EP4CE75F23I8LN - 75K LE Cyclone IV E FPGA 484-BGA | Intel
MPN: EP4CE75F23I8LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $213.75 | $53,437.50 |
| 500 | $199.5 | $99,750.00 |
EP4CE75F23I8LN Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement arbitrary digital functions. The Cyclone IV E belongs to the FPGA family hierarchy: programmable logic -> FPGA -> low-cost FPGA -> Cyclone series -> Cyclone IV generation -> Cyclone IV E sub-family. Its position in this taxonomy means it is optimized for high-volume, power-sensitive designs rather than the highest raw performance, with logic density and DSP capability emphasized over transceiver bandwidth.
Key features of the EP4CE75F23I8LN include 75,408 logic elements, 4,608 Kbits (M9K) of embedded memory, 244 embedded 18 x 18 multipliers for DSP functions, four general-purpose PLLs, and 292 maximum user I/Os. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards, enabling interface to DDR/DDR2 SDRAM, QDRII SRAM, and common parallel buses. Configuration is supported through JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes, allowing flexible in-system programming.
From an architecture standpoint, the Cyclone IV E family uses an LUT-based fabric with embedded M9K memory blocks and dedicated multiplier blocks, balanced to deliver high DSP throughput at low static and dynamic power. The internal core is organized into Logic Array Blocks (LABs) with routing that is automatically placed and routed by Intel Quartus II (now Intel Quartus Prime) software, with timing closure supported up to several hundred MHz on internal logic paths.
Typical applications include industrial motor control, video processing and image pipelines, low-cost software-defined radio front ends, PCIe endpoint bridges, and ASIC/ASSP prototyping where high logic density and DSP capability are required without the cost of high-end FPGAs. The industrial temperature grade makes it suitable for factory automation and outdoor equipment.
When designing with the EP4CE75F23I8LN, plan power sequencing and decoupling carefully: each of the four PLL analog supplies requires a dedicated ferrite bead and 0.1 uF / 10 uF decoupling, and the 484-ball FBGA package demands a multilayer PCB with microvia or via-in-pad stack-up to break out the 1.0 mm pitch ball array. Use the Quartus PowerPlay analyzer to estimate junction temperature before committing to the layout.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone IV E family, and practical PCB design notes that are not duplicated in the manufacturer datasheet.
Drop-in alternatives for EP4CE75F23I8LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23I8LN (same form factor and footprint) — differing in Package, Family, Embedded 18x18 Multipliers, Process Technology, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE75F23I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$118 / Unit
View Datasheet →EP4CE75F23I8L
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$213.3 / Unit
View Datasheet →EP4CE75F23C8LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$108.5 / Unit
View Datasheet →EP4CE75F23C9LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$139.85 / Unit
View Datasheet →EP4CE75F23C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$136.85 / Unit
View Datasheet →EP4CE75F23I8LN Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | Cyclone IV E (EP4CE75) |
| Logic Elements (LE) | 75,408 |
| Embedded Memory (M9K blocks) | 305 blocks |
| Embedded Memory (bits) | 2,810,880 bits |
| Embedded 18 x 18 Multipliers | 244 |
| General-purpose PLLs | 4 |
| Maximum User I/Os | 292 |
| User I/O Banks | 8 |
| Package | 484-ball FBGA (F23) 1.0 mm pitch |
| Supply Voltage - Core | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS Status | Compliant |
| MSL Level | 3 |
EP4CE75F23I8LN 484-ball fbga (f23) 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE75F23I8LN (484-ball fbga (f23) 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F23I8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F23I8LN is suitable for 6 applications: Industrial Motor Control and Drive, Video Bridging and Image Processing Pipeline, ASIC Prototyping and Emulation Platform, Industrial Communication Gateways, Software-Defined Radio Front-End, Test and Measurement Instrumentation.
