EP4SGX360KF43C4N - Stratix IV GX FPGA, 353K LE, 1760-FCBGA | Intel
MPN: EP4SGX360KF43C4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1490 | $745,000.00 |
| 1,000 | $1370 | $1,370,000.00 |
EP4SGX360KF43C4N Overview
A Stratix IV GX FPGA is a high-performance programmable logic device that combines fine-grained lookup tables (LUTs), embedded memory blocks (M9K/M144K), DSP blocks, and high-speed serial transceivers in a single silicon die. Stratix IV devices sit in the upper tier of the FPGA hierarchy: FPGA > programmable logic > programmable logic device > semiconductor. They are typically used in networking, signal processing, and ASIC prototyping designs where deterministic hardware parallelism is required.
Key features include integrated 8.5 Gbps transceivers (depending on variant), hard PCIe Gen1/Gen2 IP cores, up to 24 DSP blocks for high-throughput signal processing, and a rich clock network supporting multiple PLLs. The KF43 package designation (1760-ball FCBGA) enables the high I/O count needed for memory-rich and transceiver-rich designs, while maintaining signal integrity at multi-Gbps data rates.
Architecturally, Stratix IV uses an Adaptive Logic Module (ALM) of 8 inputs, allowing efficient packing of arbitrary logic. The embedded transceivers use dedicated clock-data recovery and serializer/deserializer blocks, freeing user fabric for application logic. On-chip memory can be configured as RAM, ROM, or FIFO, with true dual-port support on M9K blocks.
Typical applications include high-speed serial interface bridging (PCIe, SATA, XAUI), wireless baseband DSP, software-defined radio, ASIC prototyping, and high-throughput network packet processing. The combination of dense logic, embedded transceivers, and abundant DSP makes the EP4SGX360KF43C4N well-suited to designs that exceed the capacity of Cyclone IV or Cyclone V families.
When designing with this device, plan the power budget carefully: at full utilization the core can draw tens of amps at 0.9 V, requiring a multi‑phase VRM and substantial decoupling. Use Altera/Intel Quartus II design software (the last version with Stratix IV support) and follow AN 571 guidelines for transceiver PCB layout to maintain signal integrity at 8.5 Gbps.
This page synthesizes distributor pricing, same-package drop-in alternatives (KF40, FF35, FH29 pin-compatible variants from the Site MPN list), and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP4SGX360KF43C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360KF43C4N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature Grade, Process Technology, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360KF43C3N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP4SGX360KF43C3
✅ Drop-In✓ In Stock
$8905.55 / Unit
View Datasheet →EP4SGX360KF43C2N
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$1975 / Unit
View Datasheet →EP4SGX360KF43C2
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$8803.34 / Unit
View Datasheet →EP4SGX360KF43C4
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$7268.19 / Unit
View Datasheet →EP4SGX360KF43C4N Maximum Ratings & Electrical Characteristics
| Device Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Logic Cells | 141,440 |
| Logic Array Blocks (LABs) | 14,440 |
| Embedded Memory | 23,105,536 bits (approximately 23.1 Mbit) |
| User I/Os | 880 |
| Package | 1760-ball FCBGA (KF43) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 4 (fastest) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Device Type | FPGA - Field Programmable Gate Array |
| Lead Free | Yes |
EP4SGX360KF43C4N 1760-ball fcbga (kf43) Pin Configuration Guide
Pin configuration for EP4SGX360KF43C4N (1760-ball fcbga (kf43) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360KF43C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360KF43C4N is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed Serial Interface Bridging, Wireless Baseband DSP Processing, Software Defined Radio (SDR), High-Throughput Network Packet Processing, Industrial Test and Measurement Equipment.
ASIC Prototyping and Emulation
The EP4SGX360KF43C4N's 353,600 logic elements and 23.1 Mbit embedded memory make it well-suited for ASIC prototyping where multiple logic regions must operate at near-ASIC clock rates. With 14,440 LABs and 880 user I/Os, the KF43 package supports dense partition mapping of million-gate ASICs into single-FPGA or multi-FPGA emulation cages. Designers use Quartus II partition logic and TimeQuest timing analysis to converge on prototype timing before ASIC tape-out.
Recommended
High-Speed Serial Interface Bridging
The Stratix IV GX integrated transceivers support data rates up to 8.5 Gbps, enabling PCIe Gen1/Gen2, SATA 3.0, XAUI, and HiGig protocol bridging in telecom and storage systems. The KF43 1760-ball FCBGA provides sufficient package escape for the high-speed serial channels plus parallel control logic on 880 user I/Os. Reference designs in the Stratix IV Handbook demonstrate PCIe Gen2 x8 endpoints achieving 4 GB/s throughput.
Recommended
Wireless Baseband DSP Processing
The EP4SGX360KF43C4N integrates up to 24 DSP blocks (each supporting 18x18 multiplication) with up to 8.5 Gbps transceivers, making it ideal for wireless baseband signal processing. LTE and WiMAX base stations require simultaneous FFT/iFFT computation, channel estimation, and RF data conversion at hundreds of MSPS. Designers use Altera's DSP Builder to map MATLAB/Simulink algorithms directly to FPGA fabric for deterministic low-latency processing.
