EP4SGX360KF40C3N - 353600-Cell Stratix IV GX FPGA | Intel
MPN: EP4SGX360KF40C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP4SGX360KF40C3N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the factory. Within the broader semiconductor hierarchy, an FPGA belongs to programmable logic devices, which sit alongside ASICs and CPLDs; the Stratix IV GX family targets high-end applications requiring both massive parallelism and multi-gigabit serial transceivers.
Key features include 19.7 Mbits of embedded memory, 1,040 embedded 18x18 multipliers (DSP blocks), and PCI Express hard IP blocks, all interconnected by a multi-track routing fabric. The part's 8.5 Gbps transceivers support protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI, while the 744 general-purpose I/Os are split across 16 banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards with on-chip termination.
Architecturally, the device combines logic array blocks, memory blocks, DSP blocks, and transceivers under a hierarchical routing network that the Quartus II design tool maps, places, and routes from VHDL/Verilog sources. The 40nm low-power process reduces dynamic power relative to the prior 65nm Stratix III generation, and 0.9V core operation lowers static current draw.
Typical applications include high-performance telecom line cards with multi-gigabit serial links, military radar and signal-processing backplanes, medical imaging systems, ASIC prototyping, and high-speed test instrumentation. The 1517-ball FC-FBGA package requires controlled-impedance PCB layout with matched-length traces to preserve signal integrity at multi-gigabit rates.
When designing with this device, provide a minimum of four PCB layers with continuous power planes, follow Intel's pin connection guidelines for unused transceiver channels, and use Quartus II's PowerPlay analyzer to estimate dynamic power under worst-case toggle rates. The FC-FBGA's 1.0 mm ball pitch demands precise reflow profiling and via-in-pad construction.
Drop-in alternatives for EP4SGX360KF40C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360KF40C3N (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Transceivers, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX360KF40C3
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View Datasheet βEP4SGX360KF40C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 |
| Logic Array Blocks (LABs) | 14,144 |
| Number of I/Os | 744 |
| Embedded Memory | 19.7 Mbits |
| DSP Blocks (18x18 Multipliers) | 1,040 |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 8.5 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm CMOS |
| Package | 1517-ball FC-FBGA (KF40) |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C3 |
| Lead Free / RoHS | Yes / Compliant |
EP4SGX360KF40C3N 1517-ball fc-fbga (kf40) Pin Configuration Guide
Pin configuration for EP4SGX360KF40C3N (1517-ball fc-fbga (kf40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360KF40C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360KF40C3N is suitable for 7 applications: High-Performance Telecom Line Cards, Military Radar and Signal-Processing Backplanes, ASIC Prototyping, Medical Imaging Systems, High-Speed Test and Measurement Instrumentation, Broadcast Video Processing and Switching, Industrial Automation and Control.
High-Performance Telecom Line Cards
The EP4SGX360KF40C3N fits telecom line cards because its 24 transceivers at 8.5 Gbps each deliver 192 Gbps of raw serial bandwidth per device, enough for multi-protocol aggregation across OTU2, 10GbE, and CPRI links. The 353,600 logic elements absorb packet classification, traffic management, and SERDES-side protocol adaptation without external ASSPs. Designers typically place the FPGA between framer/MAC ASICs and the backplane, paired with 10GbE SFP+ cages and external DDR3 buffers. Quartus II's hard PCIe Gen2 IP block enables direct CPU or DSP coprocessor connection on the host side.
Recommended
Military Radar and Signal-Processing Backplanes
The EP4SGX360KF40C3N suits radar and electronic-warfare backplanes because its 1,040 18x18 DSP multipliers deliver up to 215 GMACs of multiply-accumulate throughput at the device's operating frequency, enough for real-time FFT, beamforming, and pulse-Doppler processing. The 19.7 Mbits of embedded memory holds FFT windows and beam weights with deterministic access. Military programs frequently pin this Stratix IV GX device because its 40nm 0.9V core offers a known-good balance of performance and reliability, with extended-temperature variants available in the same family. The 744 user I/Os interface directly to LVDS ADCs and DACs.
Recommended
ASIC Prototyping
The EP4SGX360KF40C3N is well-suited as an ASIC prototyping vehicle because its 353,600 logic elements partition cleanly into multi-million-gate ASIC designs with Quartus II's incremental compile and LogicLock regions. The 24 transceivers at 8.5 Gbps emulate serializer-deserializer macros found in most modern ASICs, and the 1.7 Gbps LVDS I/Os handle DDR memory interface validation. Prototyping teams typically use multiple FPGAs of this density to validate SoC designs before tape-out. The 1517-ball FC-FBGA provides the routing density needed for the multi-FPGA partition.
Recommended
Medical Imaging Systems
The EP4SGX360KF40C3N fits high-end medical imaging (CT, MRI, ultrasound beamforming) because its 1,040 DSP blocks execute parallel image-reconstruction kernels in real time, and the 19.7 Mbits of embedded memory holds line buffers for back-projection and beamformed sample storage. The 8.5 Gbps transceivers interface directly to high-speed LVDS ADCs and to host processors via PCIe Gen2. The 40nm process offers the long-life-cycle stability that medical OEMs require. Designers use this FPGA in front-end acquisition boards where deterministic latency and parallel DSP throughput dominate the design.
