EP4SGX110FF35C4G - Stratix IV GX FPGA 110K LE 9.7Mbit | Intel
MPN: EP4SGX110FF35C4G β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2988.22 | $2,988.22 |
| 10 | $2850 | $28,500.00 |
| 50 | $2680 | $134,000.00 |
| 100 | $2520 | $252,000.00 |
| 250 | $2400 | $600,000.00 |
EP4SGX110FF35C4G Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. Within the broader taxonomy, this part belongs to the FPGA family, which itself sits inside programmable logic devices (PLD), which are a subset of integrated circuits (ICs) under the semiconductor hierarchy. The Stratix IV GX sub-family adds integrated multi-gigabit transceivers (MGT) for serial connectivity, separating it from general-purpose Stratix IV non-GX variants and from Cyclone-series cost-optimized FPGAs.
Key specifications of the EP4SGX110FF35C4G include 105,600 logic elements, 9,793,536 bits of embedded RAM distributed across 372 RAM blocks, 372 user I/O pins, 8 integrated transceivers supporting data rates up to 3.125 Gbps (C4 speed grade), and 288 dedicated hardware multipliers for DSP. The 1152-ball FCBGA package exposes the high I/O count and enables dense board placement with controlled-impedance escape routing. The device operates across commercial and industrial temperature grades depending on the speed/order code suffix.
Architecturally, the Stratix IV GX uses Adaptive Logic Modules (ALMs), each containing a fracturable 8-input look-up table (LUT), two dedicated adders, and four registers, which gives the device a fine-grained compute fabric. The transceivers support multiple serial protocols including PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, CPRI, and OBSAI, while the DSP blocks (variable-precision 18x18 multipliers) accelerate filtering and FFT operations used in wireless baseband, radar, and instrumentation.
Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial interface bridging (PCIe, SRIO, GbE), radar and electronic warfare signal chains, high-performance DSP for test and measurement, and ASIC prototyping for communications SoCs. The combination of transceivers and DSP blocks makes it a fit where both wire-speed serial I/O and deterministic compute are needed on a single die.
When designing with this part, plan PCB layout for 1152-ball FCBGA escape routing, allocate sufficient decoupling across the multiple supply rails (VCC, VCCPT, VCCA, VCCP, VCCH_GXB), and use Intel Quartus II (legacy) or Quartus Prime to capture pin assignments, transceivers, and timing constraints. Configuration schemes include fast passive parallel (FPP), active serial (AS), and JTAG. This page synthesizes distributor availability, same-family and cross-brand drop-in equivalents, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP4SGX110FF35C4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110FF35C4G (same form factor and footprint) β differing in Package, Speed Grade, Embedded Memory, RoHS Status, Family.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX110FF35C3G
β Drop-Inβ In Stock
$1960 / Unit
View Datasheet βEP4SGX110FF35C2XG
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP4SGX110FF35C4G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 105,600 |
| Embedded Memory | 9,793,536 bits (372 RAM blocks) |
| User I/O Count | 372 |
| Number of Transceivers | 8 (C4 speed grade, up to 3.125 Gbps) |
| DSP Hardware Multipliers | 288 (18x18) |
| Package | 1152-ball FCBGA (FF35, 35x35 mm) |
| Speed Grade | C4 |
| Operating Temperature | 0C to +85C (commercial) |
| Process Node | 40 nm |
| Supply Voltage | Multi-rail (VCC, VCCPT, VCCA, VCCP, VCCH_GXB) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (G suffix) |
| Configuration Schemes | FPP, AS, JTAG |
EP4SGX110FF35C4G 1152-ball fcbga (ff35, 35x35 mm) Pin Configuration Guide
Pin configuration for EP4SGX110FF35C4G (1152-ball fcbga (ff35, 35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110FF35C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110FF35C4G is suitable for 6 applications: Wireless Baseband Processing, Software-Defined Radio (SDR), PCIe and Serial RapidIO Bridging, Radar and Electronic Warfare Signal Chains, High-Performance DSP for Test & Measurement, ASIC/SoC Prototyping.