Recommended
Software Defined Radio (SDR)
The combination of high logic density, abundant embedded memory, and integrated transceivers positions the EP4SGX360KF43C4N as an SDR platform for waveform processing between ADC/DAC and host processor. KF43 package variants are commonly used in tactical and laboratory SDR designs covering HF through C-band frequencies. The 880 user I/Os interface directly to high-speed ADC/DAC converters such as TI ADC08D1520 without external multiplexing.
Recommended
High-Throughput Network Packet Processing
Carrier-grade routers and switches require multi-gigabit packet classification, deep packet inspection, and traffic management at line rate. The EP4SGX360KF43C4N's 353K logic elements handle millions of TCAM-equivalent lookups per second while its integrated transceivers interface to 10 GbE and 40 GbE Ethernet PHYs. Industrial designers use this FPGA for 100G line card prototyping where Stratix IV GX transceivers simplify backplane SERDES integration.
Recommended
Industrial Test and Measurement Equipment
Test equipment manufacturers leverage the EP4SGX360KF43C4N for high-channel-count logic analyzers, protocol exercisers, and arbitrary waveform generators. The 880 user I/Os combined with 8.5 Gbps transceivers enable multi-lane PCIe and USB 3.0 test fixtures. The KF43 1760-ball BGA's thermal envelope supports sustained operation in rack-mounted instrumentation without active cooling.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360KF43C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360KF43C3N | EP4SGX360KF43C2N | EP4SGX360KF43C4 | EP4SGX360KF43C3 |
|---|---|---|---|---|---|
| Package | 1760-ball FCBGA (KF43) | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Speed Grade | 4 (fastest) | 3 | 2 | 4 | 3 |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) |
| User I/Os | 880 | 880 | 880 | 880 | 880 |
| RoHS Compliant | Yes | Yes | Yes | No (lead-free option suffix differs) | No |
| Approximate 1-Unit Price (USD) | 1850 | 1650 | 1480 | 1820 | 1620 |
Key Differentiators
- Highest logic density in Stratix IV GX family at 353,600 logic elements (vs EP4SGX230KF40I4N)
- Maximum user I/O count (880 I/Os) in 1760-ball FCBGA KF43 package (vs EP4SGX360KF40C4N)
- Integrated 8.5 Gbps transceivers with hard PCIe Gen1/Gen2 IP cores (vs EP4CGX75DF27I7N)
Design Notes
Estimated: At full utilization the Stratix IV GX core can draw 15-25 A at 0.9 V from a multi-phase VRM. The EP4SGX360KF43C4N requires at least 8 PCB power planes and bulk decoupling within 1 inch of each BGA quadrant. Use the Quartus II PowerPlay early power estimator before PCB layout to size the VRM and current-shunt traces. A minimum of 24 x 47 uF X5R ceramic capacitors are recommended around the device periphery plus 4 x 220 uF polymer bulk capacitors at the VRM output. Without adequate decoupling, transients during transceiver lane switching can corrupt the core voltage and cause CRC errors in configuration memory.
Estimated: With a junction-to-ambient thermal resistance of approximately 4-6 C/W for the KF43 1760-ball FCBGA package (per Intel Stratix IV handbook values), full-utilization designs at 0.9 V/25 A core draw (~22 W) require a heatsink plus 200 LFM airflow to stay below 95 C junction. Without forced airflow, junction temperature can exceed 110 C, triggering thermal protection and partial reconfiguration. Designers should add a thermal via array (0.3 mm pitch) under the BGA to the bottom thermal pad for maximum heat extraction.
For 8.5 Gbps transceiver operation, the KF43 PCB stackup must use low-loss dielectric (Df < 0.005 at 4 GHz, e.g., Rogers 4350B or Megtron-6) with controlled impedance for both differential traces (100 ohm +/- 5%) and single-ended (50 ohm +/- 10%). Transceiver signals should be routed with matched lengths within +/- 0.5 mm and AC-coupling capacitors placed within 4 mm of the BGA escape. Per Intel AN 571, keep transceiver traces on the top microstrip layer and avoid crossing power plane splits. Verify signal integrity with a 3D EM simulator such as HFSS or Keysight ADS before tape-out.
Do not enable JTAG-driven configuration with the wrong VID setting - the Stratix IV VCCPD pin (3.0 V) must match before VCCINT (0.9 V) ramps, or the POR (power-on reset) will mis-order and the configuration memory may become corrupted. Use the dedicated nCONFIG/nSTATUS pins and ensure all configuration modes (AS, PS, JTAG) have stable reference clock inputs. When migrating from the EP4SGX360KF43C3N to C4N, recompile the Quartus II design with the new device speed grade selected - leaving the old settings causes timing analysis failures during hardware bring-up.
Compliance Information
RoHS compliance confirmed per IC chip and ic-online distributor listings. AEC-Q100 is not applicable for commercial-grade FPGAs. Halogen-free status not specified in available data.
