivers supporting CPRI, PCIe Gen1, GBE, and SRIO protocols; up to 4.56 Mbits of block RAM (M9K blocks); 66 embedded 18x18 multipliers for DSP; 8 input PLLs supporting frequency synthesis and clock networking; and 270 user I/O with 1.2/2.5/3.3 V LVCMOS/LVDS support via per-bank reference voltages. The F23 484-pin BGA exposes four transceiver channels on each of two banks.
Typical applications include industrial motor control and factory automation, automotive driver-assist pre-processing, wireless baseband DSP, video surveillance with on-chip image processing, and low-cost PCIe-over-cable aggregation. The integrated transceivers eliminate external PHY cost for sub-3 Gbps links, while the low-power process enables fanless industrial deployments.
When designing with this device, plan power sequencing for VCCINT (1.2 V) before VCCAUX (2.5 V) and VCCIO, and follow Intel's PCB layout guide for BGA fan-out and decoupling. Quartus Prime provides free Web Edition support for this family.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP4CGX110CF23I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110CF23I7 (same form factor and footprint) — differing in Package, Speed Grade, PLLs, Operating Temperature, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX110CF23I7N
✅ Drop-In✓ In Stock
$1650.08 / Unit
View Datasheet →EP4CGX110CF23C8N
✅ Drop-In✓ In Stock
$178.9 / Unit
View Datasheet →EP4CGX110CF23C8
✅ Drop-In✓ In Stock
$132.75 / Unit
View Datasheet →EP4CGX110CF23C7N
✅ Drop-In✓ In Stock
$89.12 / Unit
View Datasheet →EP4CGX110CF23C7
✅ Drop-In✓ In Stock
$224.84 / Unit
View Datasheet →EP4CE75F23I7N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP4CGX150CF23I7N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP4CGX110CF23I7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements (LE) | 109,424 |
| Embedded Memory Bits | 5,621,760 bits |
| Embedded 18x18 Multipliers | 66 |
| User I/O | 270 |
| Transceivers | 8 channels up to 3.125 Gbps |
| PLLs | 8 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 60 nm low-power |
| Package | 484-pin FBGA (F23) |
| Operating Temperature | -40C to +100C (industrial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4CGX110CF23I7 484-pin fbga (f23) Pin Configuration Guide
Pin configuration for EP4CGX110CF23I7 (484-pin fbga (f23) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110CF23I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110CF23I7 is suitable for 6 applications: Industrial Motor Control, Wireless Baseband DSP, Video Surveillance Processing, Automotive Driver-Assist Pre-Processing, PCIe-over-Cable Aggregation, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CGX110CF23I7 fits industrial motor control and drives because its 66 embedded 18x18 multipliers deliver the parallel DSP throughput required for field-oriented control (FOC) algorithms, while the 270 user I/O support multiple encoder inputs (QEP, SSI), PWM outputs for three-phase inverters, and galvanically-isolated communication interfaces. The eight integrated 3.125 Gbps transceivers enable EtherCAT, Profinet IRT, or SERCOS III master connectivity at industrial automation protocol data rates. Industrial grade -40C to +100C operation allows deployment in unheated cabinets and outdoor enclosures. Compared to discrete DSP plus CPLD implementations, integrating motor control logic and communication protocol stacks on one FPGA reduces board area by 40-60% and simplifies firmware version management across product variants.
Recommended
Wireless Baseband DSP
The EP4CGX110CF23I7 supports wireless baseband processing for small-cell and pico-cell base stations where its 66 hardware multipliers and 5.6 Mbits of block RAM handle the uplink/downlink channel processing, FFT/iFFT operations, and channel estimation at sub-20 MHz bandwidths. The integrated 3.125 Gbps transceivers connect directly to ADC/DAC JESD204B lanes or CPRI fronthaul links to a baseband unit, eliminating external PHY cost. Compared to DSP processors running the same algorithms, the FPGA achieves 5-10x higher throughput per watt by exploiting parallel architecture. The 109K logic element budget supports full PHY-MAC integration for proprietary industrial wireless protocols, enabling single-chip radio modems.
Recommended
Video Surveillance Processing
The EP4CGX110CF23I7 is well-matched to HD video surveillance applications because its 109K logic elements can implement multi-channel H.264 encoding pipelines, motion detection, and video analytics simultaneously. The 3.125 Gbps transceivers accept serialized camera sensor inputs (MIPI CSI-2 over FPGA bridge, SLVS-EC) at gigabit rates, while the abundant block RAM (5.6 Mbits) buffers line and frame data without external memory pressure for standard resolutions. Compared to application processors with built-in video engines, the FPGA allows custom analytics algorithms, lower latency, and long-term parts availability. The 270 user I/O supports multiple parallel camera interfaces, network uplinks, and storage interfaces in a single device.
Recommended
Automotive Driver-Assist Pre-Processing
The EP4CGX110CF23I7 supports pre-processing pipelines for advanced driver-assistance systems (ADAS) where its hardware multipliers implement radar FFT and beamforming, while logic elements handle sensor fusion state machines and CAN/LIN gateway logic. The 3.125 Gbps transceivers accept serialized automotive Ethernet (100BASE-T1, 1000BASE-T1) inputs from radar and camera modules. Note that for AEC-Q100 qualified automotive applications, dedicated automotive-grade variants should be evaluated; the industrial -40C to +100C temperature rating supports non-safety-critical ADAS pre-processing in cabin-mounted ECUs. The 270 user I/O enables connection to multiple sensor modules and vehicle bus networks.