Wireless Baseband Processing
The EP4SGX110FF35C4G's combination of 105,600 logic elements, 288 18x18 hardware multipliers, and 8 multi-gigabit transceivers (up to 3.125 Gbps in C4 grade) makes it well suited for wireless baseband signal processing such as LTE and WCDMA channel cards. The 288 DSP blocks deliver the multiply-accumulate throughput needed for chip-rate filtering, FFT/iFFT, and channel estimation, while 9.7 Mbits of embedded memory buffer pre/post-FFT samples between processing stages. The 8 transceivers connect to CPRI/OBSAI links to remote radio heads (RRHs) at typical 3.072 Gbps line rates, enabling the FPGA to act as a single-chip baseband + fronthaul bridge in 3G/4G base-station line cards where latency budgets are tight.
Recommended
Software-Defined Radio (SDR)
Software-defined radio platforms benefit from the EP4SGX110FF35C4G's parallel DSP fabric and flexible transceiver channels. The 8 transceivers can connect directly to a wideband tuner and to backplane Ethernet or Aurora links, while 105,600 LEs implement channelizers, decimators, and modulators/demodulators across multiple waveforms. With 9.7 Mbits of block RAM, designers can stage overlapping FFT windows, channel filter taps, and protocol stacks without off-chip memory. The C4 speed grade is well suited to sub-6 GHz SDR where RF front-ends typically deliver I/Q data at hundreds of MSPS; higher frequency (mmWave) designs would migrate to the C3 sibling.
Recommended
PCIe and Serial RapidIO Bridging
The 8 multi-gigabit transceivers in the EP4SGX110FF35C4G implement PCIe Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) endpoints or root-ports, as well as Serial RapidIO Gen1/Gen2 for embedded compute fabrics. The C4 speed grade comfortably supports PCIe Gen1 line rate with margin, and can be used at PCIe Gen2 with timing-closure analysis. 372 user I/O pins expose sufficient LVDS and general-purpose I/O for parallel buses to ASICs, DSPs, or DDR2/DDR3 memory controllers. Engineers build PCIe-to-DSP, PCIe-to-RapidIO, and PCIe-to-Ethernet bridges on this device as a single-chip connectivity node in telecom line cards and high-end test equipment.
Recommended
Radar and Electronic Warfare Signal Chains
Phased-array radar and electronic-warfare processing both demand streaming DSP, deterministic latency, and high I/O bandwidth - all of which the EP4SGX110FF35C4G provides. 288 18x18 multipliers enable pulse-compression (matched-filter) computation, MTI/MTD filtering, and direction-of-arrival estimation in real time. The 8 transceivers accept digitized RF data at multi-gigabit rates from adjacent ADCs and forward processed tracks via Aurora or GbE to system controllers. 9.7 Mbits of block RAM serve as sample-line buffers between antenna channels and DSP stages, while 105,600 LEs implement the beam-former state machine and adaptive nulling logic. The C4 speed grade suits L/S-band systems; higher bands migrate to the C3 sibling.
Recommended
High-Performance DSP for Test & Measurement
Real-time oscilloscopes, protocol analyzers, and signal generators use FPGAs to sustain multi-GSPS capture rates. The EP4SGX110FF35C4G handles 8 channels of LVDS parallel data from high-speed ADCs, performs real-time FFT, decimation, triggering, and pre-mask computation on 105,600 LEs, and streams processed segments through 8 transceivers to host processors. 9.7 Mbits of embedded memory stage FFT bins and trigger histories with deterministic access latency. C4 speed grade meets timing for ADC rates up to ~1 GSPS on 16-bit interfaces with margin. The 1152-ball FF35 package is appropriate for high-channel-count T&M chassis where 372 user I/O pins interface to front-end ASICs and DDR3 sample buffers.