Recommended
High-Speed Test and Measurement Instrumentation
The EP4SGX360KF40C3N fits high-end oscilloscopes, BERTs, and protocol analyzers because its 24 transceivers at 8.5 Gbps handle multi-lane compliance testing (PCIe Gen2, USB 3.0, SATA, XAUI) in a single device, while its 1,040 DSP blocks execute real-time eye-diagram, jitter, and equalization analysis. The 19.7 Mbits of embedded memory captures deep trace buffers, and the 744 user I/Os drive display backplanes and front-panel controls. Test-equipment vendors appreciate the deterministic LVDS I/O timing for TDC and time-interleaved ADC interfaces.
Recommended
Broadcast Video Processing and Switching
The EP4SGX360KF40C3N fits broadcast routers, video format converters, and 3G/HD-SDI processing cards because its 24 transceivers at 8.5 Gbps handle uncompressed SDI (SMPTE 424M/425M) and HDMI/DisplayPort interfaces with on-chip clock-data recovery. The 353,600 logic elements execute color-space conversion, scaling, and frame-rate conversion in real time across multiple channels. The 1,040 DSP blocks accelerate deinterlacing and noise reduction. The FC-FBGA package provides the thermal performance required for continuously-running broadcast equipment.
Recommended
Industrial Automation and Control
The EP4SGX360KF40C3N fits high-end industrial automation (motion control, machine vision, robotic controllers) because its 1,040 DSP blocks execute real-time motor-control algorithms, its 24 transceivers aggregate multi-axis EtherCAT, SERCOS III, or Profinet traffic, and its 744 user I/Os drive high-resolution encoder inputs and PWM outputs directly. The 40nm 0.9V core provides the long-term product lifecycle that industrial OEMs require. The FC-FBGA package is well-suited for fan-less industrial chassis when paired with thermal vias and a heatsink.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360KF40C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360KF40C3 | EP4SGX360KF40C2N | EP4SGX360KF40C2 | EP4SGX360HF35C3N | EP4SGX360HF35C2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) | 1152-ball FC-FBGA (HF35) | 1152-ball FC-FBGA (HF35) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| ALMs / LABs | 141,440 / 14,144 | 141,440 / 14,144 | 141,440 / 14,144 | 141,440 / 14,144 | 141,440 / 14,144 | 141,440 / 14,144 |
| Transceivers / Max Data Rate | 24 / 8.5 Gbps | 24 / 8.5 Gbps | 24 / 8.5 Gbps | 24 / 8.5 Gbps | 24 / 8.5 Gbps | 24 / 8.5 Gbps |
| Speed Grade | C3 | C3 | C2 (faster) | C2 (faster) | C3 | C2 (faster) |
| Embedded Memory | 19.7 Mbits | 19.7 Mbits | 19.7 Mbits | 19.7 Mbits | 19.7 Mbits | 19.7 Mbits |
| DSP Blocks (18x18) | 1,040 | 1,040 | 1,040 | 1,040 | 1,040 | 1,040 |
| User I/Os | 744 | 744 | 744 | 744 | 560 (approx) | 560 (approx) |
Key Differentiators
- High-density 40nm Stratix IV GX with 24 transceivers (vs EP4SGX230KF40C2N (lower-density sibling))
- Mid-range C3 speed grade offers better yield at lower cost (vs EP4SGX360KF40C2N (faster C2 speed grade))
- 1517-ball FC-FBGA KF40 package offers highest I/O count in the family (vs EP4SGX360HF35C3N (1152-ball HF35 package))
Design Notes
The 1517-ball FC-FBGA KF40 package uses 1.0 mm ball pitch and requires via-in-pad construction with plugged or capped-and-plated vias to prevent solder wicking. The PCB stackup must provide at least 4-6 layers with continuous VCC and GND planes directly under the device. Matched-length differential pairs (within 5 mils) are mandatory for the transceiver channels; reference Intel's Stratix IV GX transceiver layout guidelines for trace-width and via-stub recommendations.
Estimated: total power consumption for the EP4SGX360KF40C3N at 100% transceiver utilization and 80% logic toggle rate can exceed 25W. The 0.9V core rail can draw 15A+ at full utilization, requiring low-impedance power planes and 0402 decoupling capacitors at every power pin pair. Use Quartus II PowerPlay to estimate core, transceiver, and I/O power budgets separately, and budget for 30% margin in the regulator selection. VCCPD, VCCA, and VCCR/CCT require separate filtered rails per the device handbook.
Do not leave unused transceiver channels floating; per the Stratix IV handbook, tie unused TX/RX pairs to analog supply or power-down in the Quartus configuration to prevent excess current draw. Configuration pins MSEL[2:0] must be set correctly for the chosen configuration scheme (AS, PS, JTAG, or FPP); misconfiguration prevents boot. JTAG chain integrity should be verified on the bench with the Quartus II Programmer before final layout, because 1517-ball packages make post-layout rework costly.
Estimated: with 25W dissipation and the KF40 FC-FBGA thermal resistance of approximately 1.2 C/W (junction-to-case) plus 5 C/W junction-to-ambient in still air, a 25W load can drive junction temperature above 125C. A heatsink with thermal interface material, plus forced airflow of at least 200 LFM, is recommended for production deployment. For sealed enclosures, run PowerPlay thermal models and consider thermal shutdown or derating the clock frequency when temperature approaches limits.
Compliance Information
RoHS-compliant per Altera/Intel product page. N suffix indicates lead-free terminal finish. Not AEC-Q100 qualified (commercial temperature grade only).
