EP4CGX110DF27C7 - Cyclone IV GX FPGA, 110K LE, 672-BGA | Intel
MPN: EP4CGX110DF27C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $382.17 | $382.17 |
| 10 | $362 | $3,620.00 |
| 100 | $320 | $32,000.00 |
| 250 | $295 | $73,750.00 |
| 500 | $272.5 | $136,250.00 |
EP4CGX110DF27C7 Overview
FPGAs are user-programmable semiconductor devices built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, block RAM, and DSP slices. Within the broader IC hierarchy, an FPGA sits between general-purpose processors and fixed-function ASICs, offering higher performance than software on a CPU and lower NRE cost than a full custom ASIC for medium-volume production. The Cyclone IV GX family specifically targets cost-sensitive applications needing 3.125 Gbps transceivers without the power or price of high-end Stratix-class parts.
Key specifications include a 1.2 V core supply with hot-socketing support, 56 embedded 18 x 18 multipliers, 4 PLLs, and 8 transceiver channels capable of protocols such as PCIe Gen1, Gigabit Ethernet, CPRI, and Serial RapidIO. The C7 speed grade balances Fmax against static power and is rated for commercial 0 C to +85 C ambient operation. The device supports configuration via active serial, passive serial, fast passive parallel, and JTAG modes.
Architecturally, the EP4CGX110 uses a 60 nm low-power process and shares the same Quartus II/Quartus Prime design flow as other Cyclone IV variants, simplifying IP reuse across Cyclone IV E and Cyclone IV GX designs. Engineers can leverage existing reference designs for PCIe endpoints, DDR2/DDR3 controllers, and 10/100/1000 Ethernet MACs.
Typical applications include industrial video broadcast equipment, low-cost PCIe add-in cards, motor control and industrial automation backplanes, wireless remote-radio-head (RRH) baseband pre-processing, and handheld test instrumentation. The integrated transceivers eliminate external PHY ICs in many designs.
Design tip: the 672-ball BGA requires careful PCB stack-up planning, with matched-length differential pairs for the eight transceiver lanes and a continuous GND reference plane beneath the BGA footprint for signal integrity and thermal dissipation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus-driven design notes not bundled into the manufacturer datasheet.
Drop-in alternatives for EP4CGX110DF27C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF27C7 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Transceiver Data Rate.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX110DF27C8
✅ Drop-In✓ In Stock
$225.4 / Unit
View Datasheet →EP4CGX110DF27I7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP4CGX110DF27C6N
✅ Drop-In✓ In Stock
$119.9 / Unit
View Datasheet →EP4CGX110DF27C7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Logic Elements (LE) | 109,424 |
| Embedded Memory Bits | 5,621,760 |
| Maximum User I/O | 393 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Transceiver Channels | 8 |
| Transceiver Data Rate (max) | 3.125 Gbps |
| Core Supply Voltage | 1.2 V |
| Speed Grade | C7 |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Package | 672-ball FBGA (F27), 27 mm |
| Process Node | 60 nm low-power |
| Configuration Methods | AS, PS, FPP, JTAG |
| RoHS Status | Compliant |
EP4CGX110DF27C7 672-ball fbga (f27), 27 mm Pin Configuration Guide
Pin configuration for EP4CGX110DF27C7 (672-ball fbga (f27), 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF27C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF27C7 is suitable for 6 applications: Industrial Video Broadcast Equipment, Low-Cost PCIe Gen1 Endpoint Card, Wireless Remote Radio Head (RRH) Baseband Pre-Processing, Industrial Motor Control and Automation, Handheld Test and Measurement Instrumentation, Gigabit Ethernet Aggregation / Switch Line Card.
Industrial Video Broadcast Equipment
The EP4CGX110DF27C7 is well suited for SDI/HD-SDI broadcast routers and video format converters requiring up to 3.125 Gbps serial links. Its 8 transceivers drive multiple SDI channels with hardware 8B/10B encoding, while the 109,424 logic elements provide headroom for color-space conversion, scaling, and overlay processing. The 1.2 V core and 60 nm low-power process keep board thermal load manageable in 1U broadcast frames where airflow is restricted.
Recommended
Low-Cost PCIe Gen1 Endpoint Card
With 8 integrated transceivers and hard PCIe Gen1 IP, the EP4CGX110DF27C7 enables a single-chip PCIe x1/x4 endpoint without external PHY. The 672-ball BGA exposes the 4-lane PCIe interface plus side-band signals, while 56 embedded 18x18 multipliers accelerate DSP pre-processing. This suits low-volume industrial capture cards, data acquisition, and FPGA-based coprocessor designs where a discrete PCIe PHY would add cost.