Recommended
ASIC/SoC Prototyping
Pre-silicon validation of complex ASICs and SoCs demands very high logic density, ample memory, and a rich I/O set. The EP4SGX110FF35C4G provides 105,600 LEs for partial SoC logic, 9.7 Mbits of block RAM for register files and caches, and 372 user I/O pins to fan out to DDR-style buses, peripherals, and bridge ASICs. The 8 transceivers support chip-to-chip SerDes at sub-3.125 Gbps in C4 grade, ideal for early-stage validation where IP may not yet meet final production speeds. Designers partition the target SoC across multiple Stratix IV FPGAs using the same FF35 footprint, enabling the EP4SGX110 to act as the 'glue-logic + I/O' partner to higher-density siblings like EP4SGX230 and EP4SGX530 on multi-FPGA prototypes.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110FF35C4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110FF35C3G | EP4SGX110FF35C2XG | EP4SGX110DF29C4G |
|---|---|---|---|---|
| Package | 1152-ball FCBGA (FF35) | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same | 780-ball FCBGA (DF29) - different |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 |
| Embedded Memory | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits |
| Speed Grade | C4 (transceivers up to 3.125 Gbps) | C3 (transceivers up to 6.375 Gbps) | C2 (transceivers up to 3.125 Gbps, industrial) | C4 (transceivers up to 3.125 Gbps) |
| Transceivers | 8 | 8 (higher speed grade) | 8 (industrial temp) | 8 (different package) |
| User I/O | 372 | 372 | 372 | 372 (DF29 ballout) |
| DSP Blocks (18x18) | 288 | 288 | 288 | 288 |
| Lifecycle | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Mid-density Stratix IV GX with transceiver-rich I/O (vs EP4SGX90FF35C4G)
- Same package as higher-density Stratix IV GX siblings (vs EP4SGX230FF35C3G)
- Higher DSP count than Cyclone IV GX (vs EP4CGX110DF31C8N)
Design Notes
Estimated: the 1152-ball FF35 FCBGA package at 35x35 mm uses a 1.0 mm ball pitch and requires 8-10 layer PCB stack-up with microvia or via-in-pad construction for signal escape. Plan at least 4 routing layers plus dedicated ground/power planes; controlled-impedance (100 ohm diff, 50 ohm se) must be tuned against the stack-up. Decoupling requires 0.1 uF and 0.01 uF ceramics placed within 100 mil of each supply pin, plus bulk caps per rail (VCC, VCCPT, VCCA, VCCP, VCCH_GXB).
Estimated: peak current on VCC (core) at maximum toggle can exceed 4-6 A on this 105K-LE device, while VCCH_GXB transceiver supplies can draw 1-2 A per bank. Designers should budget for a sequencer or rail tracker to enforce VCCPT/VCCA/VCC power-up ordering; incorrect sequencing can latch-up the device. Use Intel's PowerPlay estimator early in design to size the regulator, decoupling, and thermal solution.
Estimated: at industrial workloads the FF35 package's theta_JA of approximately 8-10 C/W with a properly designed thermal via array in the BGA land pattern, plus 200-300 LFM airflow, sustains junction temperature below 85 C. Without airflow, a top-mounted heatsink or cold plate is required for >50% utilization workloads. Use the Quartus PowerPlay thermal model to evaluate junction rise; do not exceed 100 C junction under any operating condition.
Common pitfalls when bringing up this part include: (1) leaving transceiver reference-clock pins floating - they require AC-coupling caps and a 100 MHz / 125 MHz / 156.25 MHz LVDS reference; (2) mis-assigning MSEL pins for the chosen configuration mode (FPP/AS/JTAG); (3) failing to instantiate the Altera PHY Interface (ALTLVDS) MegaWizard for LVDS channels, which can lead to timing violations; (4) over-driving 3.3 V into a 2.5 V VCCPD bank. Always re-validate pin assignments in Quartus Pin Planner and run TimeQuest timing closure before sign-off.
Compliance Information
RoHS compliance inferred from G suffix in MPN (per Altera/Intel ordering code convention). AEC-Q100 not applicable - FPGAs are not qualified to AEC-Q100. Halogen-free and conflict-minerals status not explicitly listed in the provided data.
