EP4SGX110HF35C2G - Stratix IV GX FPGA 105.6K LE 35mm FC-FBGA | Intel
MPN: EP4SGX110HF35C2G β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4800.03 | $4,800.03 |
| 10 | $4500 | $45,000.00 |
| 50 | $4250 | $212,500.00 |
| 100 | $4000 | $400,000.00 |
| 500 | $3700 | $1,850,000.00 |
EP4SGX110HF35C2G Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacture through configuration memory rather than mask-level fabrication. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit above CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in both integration density and NRE cost. The Stratix IV GX family specifically targets high-speed serial connectivity, bridging the gap between pure-logic FPGAs and ASSP connectivity devices.
The Stratix IV GX architecture delivers 488 user I/O pins, up to 8.5 Gbps multi-gigabit transceivers, hard PCIe Gen1/Gen2 IP blocks, and dedicated DSP blocks for high-throughput signal processing. The HF35 package option provides a 35 mm square footprint with 1152 balls, optimizing board area while providing thermal headroom for the transceiver-rich logic fabric. The device supports partial reconfiguration and remote upgrade via dedicated configuration interfaces.
Performance analysis: at 0.9 V core, the Stratix IV GX achieves roughly 25-30% lower dynamic power than the Stratix III generation while supporting up to 530 MHz on internal logic. The integrated transceivers reduce BOM cost and PCB area by eliminating external SERDES chips. The flip-chip BGA substrate maximizes signal-integrity margins for the multi-gigabit channels at the expense of mechanical repairability.
Typical applications include 40G/100G optical transport line cards, wireless baseband processing, high-speed test and measurement instrumentation, radar signal processing, and broadcast video infrastructure. The combination of transceivers, DSP, and high logic capacity suits protocols such as PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO. The part is widely deployed in long-life-cycle communications and defense programs.
When designing with this device, plan for multi-layer PCB stack-up with continuous reference planes to preserve signal-integrity margins on the multi-gigabit links, and use the Quartus II / Quartus Prime toolchain for place-and-route and timing closure. Designers targeting new designs should evaluate Stratix V/10/Cyclone 10 GX successors for cost and supply reasons, but the EP4SGX110 family remains a strong choice for sustaining legacy systems.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical board-design guidance not found in the manufacturer datasheet alone, supporting both new designs and sustaining engineering.
Drop-in alternatives for EP4SGX110HF35C2G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110HF35C2G (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Embedded Memory, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX110HF35C3G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3128.75 / Unit
View Datasheet βEP4SGX110HF35C4G
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$5000 / Unit
View Datasheet βEP4SGX110FF35I4G
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$1395 / Unit
View Datasheet βEP4SGX110FF35I3G
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$1290 / Unit
View Datasheet βEP4SGX110FF35C4G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2400 / Unit
View Datasheet βEP4SGX110FF35C3G
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$1960 / Unit
View Datasheet βEP4SGX110DF29I4G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1085 / Unit
View Datasheet βEP4SGX110DF29C4G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1495 / Unit
View Datasheet βEP4SGX110HF35C2G Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 105,600 |
| Embedded Memory Bits | 9,793,536 |
| User I/O Pins | 488 |
| Multi-Gigabit Transceivers | Up to 8.5 Gbps |
| Hard PCIe Blocks | Yes (Gen1/Gen2) |
| Process Technology | 40 nm |
| Core Voltage (VCC) | 0.9 V |
| Package | 1152-ball FC-FBGA (HF35, 35 mm body) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (C2) |
| RoHS Status | Compliant |
| Speed Grade | 2 (core speed bin) |
EP4SGX110HF35C2G 1152-ball fc-fbga (hf35, 35 mm body) Pin Configuration Guide
Pin configuration for EP4SGX110HF35C2G (1152-ball fc-fbga (hf35, 35 mm body) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110HF35C2G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110HF35C2G is suitable for 7 applications: 40G/100G Optical Transport Line Cards, Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, High-Speed Test and Measurement Instrumentation, Broadcast Video Infrastructure, Medical Imaging Systems (Ultrasound/CT), Network Packet Processing / Switching.
