EP4SGX360KF43C3N - 353,600-Cell FPGA | Intel | DSP
MPN: EP4SGX360KF43C3N β Active| Qty | Unit Price | Extended |
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EP4SGX360KF43C3N Overview
A field-programmable gate array is a semiconductor device containing configurable logic blocks, programmable interconnects, memory resources, and specialized processing elements. An FPGA sits below application-specific integrated circuits and above fixed-function digital ICs in the programmable-device hierarchy because it can be configured after manufacturing. This makes it useful for implementing parallel algorithms, interface bridging, packet processing, and signal-processing pipelines while allowing design changes without a new silicon spin.
Verified data identifies 23,105,536 memory bits, 353,600 logic cells, 141,440 CLBs, and 880 I/O pins. The 1760-ball package provides the physical interface for the device, while the programmable fabric can be adapted to different algorithms and protocols. The available source data also describes high-speed DSP blocks configurable for 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers operating at up to 600 MHz.
Architecturally, the device combines programmable logic with embedded memory and dedicated DSP capability. This combination is valuable when a design needs both dense control logic and repeatable arithmetic operations. The large memory capacity supports FIFOs, buffers, and true dual-port memory structures, while the multiplier configurations support filters, transforms, and other parallel numeric operations. The distributor data also lists a 717 MHz figure, but the exact meaning of that figure should be confirmed from the manufacturer datasheet before it is used as a system-level performance limit.
Typical applications include communications infrastructure, radar and sensor processing, industrial imaging, test and measurement, and high-performance DSP systems. The device can implement parallel datapaths, protocol conversion, video or image preprocessing, and real-time control functions. Because the FPGA is programmable, design teams can modify functionality through configuration and intellectual-property changes rather than changing the component footprint.
A key design consideration is the high pin count and complexity of the 1760-ball package. PCB layout, power integrity, signal integrity, thermal management, configuration, and timing closure must be planned before fabrication. The user should obtain the official manufacturer documentation and verify package dimensions, speed-grade details, supply requirements, and pin assignments before release to production. This page combines the verified distributor specifications, available source links, and a conservative replacement analysis; values not present in the supplied evidence are marked for confirmation rather than inferred.
Drop-in alternatives for EP4SGX360KF43C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360KF43C3N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Embedded Memory, Operating Temperature Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX360KF43C3
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View Datasheet βEP4SGX360KF43C2
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View Datasheet βEP4SGX360KF43C3N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix IV GX |
| Logic Cells | 353600 |
| Configurable Logic Blocks | 141440 CLBs |
| User I/O | 880 I/O |
| Embedded Memory | 23105536 bits |
| DSP Multiplier Configurations | 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit |
| Maximum DSP Multiplier Frequency | 600 MHz |
| Additional Distributor Frequency Figure | 717 MHz |
| Process Technology | CMOS |
| Package | 1760-ball FCBGA/BGA |
| Terminal Form | Ball |
| Number of Terminals | 1760 |
| Package Shape | Square |
| Package Code | BGA |
| Grading of Temperature | Other |
| Lead-Free | Lead free |
EP4SGX360KF43C3N bga Pin Configuration Guide
Pin configuration for EP4SGX360KF43C3N (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360KF43C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360KF43C3N is suitable for 6 applications: Communications Infrastructure, High-Performance DSP Systems, Industrial Imaging and Vision, Radar and Sensor Processing, Test and Measurement Equipment, High-Speed Data Acquisition.
Communications Infrastructure
EP4SGX360KF43C3N fits communications infrastructure requiring dense programmable logic, substantial embedded memory, and parallel data-path processing. The verified 353,600 logic cells and 23,105,536 memory bits support protocol adaptation, packet buffering, and multi-channel datapaths. Its 880 I/O resources can connect high-speed external interfaces when the board implementation meets the required timing and signal-integrity constraints. Dedicated DSP blocks support 9 x 9-bit through 36 x 36-bit full-precision multipliers at up to 600 MHz, making the device useful for filtering and channel-processing functions. The large 1760-ball FCBGA/BGA package provides extensive physical connectivity but requires careful escape routing, controlled impedance, and a qualified assembly process.
Recommended
High-Performance DSP Systems
EP4SGX360KF43C3N is well matched to DSP systems that need parallel arithmetic and configurable datapaths. The supplied documentation evidence reports 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multiplier configurations, with operation at up to 600 MHz. Combined with 353,600 logic cells and 23,105,536 memory bits, the FPGA can implement filters, transforms, beamforming, or sensor-fusion pipelines. The programmable fabric allows designers to trade precision, pipeline depth, and resource usage after implementation. Actual throughput is not determined by the headline resource count alone; timing closure, clocking, routing congestion, and thermal conditions must be evaluated in the target design.
Recommended
Industrial Imaging and Vision
EP4SGX360KF43C3N can support industrial imaging designs that require simultaneous acquisition, buffering, and real-time processing. Its 23,105,536 memory bits provide capacity for frame buffers, FIFOs, and intermediate arrays, while 353,600 logic cells support image preprocessing, format conversion, and control logic. The reported 9 x 9-bit to 36 x 36-bit DSP configurations can accelerate filtering and pixel arithmetic. The 880 I/O count offers flexibility for connecting image sensors, memories, converters, and high-speed links. Designers should plan memory bandwidth, clock domains, and external memory interfaces carefully, because a large FPGA does not remove the board-level limits imposed by the 1760-ball package, power distribution, and signal integrity.