Industrial Motor Control and Drive
The EP4CE75F23I8LN fits industrial motor control because its 244 dedicated 18x18 multipliers and 305 M9K memory blocks deliver real-time field-oriented control (FOC) loops at switching frequencies above 20 kHz without external DSP. The 292 user I/Os in 8 banks provide simultaneous PWM channels for three-phase inverters, encoder feedback (QEP), and resolver excitation sampling. Industrial -40C to +100C temperature grade supports cabinet-mounted drives and outdoor equipment. Designers place the FPGA between the MCU host and the IGBT/MOSFET gate driver, using the on-chip PLLs to derive the PWM carrier from an external crystal. Compared with a software-DSP MCU, the FPGA removes one interrupt latency layer and reduces torque ripple at low speed.
Recommended
Video Bridging and Image Processing Pipeline
The EP4CE75F23I8LN handles HDMI-to-MIPI, dual-camera stitching, and real-time image preprocessing at 1080p60 because its 244 hardware multipliers accelerate 2D convolution, color-space conversion, and scaling kernels. The 2.8 Mbit embedded memory buffers full HD scan lines without external SRAM, simplifying PCB and BOM. Its 8 I/O banks support mixed-voltage LVCMOS/LVDS interfaces to image sensors and display panels simultaneously. The device is placed at the heart of a video capture card, with DDR2 SDRAM attached via the FPGA's dedicated DQS pins for frame buffering. Compared with an ASSP video bridge, the FPGA enables protocol- and resolution-agnostic firmware updates via JTAG without respinning the PCB.
Recommended
ASIC Prototyping and Emulation Platform
The EP4CE75F23I8LN fits small ASIC and ASSP prototyping because its 75,408 logic elements, 305 M9K blocks, and 244 DSP blocks map most mid-complexity ASIC RTL blocks one-to-one onto FPGA primitives. Designers partition the ASIC into clock domains and verify them with realistic timing paths inside the FPGA before tape-out. The 4 PLLs allow multiple ASIC clock domains to be replicated on-chip, and the 292 user I/Os expose all internal ASIC buses for bench observation. Industrial temperature grade enables prototype bring-up on extended-temperature test fixtures. Compared with high-end prototyping FPGAs, the EP4CE75F23I8LN delivers the lowest per-unit prototyping cost, ideal for A-rev silicon verification on budget-constrained programs.
Recommended
Industrial Communication Gateways
The EP4CE75F23I8LN suits multi-protocol industrial gateways (EtherCAT, PROFINET, EtherNet/IP, Modbus TCP) because its embedded 18x18 multipliers handle CRC and checksum acceleration, and the 2.8 Mbit embedded memory supports frame buffers for cut-through switching. Its 292 I/Os map to dual MII/RGMII PHYs, RS-485 transceivers, and CAN-FD controllers in parallel. Industrial -40C to +100C operation tolerates factory floor temperature swings. The device sits between the upstream Ethernet switch and downstream fieldbus slaves, providing protocol conversion with sub-microsecond latency. Compared with a soft-CPU MCU gateway, the FPGA offloads wire-speed protocol processing and frees the MCU for diagnostics and configuration.
Recommended
Software-Defined Radio Front-End
The EP4CE75F23I8LN performs DDC/DUC, channelization, and modulation/demodulation in low-cost SDR platforms because its 244 18x18 multipliers support parallel FIR filtering and FFT butterfly operations at baseband sample rates up to ~80 MSPS. The 305 M9K memory blocks store NCO lookup tables, channelization coefficients, and short sample windows without external SRAM. The 4 PLLs synthesize the ADC/DAC sample clocks and IF LO. Designers place the FPGA between the RF ADC/DAC and the host processor (USB 3.0 or PCIe link). Compared with a fixed-function DSP, the FPGA enables protocol-agnostic waveform updates via JTAG, supporting evolving SDR standards in research and tactical-radio prototypes.