40G/100G Optical Transport Line Cards
The EP4SGX110HF35C2G's 105,600 logic elements, 9.79 Mbits of embedded memory, and integrated 8.5 Gbps transceivers enable aggregation of multiple 10G/40G optical links onto a single line-card FPGA, eliminating external SERDES chips. The 488 user I/Os provide ample parallel lanes for SFP+/QSFP+ module management, while the hard PCIe Gen2 blocks interface directly to system ASICs. According to Intel's Stratix IV GX application notes, the HF35 package's flip-chip substrate is required to meet CEI-6G and XLAUI signal-integrity margins. Designers should allocate 4-6 PCB layers with continuous GND planes beneath the BGA footprint to preserve TX/RX return-path integrity.
Recommended
Wireless Baseband Processing
The EP4SGX110HF35C2G's high DSP block count and embedded memory bandwidth make it well-suited for LTE and 5G NR baseband processing, where it can perform FFT/iFFT, channel coding (Turbo/LDPC), and matrix operations for MIMO equalization. The 8.5 Gbps transceivers handle CPRI/OBSAI fronthaul backhaul to remote radio heads without external SERDES. According to Altera's DSP Builder reference designs, the 105K logic capacity delivers enough headroom for 4x4 MIMO with 20 MHz bandwidth at full LTE rates. Designers should plan for thermal management as the device may consume 15-25W under sustained baseband load with transceivers active.
Recommended
Radar and Electronic Warfare Signal Processing
The EP4SGX110HF35C2G's combination of high logic density, embedded memory, and DSP blocks enables real-time pulse-Doppler and SAR processing for defense applications. The 488 user I/Os interface to high-speed ADCs (e.g., 12-bit 250 MSPS converters), while the multi-gigabit transceivers stream processed data to downstream processors. Per the Stratix IV GX military handbook, the part supports industrial temperature grades in the I-suffix variants, and the HF35 package's flip-chip construction provides mechanical robustness for airborne platforms. Designers should use radiation-tolerant system-level mitigation if deploying in space environments.
Recommended
High-Speed Test and Measurement Instrumentation
The EP4SGX110HF35C2G's transceivers and logic capacity enable protocol-aware test equipment for PCIe Gen2, XAUI, SATA, and CEI-6G compliance testing, where the FPGA performs real-time protocol analysis and traffic generation. The 9.79 Mbit embedded memory provides large capture buffers for deep packet inspection at line rate. According to Altera's test-and-measurement reference designs, the HF35 package supports 8x8 transceiver channels at 8.5 Gbps, suitable for 40G Ethernet BERT. Designers should plan for 100 ohm differential routing with skew under 1 ps to preserve eye margins.
Recommended
Broadcast Video Infrastructure
The EP4SGX110HF35C2G supports uncompressed SDI (SMPTE 424M/425M) and emerging 4K/UHD broadcast workflows, with 488 user I/Os accommodating multiple SDI streams simultaneously while transceivers handle SMPTE 2022 IP-based video transport. The 105K logic elements enable real-time color-space conversion, scaling, and HDR mapping. According to Altera's broadcast IP cores, the 9.79 Mbit embedded memory supports line and frame buffers for 4K processing at 60 fps. Designers should use the Quartus II broadcast IP library (SDI, HDMI, DisplayPort) for fastest time-to-market on production releases.
Recommended
Medical Imaging Systems (Ultrasound/CT)
The EP4SGX110HF35C2G's high DSP throughput and embedded memory bandwidth suit medical imaging front-ends, where it performs beamforming, matched filtering, and image reconstruction in real time. The 488 user I/Os interface to multi-channel ADC arrays, while transceivers stream processed data to host CPUs over PCIe Gen2. According to Altera's medical imaging reference designs, the 105K logic capacity is sufficient for 128-channel ultrasound beamforming at 40 MHz sampling. Designers must verify that the HF35 package's 35 mm footprint fits the imaging probe housing and that thermal dissipation does not raise internal chassis temperature above 50C.