Recommended
Radar and Sensor Processing
EP4SGX360KF43C3N is suitable for radar and sensor-processing platforms that combine high logic density with parallel DSP and memory resources. The verified 23,105,536 memory bits support sample buffers, delay lines, and multi-channel intermediate storage. The 353,600 logic cells can host control, filtering, detection, and interface logic, while the reported DSP multipliers support high-throughput numeric operations. The 880 I/O resources help interface converters, network devices, and timing or synchronization circuits. System performance depends on implementation quality, clock architecture, memory bandwidth, and thermal design. A 1760-ball FCBGA/BGA device also requires early collaboration with the PCB and assembly teams to control routing congestion, power delivery, and solder-joint reliability.
Recommended
Test and Measurement Equipment
EP4SGX360KF43C3N can serve in test and measurement equipment that requires deterministic parallel processing, custom interfaces, and reconfigurable measurement pipelines. The 353,600 logic cells and 23,105,536 memory bits allow designers to combine acquisition control, waveform analysis, buffering, and data formatting in one programmable device. The 880 I/O connections provide flexibility for connecting converters, clocks, memories, and communication interfaces. The reported DSP multiplier configurations, including 36 x 36-bit full-precision multipliers, support numerical processing at up to 600 MHz as reported in the supplied source. For production use, verify measurement bandwidth, timing margin, calibration strategy, thermal behavior, and configuration reliability from the official documentation.
Recommended
High-Speed Data Acquisition
EP4SGX360KF43C3N fits high-speed data-acquisition systems where large FPGA resources can manage parallel converters, buffering, and real-time processing. The verified 880 I/O count and 1760-ball package support designs with many external connections, while 23,105,536 memory bits can hold captured data, FIFOs, and processing windows. The 353,600 logic cells can implement protocol handling, triggering, filtering, and data reduction. DSP blocks can accelerate arithmetic operations using the supplied 9 x 9-bit to 36 x 36-bit multiplier configurations. Success depends on the complete signal chain: converter interface design, clock distribution, power integrity, PCB stack-up, grounding, and thermal management all affect the achievable acquisition rate.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360KF43C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360KF43C3 | EP4SGX360KF43C2N | EP4SGX360KF43C2 | EP4SGX360KF40I3N | EP4SGX360KF40C3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-ball FCBGA/BGA | 1760-ball FCBGA/BGA | 1760-ball FCBGA/BGA | 1760-ball FCBGA/BGA | 1760-ball FCBGA/BGA | 1760-ball FCBGA/BGA |
Key Differentiators
- Large verified logic capacity (vs EP4SGX360KF40I3N)
- High embedded-memory capacity (vs EP4SGX360KF40C3N)
- Substantial programmable I/O capacity (vs EP4SGX360KF43C2N)
- Dedicated DSP functionality (vs EP4SGX360KF43C2)
- High-density 1760-ball package (vs EP4SGX360KF40I3N)
Design Notes
Treat the 1760-ball FPGA as a high-density power and thermal design. The supplied data does not provide a verified junction-to-ambient thermal-resistance value or device power figure, so thermal estimates require a complete power analysis and board measurements. Calculate core, I/O, transceiver, memory, and clock power separately, then include the FPGA configuration and operating activity. Provide multiple low-impedance power planes, local decoupling, and thermal vias beneath the package according to the official land pattern and reference design. Confirm airflow and case temperature before relying on the device in a continuously high-utilization design.
The 1760-ball FCBGA/BGA package requires an early PCB stack-up decision and package-specific escape strategy. The supplied evidence establishes 1760 terminals but does not provide a complete ball map or package drawing. Before schematic capture, obtain the official package outline, land pattern, pinout, and recommended via arrangement. Maintain the documented solder-mask-defined or non-solder-mask-defined process consistently, control impedance for high-speed traces, and keep sensitive clock and differential pairs away from noisy power regions. Use the manufacturer reference design as the starting point and validate the final assembly with the intended contract manufacturer.
Use a staged power-up and power-down strategy for the FPGA and its supporting components. The verified web data does not include supply voltages, current limits, power sequencing, or tolerance values, so those values must be taken from the manufacturer datasheet and reference designs rather than inferred from the MPN. Place the required input and bypass capacitors at the shortest possible connection points, provide local bulk capacitance, and verify the selected regulator transient response. Sequence shared configuration, memory, and interface rails so that inputs do not receive invalid levels while the FPGA is unpowered or resetting.
Plan high-speed I/O, clocks, and DSP data paths as transmission lines from the beginning of the design. The supplied data reports 880 I/O and a high-density package but does not establish the supported I/O rates or termination scheme for the target design. Use the official I/O-bank constraints, reference-clock topology, differential-pair rules, and termination recommendations. Confirm the 717 MHz distributor figure before treating it as an I/O or internal-clock limit. After the first layout, review return paths, via stubs, crosstalk, skew, and simultaneous-switching noise using the target stack-up and the actual configured pin assignments.
Do not select a replacement from the EP4SGX360 family using the shortened ordering suffix alone. Similar logic-cell counts, package descriptions, or family names do not prove pin-to-pin compatibility. The target and candidate must be checked against the complete MPN, package drawing, ball map, speed grade, temperature grade, voltage requirements, configuration interface, and timing constraints. The supplied alternative list contains only 5 candidates and the cross-reference results do not verify their detailed electrical differences, so treat the compatibility conclusion as provisional until the manufacturer documentation and distributor technical support confirm it.
Compliance Information
The supplied Ampheo result explicitly describes the part as lead free. RoHS, REACH, halogen-free, AEC-Q100, and conflict-minerals statuses were not established by the supplied evidence, so they remain unknown.