Recommended
Test and Measurement Instrumentation
The EP4CE75F23I8LN fits bench instruments (logic analyzers, pattern generators, protocol analyzers) because its 292 user I/Os implement multi-channel acquisition or stimulus at rates up to 200 MHz LVDS, and the 244 multipliers accelerate real-time protocol decoding. The 2.8 Mbit embedded memory captures deep trace buffers without requiring large external SRAM. Industrial temperature grade supports portable and field-test instruments. The device serves as the central FPGA between the probe front-end and the host PC or display. Compared with a discrete MCU + CPLD architecture, the EP4CE75F23I8LN consolidates acquisition, triggering, and pattern generation in a single reprogrammable device, simplifying firmware updates.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23I8LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F23I7N | EP4CE75F23I8L | EP4CE75F23C8LN | EP4CE75F23C9LN | EP4CE75F23C7N |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (F23) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 | 75,408 |
| Embedded Memory | 2,810,880 bits (305 M9K) | 2,810,880 bits (305 M9K) | 2,810,880 bits (305 M9K) | 2,810,880 bits (305 M9K) | 2,810,880 bits (305 M9K) | 2,810,880 bits (305 M9K) |
| 18x18 Multipliers | 244 | 244 | 244 | 244 | 244 | 244 |
| Maximum User I/Os | 292 | 292 | 292 | 292 | 292 | 292 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I8 (industrial) | I7 (faster industrial) | I8 (industrial) | C8 (commercial) | C9 (slower commercial) | C7 (faster commercial) |
| RoHS Compliance | Yes (N suffix) | Yes (N suffix) | No (leaded variant) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Key Differentiators
- Largest Cyclone IV E with true F23 FBGA-484 pin compatibility within its density class (vs EP4CE55F23I8LN)
- Faster industrial speed grade option exists in same package (vs EP4CE75F23I7N)
- RoHS compliant (N suffix) variant for EU/global markets (vs EP4CE75F23I8L)
Design Notes
The EP4CE75F23I8LN's 484-ball FBGA package uses 1.0 mm ball pitch, which requires a multilayer PCB with microvia or via-in-pad stack-up. Per Cyclone IV hardware design guidelines, route all signal escapes on inner layers with HDI microvias, and assign one full PCB layer to a solid ground pour directly beneath the BGA for thermal dissipation. Failure to provide adequate breakout and thermal vias will result in signal-integrity issues at >100 MHz and junction-temperature derating above 1.5 W dissipation.
Power the EP4CE75F23I8LN from a four-rail supply: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCD_PLL (1.2 V PLL digital), and VCCIO (per-bank, 1.2 V to 3.3 V depending on I/O standard). Each PLL analog supply requires an isolated ferrite bead and a 0.1 uF + 10 uF decoupling network placed within 5 mm of the ball. Per Cyclone IV pin connection guidelines, all VCC and GND balls must be connected, even unused ones, to maintain mechanical and thermal integrity.
Do not assume the EP4CE75F23I8LN is pin-compatible with the EP4CE115F23I8LN despite the shared F23 FBGA-484 footprint - the larger EP4CE115 die uses different I/O assignments in the same package. Per Intel's Cyclone IV pin compatibility matrix, only the EP4CE75 family and lower-density devices (EP4CE40, EP4CE55, EP4CE30) share the F23 ball-out, while the EP4CE115 in F23 is NOT pin-compatible. Always cross-reference the exact pin-out table from the Cyclone IV device handbook before PCB fabrication.
Estimated: the FBGA-484 package junction-to-ambient thermal resistance (theta_JA) is approximately 15 C/W with a properly soldered thermal pad to a 4-layer PCB with 1 oz copper pours. For a typical 2 W design, junction temperature rises ~30 C above ambient; at 85 C ambient this gives ~115 C junction - within the 100 C industrial limit. Per Cyclone IV reliability guidelines, use the Quartus PowerPlay Power Analyzer to estimate worst-case dissipation before committing to PCB copper-area decisions.
Compliance Information
RoHS compliant per Intel Cyclone IV E material declaration (N suffix denotes Pb-free). Not AEC-Q100 qualified; for automotive designs consult the Cyclone IV automotive-grade family. Halogen-free status not confirmed in the verified web data.