Recommended
Wireless Remote Radio Head (RRH) Baseband Pre-Processing
The EP4CGX110DF27C7's 8 CPRI-capable transceivers at 3.072 Gbps and 56 DSP multipliers make it a fit for RRH fronthaul pre-processing, including uplink crest-factor reduction (CFR) and digital predistortion (DPD). The 109K LE budget holds real-time DPD lookup tables, while the 5.6 Mbits of block RAM buffer sub-frame samples. Commercial C7 temperature rating fits outdoor cabinet designs with sealed enclosures.
Recommended
Industrial Motor Control and Automation
The EP4CGX110DF27C7 supports multi-axis motor control with its 56 hardware multipliers for Park/Clarke transforms, SVPWM, and field-oriented control (FOC) loops. The 8 transceivers connect to multi-axis encoder feedback via EnDat or BiSS protocols, while 393 user I/O drive PWM channels and GPIO. The commercial C7 temperature grade suits factory-floor enclosures; for harsher environments the I7N speed grade drop-in extends range to -40 C.
Recommended
Handheld Test and Measurement Instrumentation
The EP4CGX110DF27C7's low static power from the 60 nm process and 1.2 V core make it appropriate for portable oscilloscopes, logic analyzers, and protocol analyzers. The 8 transceivers support USB 3.0 PHY bridging, Ethernet, or serial protocol triggering, while 5.6 Mbits of embedded memory capture deep waveform traces. Quartus II support and mature reference designs shorten development cycles for low-volume T&M products.
Recommended
Gigabit Ethernet Aggregation / Switch Line Card
The EP4CGX110DF27C7 integrates 8 transceivers capable of SGMII / 1000BASE-X, supporting up to 8 Gigabit Ethernet ports plus an uplink with hardware 8B/10B encoding. The 109K LE holds custom packet classification and QoS logic, while 5.6 Mbits of block RAM buffer statistics counters. The 672-ball BGA provides more than enough I/O for 8 SFP cages, MDIO, I2C management, and board-level GPIO.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF27C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF27C8 | EP4CGX110DF27I7N | EP4CGX110DF27C6N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|
| Package | 672-BGA (F27) 27 mm | 672-BGA (F27) 27 mm - same | 672-BGA (F27) 27 mm - same | 672-BGA (F27) 27 mm - same | 484-BGA (F23) - different |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C7 | C8 (faster) | I7 | C6 (slower) | I7 |
| Temperature Range | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Transceivers | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 |
| Lead-Free / RoHS | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Key Differentiators
- Largest Cyclone IV GX device in 672-ball BGA, maximum logic density (vs EP4CGX110DF23I7N)
- Faster Fmax than C6 in same package (vs EP4CGX110DF27C6N)
- Commercial temperature versus industrial I7N substitute (vs EP4CGX110DF27I7N)
Design Notes
Estimated: The 672-ball F27 BGA at 1.0 mm ball pitch requires a minimum 4-layer PCB stack-up with a continuous GND plane directly beneath the BGA footprint. Use 0.5 oz copper on outer layers with microvia-in-pad if BGA pitch drops below 1.0 mm. Route 100 ohm differential pairs for the 8 transceiver lanes with intra-pair skew under 1 ps and length matching to within 5 mil across all 8 channels.
Cyclone IV GX requires 1.2 V core, 2.5 V auxiliary, 3.0 V or 3.3 V I/O banks, and separate PLL analog supplies. Use a TI or Linear Technology point-of-load regulator per rail; decouple each supply pin with 0.1 uF and 10 uF ceramic caps placed within 100 mil of the pin. Power-on-reset (POR) requires each rail to ramp within 50 ms of the others to avoid configuration failure.
Estimated: At 100% utilization of 56 multipliers and 8 transceivers at 3.125 Gbps, the EP4CGX110DF27C7 dissipates approximately 4-6 W. With 672-ball BGA theta-JA of approximately 15 C/W (still air, JEDEC test board), expect 60-90 C junction-to-ambient rise. Mount the device on a 4-layer board with a 1 oz copper ground pour and consider a small heatsink or forced-air cooling for closed-enclosure designs.
Do not apply non-zero VCC before VCCAUX or VCCD_PLL - this violates Intel power-sequencing requirements and risks long-term reliability damage. Configure unused transceiver channels to enable power-down via Quartus fitter settings; otherwise leakage adds 100 mW per active channel. Ensure the CONF_DONE pin pulls high correctly before exiting configuration mode.
Transceiver reference clock input pins require a 100 ohm differential source termination as close as possible to the FPGA pin. Keep reference clock traces within 200 mil and away from switching signals. For PCIe Gen1 implementations, the 100 MHz reference clock must be PCIe-compliant; use a dedicated clock buffer like the CDCV304.
Compliance Information
RoHS compliant and lead-free per distributor listings. Commercial temperature grade (C7); use I7N for industrial applications. No AEC-Q100 grade available in the Cyclone IV GX family.