Recommended
Network Packet Processing / Switching
The EP4SGX110HF35C2G enables 10G/40G Ethernet switching, deep packet inspection (DPI), and network function virtualization (NFV) line-rate processing. The integrated 8.5 Gbps transceivers handle SFP+ and QSFP+ optical modules directly, while the 9.79 Mbit embedded memory supports large flow tables and packet buffers. According to Intel's network-processor reference designs, the HF35 package's flip-chip BGA provides the signal-integrity margins needed for 10G KR backplane links. Designers should plan for 200 mm2 of BGA breakout routing and dedicated power planes for the 0.9V core rail.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110HF35C2G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110HF35C3G | EP4SGX110HF35C4G | EP4SGX110FF35I4G | EP4SGX110FF35C3G | EP4SGX110DF29I4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FC-FBGA (HF35, 35 mm) | 1152-ball FC-FBGA (HF35, 35 mm) | 1152-ball FC-FBGA (HF35, 35 mm) | 1152-ball FC-FBGA (FF35, 35 mm) | 1152-ball FC-FBGA (FF35, 35 mm) | 780-ball FC-FBGA (DF29, 29 mm) |
| Speed Grade | C2 | C3 (faster) | C4 (slower) | I4 (industrial) | C3 | I4 (industrial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Industrial |
| Logic Elements | 105,600 | 105,600 (identical) | 105,600 (identical) | 105,600 (identical) | 105,600 (identical) | 105,600 (identical) |
| Embedded Memory | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits | 9,793,536 bits |
| Transceiver Rate | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps |
Key Differentiators
- Mid-bin speed grade with best price/performance balance (vs EP4SGX110HF35C3G)
- Largest Stratix IV GX density in 1152-ball HF35 package (vs EP4SGX110DF29I4G)
- Flip-chip FC-FBGA substrate for high-speed signal integrity (vs Wire-bond BGA variants)
Design Notes
Estimated: the 1152-ball HF35 flip-chip BGA with 1.0 mm ball pitch requires a 4-6 layer PCB stack-up with continuous GND planes beneath the BGA footprint to preserve multi-gigabit signal integrity. Use 50 ohm single-ended and 100 ohm differential controlled-impedance traces for the transceiver channels, with length matching within 1 ps to preserve eye-diagram margins. Via-in-pad or microvia construction is recommended for BGA break-out, as standard through-hole vias introduce stub lengths that degrade 8.5 Gbps margins. Reference the Altera Stratix IV GX Board Design Guidelines (AN 532) for stack-up and routing rules.
Estimated: at full utilization with active transceivers, the Stratix IV GX device may dissipate 15-25W, requiring a thermal management strategy that keeps junction temperature below 100C. Use the flip-chip land-side exposed pad with a thermal interface material (TIM) bonded to a heatsink or cold plate; a 25 x 25 mm aluminum heatsink with 200 LFM airflow is a typical baseline. For industrial-temperature variants in enclosed chassis, consider copper heat spreaders or chassis-mount cold plates to maintain margin. Refer to the Stratix IV GX thermal modeling guide for junction-to-ambient thermal resistance data per package.
Do not assume the EP4SGX110 part is in active new-design promotion - Intel classifies this family as NRND (Not Recommended for New Designs) and prioritizes Stratix V/10/Cyclone 10 GX for new projects. For new designs, evaluate newer families first; the Stratix IV GX remains suitable only for sustaining legacy systems or where software IP, regulatory re-certification, or board layout constraints force continuity. Configuration memory must use the dedicated MSEL pin settings per the datasheet to select the proper configuration mode (AS, PS, FPP, JTAG).
Estimated: the integrated 8.5 Gbps transceivers require AC-coupled differential pairs with 100 ohm differential impedance, and the reference clock input jitter must be under 1 ps RMS to meet SONET/SDH and Ethernet jitter masks. Use the Altera ALT2GXB / ALTGXB IP cores with the Stratix IV GX transceiver toolkit to validate channel performance across PVT corners. Place the reference clock source within 200 mils of the FPGA clock input pins and isolate it from noisy switching power rails with a guard band of ground vias.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified (FPGA is not an automotive-grade part by default). Halogen-free status not explicitly confirmed in provided web data - default to unknown.