Recommended
PCIe-over-Cable Aggregation
The EP4CGX110CF23I7 implements low-cost PCIe-over-cable aggregation systems where its integrated 3.125 Gbps transceivers support PCIe Gen1 endpoints and the logic elements implement PCIe Transaction Layer, Data Link Layer, and protocol tunneling logic. Compared to discrete PCIe switch ICs, the FPGA enables proprietary compression and aggregation across multiple cable links. The 270 user I/O connect to multiple cable interface connectors and sideband signals, while block RAM buffers transaction layer packets. This architecture is common in industrial machine vision, broadcast video transport, and remote storage extension applications where standard PCIe over copper cabling is impractical.
Recommended
Test and Measurement Instrumentation
The EP4CGX110CF23I7 fits portable test and measurement instruments because its 66 18x18 multipliers implement real-time DSP (FIR filters, FFT, correlation) for signal analysis, while the 270 user I/O drive LCD displays, keypads, and analog front-end interfaces. The 3.125 Gbps transceivers enable high-speed serial data acquisition from ATE fixtures or protocol analyzers. The 109K logic elements support custom protocol decoders for proprietary bus standards and instrument-specific calibration logic. Compared to DSP processors, the FPGA delivers deterministic latency for closed-loop measurement applications and parallel execution of multiple measurement channels simultaneously within a single device.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110CF23I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110CF23I7N | EP4CGX110CF23C8N | EP4CGX110CF23C8 | EP4CGX110CF23C7N | EP4CGX110CF23C7 | EP4CE75F23I7N | EP4CGX150CF23I7N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin FBGA (F23) | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same | 484-pin FBGA (F23) - same |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 75,408 (-31%) | 149,760 (+37%) |
| Embedded Memory (bits) | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 3,743,640 (-33%) | 6,528,000 (+16%) |
| Transceivers | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 8x 3.125 Gbps | 0 (Cyclone IV E, no transceivers) | 8x 3.125 Gbps |
| User I/O | 270 | 270 | 270 | 270 | 270 | 270 | 296 (+10%) | 270 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 7 | 7 | 8 | 8 | 7 | 7 | 7 | 7 |
Key Differentiators
- Industrial temperature grade with same F23 package (vs EP4CGX110CF23C8N)
- Higher logic density than Cyclone IV E equivalent (vs EP4CE75F23I7N)
- Lower cost than EP4CGX150 with sufficient density for many designs (vs EP4CGX150CF23I7N)
Design Notes
Estimated: Cyclone IV GX power analysis requires Quartus PowerPlay with your design utilization. For a typical 75% utilization design with 4 active transceivers at 2.5 Gbps, total power consumption is approximately 3-5W. Follow Intel's power sequencing requirements: VCCINT (1.2V) must ramp before VCCAUX (2.5V), and VCCAUX must ramp before or with VCCIO. Use a sequencer IC or discrete RC delay circuit to ensure monotonic power-up. Decoupling requires 100nF ceramic capacitors within 100 mils of every VCCINT pin, plus 10uF bulk capacitors per power rail.
The 484-pin FBGA package has 1.0 mm ball pitch requiring either 4-layer PCB with microvia HDI stack-up (preferred for production) or 6-layer conventional stack-up with 8-mil laser-drilled vias. Follow Intel's BGA breakout routing guidelines: use 4-mil trace width with 4-mil spacing for escape routing, and maintain 100-ohm differential impedance for transceiver lanes. The PCB substrate material should be high-Tg FR4 (Tg >= 170C) for industrial temperature reliability. Thermal vias beneath the package center pad are required for heat dissipation.
Transceiver channel placement is critical: assign the highest-speed lanes to GXB channels closest to the package edge to minimize PCB trace length and crosstalk. Maintain 100-ohm differential impedance with controlled-length matching within 0.15mm for lane-to-lane skew. AC-coupling capacitors (0.01uF) must be placed within 250 mils of the receiver pins. For multi-lane protocols like PCIe Gen1, follow Intel's reference design pinout for lane-to-channel mapping. Global clock routing should use dedicated clock input pins with matched-length routing to all PLL inputs.
Common design pitfalls include: (1) Insufficient decoupling causing PLL jitter and transceiver link errors - place 100nF caps within 100 mils of every power pin; (2) Incorrect JTAG chain configuration preventing configuration - include a JTAG header even if using passive serial configuration; (3) Wrong MSEL pin settings selecting incompatible configuration scheme - consult the Cyclone IV GX configuration handbook; (4) Ignoring the POR (power-on reset) delay of approximately 5ms - ensure downstream devices hold reset during this period; (5) Using generic BGA PCB footprints - always use the exact footprint from Intel's package specification including NSMD or SMD pad geometry.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial temperature grade supports -40C to +100C operation. Not AEC-Q100 qualified; for automotive safety applications, evaluate dedicated automotive-grade variants or Cyclone IV Auto families.
